HK1007705B

HK1007705B - Process and device for manufacturing plastic mouldings having wall regions of reduced thickness

Info

Publication number: HK1007705B
Application number: HK98106916.1A
Authority: HK
Inventors: Barak Renee-Lucia; Haghiri-Tehrani Yahya; Baader Helmut
Original assignee: Gao Gesellschaft Fur Automation Und Organisation Mbh
Priority date: 1991-05-10
Filing date: 1998-06-26
Publication date: 1999-04-23

Description

The invention relates to a process and device for the manufacture of chip cards and chip card raw materials with partially reduced wall thickness by injecting a molten plastic material into a mold chamber and then cooling the plastic material.

The card with a plastic card body has long been known. For example, FR-A 2 579 799 contains a chip card with a PVC card body containing a multi-stage sink for the chip module. The module is pressed into the hollow with the chips under heat. During the pressing process, the chips, which are softened and compressed to a predetermined size, act as spacing elements so that a liquid adhesive with a defined layer of adhesive can be applied between the module and the card afterwards.

However, from EP 0 277 854 A1 and EP 0 267 826 A1 injection moulding techniques are known for chip cards or chip card grooves which have a membrane area or a recess to accommodate the chip module.

In the method for producing the card described in EP 0 277 854 A1, the module is already in the mould during the injection process and is held there by suction air. A spring-loaded plate in the mould cavity, which presses the module against the top mould, ensures additional positioning and fixation of the module before injection moulding. The plastic is injected through a side edge of the mould, the plate decreasing to card thickness due to the resulting pressure.

The method allows the manufacture of a chip board in one operation. Since the module is in the molding space during the injection process, it acts as a stamp protruding into the mold. Due to the lateral injection of the material, the plastic flow in front of the module or in front of a stamp splits into two streams, which surround the obstacle and reunite behind it.

EP 0 267 826 A1 describes a method for the production of chip card raw materials by injection moulding. The mould used is made of planar parallel plates which are movable against each other. In one of the plates the injection channel is provided. Opposite the injection channel is a stamp protruding into the mould and equipped with cooling channels, which forms the outer surface for later inclusion in the chip module in the card. The stamp has indentations on its front surface to produce nozzles in the bottom of the module moulding. When the module is inserted into the moulding, it is placed on the nozzles so that the gap between the chip module and the chip module floor can be filled with an adhesive to fix the module.

The method presented in EP 0 267 826 A1 eliminates the disadvantages of the method described in EP 0 277 254 A1 by the position of the injection channel. In particular, no preferential breaking points are created and complex sharp contours (nobs) can be formed in the area of the stamp face. However, due to the position of the injection channel, the injection pin necessarily lies in the area of the membrane on the back of the card raw material, which affects the optical appearance of the finished card. More importantly, the plastic material is first injected into the area with reduced wall strength, so that there is a significant loss of pressure in the remaining areas. The reason for this is the incomplete form of the plastic filling of the cartridge.

In conclusion, both methods allow the production of low-cost chipsets or chipset raw materials, but with a loss of quality.

The purpose of the invention is to create a process and device of the type mentioned at the outset which allows the economic production of chip cards and chip card raw materials with significantly reduced wall thickness in some areas without the limitations described.

According to the invention, this task is solved by the characteristics of the claims in the next order.

Although the manufacture of injection moulds in which the insertion of a movable stamp results in savings is generally known from DE-A 34 01 644, DE-A 34 01 644 does not address the specific steps necessary to manufacture a chip card.

The method of the invention involves first injecting the plastic material into a starting mold which is essentially the same configuration as the card body without any gaps. Since no cross-sectional narrowing obstructs the flow path in this initial state of the mold, there are no problems with filling the mold with the plastic material.

The method of the invention also provides that at a certain point the spacing of certain wall areas of the original mould space corresponding to the wall thickness reduction area (s) is reduced so that the plastic material is displaced at these areas to a residual wall thickness which may be several times smaller than the wall thickness at adjacent areas.

Although the reduction of the spacing of the specific wall areas of the mould space is usually not started until the original mould space has been substantially filled, this step can also be done at a time when the plastic material has filled the space between the specific wall areas but not the entire original mould space.

Appropriate measures to compensate for the displaced material volume may include a corresponding change in the volume of the mould space at points outside the specified wall areas and/or a displacement of the plastic material back into the annealing system.

After the card body is completed with the slot, a chip module is inserted into the slot to complete the chip card.

