GB2631251A

GB2631251A - Electronic device cooling module

Info

Publication number: GB2631251A
Application number: GB2309372.7A
Authority: GB
Inventors: Daniels Rupert; Kadhim Mustafa
Original assignee: Iceotope Group Ltd
Current assignee: Iceotope Group Ltd
Priority date: 2023-06-21
Filing date: 2023-06-21
Publication date: 2025-01-01
Also published as: WO2024261487A1

Abstract

A main housing enclosing 7 at least one first electronic device, such as a computer server (see figure 1), is in thermal contact a liquid coolant contained within the housing. A second electronic device 6, such as a pluggable networking device, is externally fixed to the housing, with an electrical connection (eg cables 4 figure 1) 11 to the first device and has a thermally conductive portion 17 with an outer surface thermally connected to the liquid in the housing and an inner surface connected to cool the second device. The thermal portion is preferably fixed to an aperture to allow both the thermal and electrical connections. Figure 2 shows an exploded diagram of the second device (showing a second housing fixed to the first via seal at the aperture and showing a sealed chamber 12 for the electrical connection). The thermal portion may comprise may different elements and/or heat exchangers: Figures 3b,c show fins; figures 4,4a shows heat-pipes extending to a finned heat exchange in the first housing; Figures 5 and 6 instead show a close coolant heat-exchanger fixed to the external device and plumbed into the coolant loop of the first housing.

Description

ELECTRONIC DEVICE COOLING MODULE

Field of the Disclosure

[001] The present disclosure relates to a cooling system and in particular, a cooling system for electronic devices and boards. The cooling system may provide a sealable enclosure for housing heat generating components such as motherboards, memory modules or servers that require active or fluid cooling. The cooling system may further provide cooling to heat generating components located outside of the enclosure.

Background of the Disclosure

[2] Many types of electrical component generate heat during operation. In particular, electrical computer components such as motherboards, central processing units (CPUs) and memory modules may dissipate substantial amounts of heat when in use. Heating of the electrical components to high temperatures can cause damage, affect performance or cause a safety hazard. Accordingly, substantial efforts have been undertaken to find efficient, high performance systems for cooling electrical components effectively and safely.

[3] One type of cooling system uses liquid cooling. Although different liquid cooling assemblies have been demonstrated, in general the electrical components are immersed in a coolant liquid, so as to provide a large surface area for heat exchange between the heat generating electrical components and the coolant.

[4] WO-2018/096362 (commonly assigned with the present disclosure) describes an apparatus for cooling one or more heat generating components. The apparatus includes a sealable enclosure containing a first liquid coolant and one or more heat generating components. The apparatus further includes a conduit enabling a second liquid coolant to enter and exit the sealable enclosure without directly contacting the first coolant, and a pump within the enclosure configured to draw, pump, force or direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

However, as the enclosure contains a liquid coolant, access to the enclosure is more complicated and it is difficult to provide a removeable connection between the electronic devices inside the sealable enclosure and electronic devices external to the apparatus. Such a removeable connection may be provided for communication networking, for instance.

[5] WO-2019/048864 (commonly assigned with the present disclosure) describes a heat sink for cooling a heat-generating electronic device. The heat sink is designed for use in a cooling module, in which the one or some electronic devices are partially or fully immersed in a liquid coolant, whilst one or more other electronic devices may be cooled by the liquid coolant accumulating in the heat sink. As the cooling module contains liquid coolant, it can be difficult to provide a removeable connection between the electronic devices inside the enclosure and electronic devices external to the apparatus.

[6] Consequently, providing a connection between electronic devices within a liquid cooled enclosure and external electronic devices is desirable. It is further desirable to allow the connection to be removable.

Summary of the Invention

[7] Against this background, there is generally provided an electronic device cooling module that provides liquid cooling to components within the module housing, as well as providing connection and cooling to components mounted outside of the housing (in particular, these components providing a removeable connection between the electronic devices inside the enclosure and electronic devices external to the apparatus).

[8] In a first aspect, there is provided an electronic device cooling module in accordance with claim 1. Further features of this aspect are detailed in the dependent claims and herein.

[9] An electronic device cooling module comprises a housing which encloses at least one first electronic device (which may equivalently be termed one or more heat generating components), which is in thermal contact with a first liquid coolant contained within the housing. A second electronic device (which may equivalently be termed an external component) is disposed on an outer surface of the housing and is electrically and/or communicatively connected to the at least one first electronic device contained within the housing. A thermally conductive portion (which may be a heat sink block) is included in or on the outer wall of the housing, that is in thermal contact with the first liquid coolant and the second electronic device.

