Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 金苹果国际有限公司filedCritical金苹果国际有限公司
Priority to HK04110249ApriorityCriticalpatent/HK1068041A2/en
Publication of HK1068041A2publicationCriticalpatent/HK1068041A2/en
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices
(AREA)
Abstract
A method for forming a resin article with independent metal elements in the resin portion. In this method, the independent metal elements are fixed by supports before the liquid resin is poured into a metal frame. After the resin sets, the supports are removed and the article is polished to form a finish with independent metal elements in the resin portion.
HK04110249A2004-12-242004-12-24Method for forming a resin article with independent metal elements in the resin portion
HK1068041A2
(en)