According to a further development of the invention, the movable elements of the injection mould are used not only for the manufacture of thin wall areas but also for embedding the chip module in the plastic mass of the card body. As will be explained further in the examples, this can be done in various ways.

In one of these embodiments, a microchip module fixed to the front of the stamp, as is commonly used for chip cards, is pressed into the plastic mass by means of a movable stamp, thus inserting and fixing the module in the card body and creating the required cavity in a single operation.

In the second embodiment, the module is embedded in two steps, the first of which is to create the cavity by pressing the stamp, the second, directly following, is to insert the module into the cavity.

The method of the invention has a number of advantages over the known methods. For example, the front surface of the movable stamp can be made almost arbitrarily complex. By pressing the stamp into the plastic mass, an exact impression of these structures is always obtained. The formation of bubbles, defects, blurred contours, etc. is completely avoided.

Err1:Expecting ',' delimiter: line 1 column 547 (char 546)

Since the thin wall areas are produced by pressing the already inflowing plastic mass, not only is the exact shape and wall thickness obtained for very thin membranes, but also by compressing the plastic mass in these areas, an increased strength of the plastic material thus compacted is achieved.

Further advantages and embodiments are shown in the following examples, which are described in the figure.

It shows: Fig. 1interface drawing of a rotational symmetrical membrane with different wall thickness ranges,Fig. 2a die in a fragmented cut view at the time of the mold filling and reduction of wall thickness,Fig. 3a chip card grinding under supervision,Fig. 4the interface A-B from Fig. 3,Fig. 5the interface A-B with chip module,Fig. 6a device for manufacturing injection moulds in simplified interface design,Fig. 7alternative device elements for manufacturing injection moulds,Fig. 8a - alternative chip module components integrated in a single injection mould carrier,Fig. 9a carrier with minichip carrier integrated in a standard carrier,Fig. 10a carrier with minichip integrated in a standard carrier designed for manufacturing simplified moulds.

Figure 1 shows, for the purpose of illustrating the basic principle of the invention, the intersection of a moulding part 1 of plastic with different wall thicknesses. The moulding part 1 is rotationally symmetrical. It has an outer ring 2 which is reinforced and profiled in such a way that it can be fixed in a ring-shaped housing for later use. Inside the moulding part 1 there is a circular floor or a membrane 3 with increased strength. Between the outer ring 2 and the membrane 3 there is a ring-shaped wall thickness reduction 4 which involves an elastic embedding of the membranes 3.

Figure 2 shows a schematic of a die that can be used to produce the die part 1 shown in Figure 1.

The mould shown is known to consist of a first moulding part or mould plate 12 and a second moulding part or mould plate 13, which can be moved along the mould opening along the centre line 10 by means of non-shown devices. In the closed position shown, the moulding parts 12, 13 define between themselves a moulding space 11 and 11 respectively. Although the moulding space 11, 11' in the embodiment shown is arranged symmetrically to the centre line 10, the invention is not limited to such a position of the moulding space. Other non-symmetrical arrangements can also be envisaged.

In one of the moulds 12, 13, in the present moulding in moulding 13, an arrangement is provided consisting of an outer core element 14 and an inner stamping element 15, the elements 14, 15 can be moved relative to each other and to moulding part 13 and have free front surfaces that limit or define the moulding space 11 by area.

As mentioned above, in the present embodiment, the injection mould is used to produce a disc-shaped mould with a ring-shaped cross-sectional dilution close to its outer circumference, and the outer core element 14 may therefore have a cylindrical configuration with an axis coinciding with the center line 10 of the mould chamber 11.

Err1:Expecting ',' delimiter: line 1 column 348 (char 347)

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Although other suitable devices may be provided, in the present embodiment, the control of the movement of the core element 14 between the first and second positions is to be accomplished by an arrangement of first interacting wedge surfaces 21, 22 on the front face of the core element 14 facing the form 11 or a control device 17 sliding between the form 13 and a support plate 16.

The movement of the control 16 in the direction of the arrow 9 may be effected by any suitable control (not shown), e.g. piston cylinder control, depending on the command of a control also not shown.

The arrangement of the first interacting wedge surfaces 21, 22 is such that when the control 16 moves in one direction (in the drawing to the right), the core 14 is in the first or starting position, while when the control 16 moves in the opposite direction, the core 14 is moved to the second, in the drawing to the left.