[10] Advantageously, this arrangement allows a second electronic device located outside of the housing to be cooled using the same liquid cooling system used to cool the at least one first electronic device located inside the housing. This second electronic device can be easily accessed without needing to remove coolant from the system. Additionally, a second, external, cooling system need not be required to cool the second electronic device, reducing size, cost and weight of the cooling module.

[11] In some embodiments, the thermally conductive portion may extend into the interior of the housing, which may increase the surface area of the thermally conductive portion that is in contact with the coolant. Additionally or alternatively, it may allow a lower level of coolant to be used. Increased contact area between the thermally conductive portion and the coolant advantageously may improve or increase the transfer of heat. A lower level of coolant advantageously may decrease cost and weight of the system.

[12] Optionally, the surface area of the thermally conductive portion may be further increased with pins. Additionally or alternatively, the surface area of the thermally conductive portion may be further increased with fins. Increased surface area of the thermally conductive portion provided by pins and/or fins (or more generally, projections) may increase contact area between the thermally conductive portion and the coolant, advantageously improving or increasing the transfer of heat.

[013] In some embodiments, the thermally conductive portion may include at least one heat pipe in thermal contact with the thermally conductive portion such that at least a tip of the heat pipe distal from the thermally conductive portion is in contact with the first liquid coolant.

[14] Optionally, the heat pipe may interconnect with a heatsink, and the heatsink may be at least partially submerged in the first liquid coolant. This may advantageously increase the surface area between the thermally conductive portion and the liquid coolant. Additionally or alternatively, this may allow a lower level of liquid coolant to be used. Increased contact area between the thermally conductive portion and the coolant advantageously may improve or increases the transfer of heat. A lower level of coolant advantageously may decrease cost and weight of the system.

[15] In some embodiments, the thermally conductive portion may comprise a first liquid coolant receptacle (which may be a bath heat sink, for example as discussed with reference to WO-2019/048864) connected to a remote first liquid coolant supply source. This may advantageously deliver coolant directly from the source to the thermally conductive portion, without the coolant being first heated by the at least one first electronic device.

[16] Optionally, the first liquid coolant receptacle includes a first liquid coolant outlet that is configured such that first liquid coolant received from the remote first liquid coolant supply source overflows from said first liquid coolant receptacle into the interior of the housing.

[17] In some embodiments, the thermally conductive portion includes a second liquid coolant receptacle (which may be a cold plate) containing a second liquid coolant and connected to a remote second liquid coolant supply source. This may advantageously allow the second electronic device to be cooled with a second coolant that does not mix with the first coolant. As the second liquid coolant does not directly contact any electronic devices, a coolant with a higher specific heat capacity than the first liquid coolant may be used.

[18] Optionally, the first liquid coolant may be a dielectric coolant. Additionally or alternatively, the second liquid coolant, where present, may be water.

[019] Optionally, the second electronic device may a networking connector. The networking connector may be a small form-factor pluggable module, a quad small form-factor pluggable module, or an octal small form-factor pluggable module. In embodiments, the first electronic device may comprise or be at least part of a computer system, for example a motherboard and/or one or more components that are mounted on a motherboard.

[020] In some embodiments, the thermally conductive portion may include a conduit (which may equivalently be referred to as a cable) through which an electrical and/or communicative interconnection between the first electronic device and the second electronic device is provided. Optionally, the conduit may be leakproof.

[021] In some embodiments, a thermal interface material may be disposed between the thermally conductive portion and the second electronic device. This may advantageously increase the transfer of heat from the second electronic device to the thermally conductive portion, and consequently the coolant.

[22] In some embodiments, the thermally conductive portion may be removably connected to an outer wall of the housing.

[23] In some embodiments, a window or opening may be provided in the outer wall of the housing which is covered by the thermally conductive portion.

[24] Optionally, a gasket may be disposed between the thermally conductive portion and the outer wall. This may advantageously create a liquid proof seal between the thermally conductive portion and the outer wall, preventing the leakage of liquid coolant.

[25] In respect of any and all of the aspects disclosed herein, features of a method for manufacturing and/or operating corresponding with those of any one or more of the electronic device cooling modules disclosed may additionally be provided. Combinations of aspects are also possible. Moreover, combinations of specific features from one aspect with the features of another aspect are also disclosed, where such combinations are compatible. Specific examples of such combinations are suggested herein, by way of example.

Brief description of the Figures

[026] The disclosure may be put into practice in a number of ways and preferred embodiments will now be described by way of example only and with reference to the accompanying drawings, as now described.

[027] Figure 1 shows a full chassis system according to an embodiment from a rear isometric view.

[28] Figure 2 shows an exploded view (front isometric) of a heat sink block of the full chassis system of Figure 1.

[29] Figure 3 shows a detailed view of heat sink block in Figures 1 and 2.