A second pair of interacting wedge surfaces 23, 24 is provided at the inner piston 15 and control element 16 respectively. The second wedge surfaces 23, 24 are oriented opposite in relation to the first wedge surfaces 21, 22 so that movement of the control element 16 in one direction triggers a movement of the piston 15 in a direction opposite to that of the core element 14. Therefore, when the control element 16 is moved to the left in the drawing, the piston 5 undergoes a movement towards the piston 7 away from the mould 12 in the opposite direction, so that the distance between the free piston area of the piston 15 and the area of the mould 11 in the opposite direction increases while the distance between the free piston area of the mould 11 and the area of the mould 14 in the opposite direction increases slightly.

By adjusting the inclination of the first and second wedge surfaces 21, 22 and 23, 24 respectively, it can be obtained that the increase in volume of the moulding chamber 11 resulting from the movement of the stamping element 15 corresponds essentially to the decrease in volume resulting from the movement of the core element 14 into the second position. In this way it can be obtained that the total volume of the moulding chamber 11 is substantially altered in both the first and second positions of the core element 14.

Err1:Expecting ',' delimiter: line 1 column 433 (char 432)The movement of the control element 16 causes the core element 14 to move in the direction of the shaft 5 to the second position shown in the drawing to the left, displacing the material between its front surface and the opposite wall of the formwork 11.

Err1:Expecting ',' delimiter: line 1 column 417 (char 416)

It is understood that the invention is not limited to the number of core and stamp elements 14, 15 and their arrangement between themselves and in relation to the mould space 11 shown, but that any arrangement of one or more core reducing wall thickness elements 14 with one or more stamp elements 15 may be provided for.

In the embodiment shown, the movement of the elements 14, 15 is essentially parallel to the centre line 10. The invention is not limited to such a direction of movement.

Figure 3 shows a chip card reel 26 which can be produced in a particularly advantageous way by the method of the invention.

In Fig. 4 the section A to B of Fig. 3 is shown schematically. For the sake of a better overview, the exact proportions have not been given. Usually the outer dimensions of such chip cards are about 85 mm x 54 mm, the thickness is 0.76 mm, the membrane 28 at the bottom of the depth 27 has a wall thickness of about 100 m. The outer diameter of the depth 27 is about 15 - 20 mm, the shape of the depth can vary as much as desired in terms of both the outer circumference and the grading. For example, rectangular, square or oval outer contours are known. The molding itself can also have several abutments or be formed on the inner lenses.

Fig. 5 shows the section A to B of the card area with the chip module 44 inserted. The chip module consists of a support film 29 with metallic contact surfaces 30 on which, when the chip card 26 is used, the integrated circuit, or chip for short, located in the casting resin tablet 31 can be communicated. The chip module 44 is equipped with an adhesive layer 32 to fix the module in the gap 27.

Figure 6 shows a die for the manufacture of chip cards using the method of the invention. The device consists essentially of a lower half 35 and an upper half 36. Between these two halves, the die space 38 is provided, which has the shape of the later chip card, but without the depth shown in Figure 4. The two halves 35 and 36 have an injection channel 39 through which the plastic is fed into the die.

In the simplest case, the injection molding card 26 could be injected so that the stamp 40 is inserted into the stamping mold 46 so that the stamping face is closed with the edge to the molding chamber 38. In this arrangement, the plastic material is first pressed through the injection channel 39. After the molding chamber is largely filled with plastic material, the stamp 40 is pressed into the molding chamber or the plastic mass therein so that the stamping face 40 is uncovered in the plastic mass or the graduated closing is produced. The stamp 40 is removed from the displaced plastic material, as described above, and the plastic material can be removed in the chip either by means of a plastic filling or by means of a mechanical release of the plastic material in the original mold 36 or the mold 26 and the mechanical release of the plastic material can be obtained separately from the original mold.

When this procedure is carried out, it is of course necessary to make the front face of the stamp 40 different from the shape shown in Figure 6 according to the recess 27, i.e. the front face must have a step, as shown in Figure 7a, which forms the membrane 28.

In addition to the appropriate forming of the stamping face, the surface can of course also be affected in a specific way, for example to produce special surface roughnesses of the ring-shaped stage 33 during the subsequent grinding of the chip card, as is necessary in the present case.

The device shown in Figure 6 has additional device elements which allow, in addition to the production of the chip card grinding described in the introduction, the simultaneous embedding of the chip module.

Err1:Expecting ',' delimiter: line 1 column 551 (char 550)

Unlike the simplest design described at the beginning, the stamp 40 shown in Figure 6 has no grading but a flat surface and one or more suction air channels 43 to allow the film to be sucked into the stamp face.

The map is now produced as follows: In a first step, the strip 41 is placed in front of the face of the stamp 40 so that a chip card module 44 is positioned in front of it. By lowering the stamp 40 towards the molding space 38 (arrow 42), the chip module is pushed into the stamp guide of the molding part 36 and protruded from the strip 41. The protruded chip module is sucked through the suction channels 43 and thus held on the stamp's face. The stamp 40 is now lowered towards the molding space 38 so that the bottom edge of the module ends approximately with the top edge of the molding space 38, i.e. the chip module is not yet blown into the molding space. In this position the chip module is blown over the plastic 39 injection molding material. The plastic 39 injection molding material is injected into the molding space 40 together with the plastic injected into the molding space, although the molding material is not blown into the molding space.

After sufficient cooling of the plastic mass, the mould is opened, i.e. the mould halves 35 and 36 are pulled apart and ejected from the mould by re-activating the stamp 40.

After closing the two halves 35 and 36, the stamp 40 is withdrawn to the starting position and the 45-lined area of the film is moved until a chip module 44 is again positioned in front of the stamp 40.

The method of cardmaking shown in Fig. 6 thus allows the production of injection moulded chip cards with the chip module embedded at the same time. The embedding of the chip module into the injected plastic mass is, as experiments have shown, relatively unproblematic as long as the outer shape of the chip module is simply structured and the module is mechanically resilient.

Figure 7a shows a possible embodiment of such a stamp with additional functions 40. The stamp 40 consists of three interlocking stamp elements 47, 48 and 49. The stamp 40 is used in the form shown in Figure 7a to press the groove 27 by passing through the foil mount 45 of the strip 41 to the mould space 38, injecting the plastic material into the mould space and pressing it into the mould mass as described at the beginning.

After the graduated recess 27 has been imprinted into the card body, the stamp 40 is retracted into the guide plate 37. In addition, the stamp element 48 is moved back until the front face of the element 48 is completely closed with the front face of the element 49. The pen 47 is then retracted and fixed into the position shown in Fig. 7b. In this position, an air channel is formed which enters the centre of the stamp finger surface and allows the suction of the chip module 44 by means of a hole in element 48 and a longitudinal nut 50 provided for in element 49.

After the stamp 40 has been moved one position further in the direction of the molding space by retracting the elements 47 and 48 in the order shown in Fig. 7b, and the film strip 41 has been moved one position further, the stamp 40 is printed again in the direction of the molding space, whereby, as described at the beginning, a chip module 44 is extruded from the film strip 41 and placed in the previously created graduated recess.

After sufficient cooling, the mould slots 35 and 36 can be reopened and the card body removed from the mould.

Chip modules with anchorages that anchor the module in addition to or as an alternative to an adhesive layer in the card body are particularly suitable for installation in injection moulded cards.

A module of this type is already known from DE 31 31 216 C2 and is shown in Fig. 8a. For simplicity, just as in the following figures, only the components necessary to describe the situation are shown here. The chip module consists of a carrier film 29 on which contact surfaces 30 are located, which are connected to the chip by conduction. To protect against mechanical stresses, the chip module and conductive connections are surrounded by a casting body 55. Beyond the edge of the casting body 55 there are anchorage elements 56 which are used exclusively for anchoring the module in the card body. For this purpose, the anchorage element 56 can be, for example, formed as a perforated ring which is embedded in the card material.

The holes are permeated by the card material, so that the chip module is anchored in the card.

In addition, in the case of injection moulded boards, chip modules are also conceivable in which the anchorage elements do not protrude beyond the mould but are provided in the mould itself by special training, such as grooves, recesses, holes, etc. Such embodiments are shown in Figures 8b to 8e.

In the manufacture of injection moulding cards, such modules can be either first inserted into the mould chamber and then injected or subsequently pressed into the plastic mass which has not yet solidified.

The module shown in Figure 8b has a ring-shaped recess in the casting body 55 which, on the one hand, facilitates the filling with plastic material and, on the other, ensures optimal anchoring of the module even with a curved chip board.

Figure 8c shows a chip module with gaps in both the casing surface and the face of the casing body. The gap 59 in the casing surface is ring-shaped and prevents the chip module from being removed from the card body. The angled gaps 60 anchor the module additionally in the card body but also prevent the module from being rotated in the card.

The channels terminate on the one hand in the bottom surface of the module and on the other hand in the casing surface of the casing. The channels have, for example, an inclination of about 45°. The chip module shown in Fig. 8d is particularly suitable when the module is pressed into the plastic mass already injected, since the channels 58 are also intended to allow the still liquid plastic material to flow very well through. To prevent further fracturing of the plastic material inserted into the boreholes when the card is used, the openings in the casing surface are arranged so that the chip casings are positioned in a plastic crane.

Figure 8e shows a chip module with a casting body 55 with a coating surface formed as a thread. The comparatively complex thread structure is formed by pressing the module into the plastic mass as yet uncured as an exact negative. If the materials forming the casting body and the card body are chosen in such a way that they do not join together, the module anchored to the card body through the thread can be later scraped out of it.

Figure 8f shows the module 55 shown in Figure 8e in conjunction with a threaded housing 61. The housing has anchorage elements 56 by which the housing can be fixed in the card body. The housing 61 is inserted into the card body during the injection process with or without the screw-in module 55. However, to prevent deformation of the housing, it is preferable to insert it together with the chip module or a corresponding module dummy.

The housing 61 shown in Fig. 8f is equipped with an anchorage frame, as shown in Fig. 8a. This protrudes beyond the edge of the housing 61 and ensures a particularly good anchoring of the chip module/housing unit in the card body.

Fig. 9 shows a standard card 65 with integrated minichip card 66, as known from, for example, DE 40 07 221 A1. As explained in DE 40 07 221 A1, such minichip cards 66 are usually cast from conventional standard cards 65. However, such a standard card 65 with integrated minichip card 66 can also be produced by the injection molding process of the invention without further stamping operations.

Figure 10 shows a mold of this type, which has a slit opening in the lower half of the mold 35 through which a punching tool 69 can be inserted into the mold chamber 38.

Err1:Expecting ',' delimiter: line 1 column 636 (char 635)

The standard cards with integrated minichip cards are produced in the usual way, as shown in the context of Figures 6 and 7. After this process, the stamping tool 69 is pressed into the molding chamber with the help of the gripper 74 to produce the contour line 75 and the platform 67.

For the sake of completeness, it should be noted that the examples of execution shown in the figures are not intended to be a complete list of possible embodiments; it is understood by the professional that the combination of the various execution details is as possible as the addition or modification by means of measures known to the state of the art without abandoning the basic principle of the invention.

Claims

A method for producing chip cards comprising an injection-molded card body (26) with a recess (27) containing a chip module (44), characterized by the following method steps: producing the card body (26) by injecting a molten plastic material into an initial mold space (38) whose configuration corresponds substantially to the card body without a recess, reducing the distance between certain wall areas of the initial mold space (38) with a movable die (40) to form the recess (27) after the plastic material has flowed at least into the areas of the wall areas to be reduced, whereby the plastic material in the wall areas is compressed and/or displaced out of these areas, removing the card body (26) with the recess (27) from the initial mold space, fastening the chip module (44) in the recess (27).
A method for producing chip cards comprising an injection-molded card body (26) with a recess (27) containing a chip module (44), characterized by the following method steps: positioning a foil strip (41) provided with chip modules (44) before the face of a movable die (40), sucking the foil strip (41) against the die by activating a suction air source, lowering the die (40) toward an initial mold space (38) whose configuration corresponds substantially to the card body without a recess, and simultaneously stamping a module (44) out of the foil strip (41), positioning the chip module (44) in the area of the boundary surface of the initial mold space (38), injecting molten plastic material into the initial mold space (38), further lowering the die (40) so that the chip module (44) is pressed into the surface of the molding after the mold space (38) in the area of the die (40) is largely filled with plastic material, completely filling the mold space (38) in so far as any cavities in the mold space (38) are left to be filled with plastic material, cooling the molding until the plastic material has solidified, opening the injection mold and removing the molding.
A method for producing chip cards comprising an injection-molded card body (26) with a recess (27) containing a chip module (44), characterized by the following method steps: lowering a die (40) with a face adapted to the recess to be produced, into the area of the surface of an initial mold space (38) whose configuration corresponds substantially to the card body without a recess, injecting the plastic material into the initial mold space (38), further lowering the die (40) into the plastic compound of the mold space (38) to form the recess to be produced in the molding, further injecting the plastic material until all cavities in the mold space (38) are filled, cooling the molding until the plastic compound has solidified, withdrawing the movable die (40) into a waiting position in which a foil strip (41) equipped with chip modules (44) is positioned before the face of the die (40), changing the face of the die into a form suitable for stamping out, fixing, and inserting a chip module (44) in the depression in the molding, positioning the foil strip (41) before the face of the die, sucking the chip module (44), lowering the die (40) again while stamping out the chip module (44) until the chip module (44) is inserted into the recess in the molding, pressing the chip module (44) into the recess (27) in the card body (26), opening the mold and removing the chip card.
The method of any of claims 1 to 3, characterized in that the movable die (40) is lowered into the initial mold space (38) only after the latter has been filled virtually completely.
The method of claim 4, characterized in that wall distances are increased in certain areas of the mold space (38) parallel to the lowering of the movable die (40) or the reduction of other wall areas, the areas with the increased wall distances taking up the plastic material displaced out of the other areas.
The method of claim 4, characterized in that the material is displaced into the gate system (39).
The method of any of claims 1 to 3, characterized in that the displacement of material caused by the lowering of the movable die (40) into the mold space (38) is already taken into account in the supply of material.
The method of any of claims 1 to 3, characterized in that the chip module (44) has a hot-melt adhesive coating (32) that is activated by the residual heat of the card body (26) after it has been incorporated in the recess (27) or pressed into the plastic compound of the card body (26).
A method for producing a mini chip card (66) integrated in a standard card (65) that is connected via bars (67) with the surrounding card body of the standard card (67), according to any of claims 1 to 3, characterized in that the contour of the mini chip card (66) is produced by pressing a stamping die (69) into the plastic material disposed in the mold space (38) of the injection molding means.
An injection molding means for carrying out the method of claim 1 having a mold enclosing at least one mold space and having mutually movable mold parts and at least one die movable between first and second positions into and out of the mold area, characterized in that the mold space (38) corresponds virtually to a chip card without a recess, the face of the movable die (40) is adapted to the recess (27) to be produced in the card body (22).
An injection molding means for carrying out the method of claim 2 having a mold enclosing at least one mold space and having mutually movable mold parts and at least one die movable between first and second positions into and out of the mold area, characterized in that the mold space (38) corresponds virtually to a chip card without a recess, one of the mold parts (35, 36) has a guide means (34) for a foil strip (41) with chip modules (44), the face of the movable die (40) is virtually plan.
An injection molding means for carrying out the method of claim 3 having a mold enclosing at least one mold space and having mutually movable mold parts and at least one die movable between first and second positions into and out of the mold area, characterized in that the mold space (38) corresponds virtually to a chip card without a recess, one of the mold parts (35, 36) has a guide means (34) for a foil strip (41) with chip modules (44), the face of the movable die (40) is variable and either corresponds to the recess (27) to be produced in the card body (22) or is virtually plan.
An injection-molded card produced by the method of any of claims 1, 2 or 3, characterized in that the card body (22) has a one- or multistep recess (27) for taking up a chip module (44), and the molecular orientation in the surroundings of the recess (27) corresponds virtually to the orientation in the rest of the card area.
An injection-molded card produced by the method of any of claims 1 to 3, characterized in that the card has a chip module (44) embedded positively in the card material, and the molecular orientation surrounding the module (44) corresponds virtually to the orientation in the rest of the card area.
The injection-molded card of claim 13 or 14, characterized in that the plastic material is compressed in the area of the membrane.
A chip module, particularly for use in injection-molded cards produced by the method of claim 2, comprising at least one carrier foil bearing contact surfaces, and a casing enclosing the chip module, characterized in that anchoring elements (56, 58, 59, 60) are provided on the casing for the injection-molding material to flow around and/or through and to permit an anchoring in the card body.
The chip module of claim 16, characterized in that the anchoring elements are provided in the casing (55) of the chip module (44) in the form of recesses, depressions, bores, notches, profiles or the like.
The chip module of one or both of claims 16 and 17, characterized in that the recesses (59) are located in the surface area and/or in the end face of the casing opposite the carrier foil.
The chip module of one or more of claims 16 to 18, characterized in that the recess (59) located on the surface area is designed as a groove whose cross section is preferably wedge-shaped or rectangular.
The chip module of claim 16, characterized in that the anchoring elements (56, 58, 59, 60) provided on the casing (55) are formed as channels (58) open on both sides through which injection-molding material flows.
The chip module of claim 20, characterized in that the channels (58) arise through bores from the end face to the surface area and form an angle of 45° with the end face.
The chip module of claim 16, characterized in that the anchoring arising through the anchoring elements provided on the casing (55) is reversibly detachable.
The chip module of claim 22, characterized in that the anchoring element is of threaded design.
The chip module of one or more of claims 22 to 23, characterized in that it is screwed into a sleeve (61) bearing anchoring elements around and/or through which injection-molding material flows to permit anchoring in the card body (22).