[30] Figure 3(a) shows a detailed view of a variation of the heat sink block of Figure 3, with the addition of pins.

[31] Figure 3(b) shows a detailed exploded view of a variation of the heat sink block of Figure 3, with the addition of fins.

[32] Figure 3(c) shows a detailed view of a variation of the heat sink block of Figure 3(b), with the fins extended vertically into the housing.

[33] Figure 4 shows a detailed view of a variation of the heat sink block of Figure 3, with the addition of heat pipes.

[034] Figure 4(a) shows a detailed view of a variation of the heat sink block with heat pipes of Figure 4, with the addition extended heat pipes and a submerged heat sink.

[035] Figure 5 shows a detailed view of a variation of the heat sink block of Figure 3, with the addition of a pumped first liquid coolant bath heat sink.

[36] Figure 6 shows a detailed view of a variation of the heat sink block of Figure 3, with the addition of a hybrid cold plate.

[37] Figure 7 Shows a section view of a heat sink block showing the first liquid coolant level.

Detailed description of the preferred embodiments

[38] With reference to Figure 1, there is shown an electronic device cooling module in accordance with an embodiment. In all of the drawings in this disclosure, the chassis lid has been removed for clarity. The module includes a housing 1 which encloses one or more heat generating components 3 and a liquid coolant 8. The module further comprises: Printed Circuit Boards (PCBs) 2; a cable 4; an external component 5; a heat sink block 6; and connectors 11. The heat generating components 3 may be processors, memory modules, I/O interfaces, or any other electronic component found in a computing system.

The heat generating components 3 may be mounted on one or more boards such as the PCBs 2. One or more of the heat generating components 3 are directly or indirectly connected to the cable 4. For instance, the one or more heat generating components 3 may be indirectly connected to the cable 4 through the PCBs 2. The cable 4 may be an optical cable or an electrical cable and is configured to allow information transfer and/or power transfer between the heat generating components 3 and an external component 5 via connectors 11. The external component 5 may be an electrical component located outside of the housing 1. The external component 5 typically also generates heat. The module may also contain equipment 31 for removing heat from the liquid coolant 8. In operation, the liquid coolant 8 is used to cool the heat generating components 3.

[39] An outer wall 7 of the housing 1 includes a thermally conductive portion. The thermally conductive portion in this embodiment is provided in the form of the heat sink block 6. The thermally conductive portion is in thermal contact with the external component 5 (outside the housing 1) and the liquid coolant 8 (inside the housing 1). The thermally conductive portion allows for transfer of heat from the external component 5 to the liquid coolant 8.

[40] In some embodiments, the external component 5 may be an I/O interface such as a networking interface. The networking interface may a Small Form-factor Huggable (SFP), a Quad Small Form-factor Huggable (QSFP) or an Octal Small Form-factor Huggable (OSFP) interface. The networking interface may be any other such networking interface as known in the art. Alternatively, the external component 5 may be a power component such as a fuse, battery or power supply. Furthermore, the external component 5 could be any other heat generating component that may need to be accessed (for instance for general configuration and/or servicing).

[041] Referring to Figure 2, there is shown an exploded view of the heat sink block 6 and associated components of the full chassis system of Figure 1. Where the same features are shown as in another drawing, identical reference numerals have been used. In the embodiment of Figures 1 and 2, a window or opening 29 is provided in an outside wall 7 of the housing 1. The heat sink block 6 is fixed to the outside wall 7 of the housing 1 with screws 9(a), bolts, clamps, adhesive, welding or any other such fixing method known in the art. A gasket 10 is provided between the heat sink block 6 and the outer wall 7 to provide a tight seal, effectively making the heat sink block part 6 of the outer wall 7. A pass-through hole 12 is provided in the heat sink block 6 which substantially aligns with the opening 29 in the outer wall 7. This allows for the cables 4 to pass through the heat sink block 6 and connect using connectors 11 to a PCB 14 fixed to the heat sink block 6. The PCB 14 is fixed to the heat sink block 6 with screws 9(b), bolts, clamps, adhesive, welding, or any other such fixing method known in the art. A gasket 13 is provided between PCB 14 and heat sink block 6 to provide a tight seal. The outer wall 7, heat sink block 6, PCB 14, and gaskets 10 and 13 are arranged to provide a liquid tight seal, preventing the liquid coolant from leaking out of the housing 1. Alternatively, the heat sink block 6 may be provided as an intrinsic part of the outer wall 7 of the housing 1.

[42] The external component 5 is mounted onto the PCB 14. Circuitry is provided in the PCB 14 to interface the connectors 11 with the external component 5. The external component 5 is mounted on the PCB 14 so that at least one surface of the external component 5 is in thermal contact with the thermal contact area 15 of the heat sink block 6.

A thermal interface material 16 may be provided between the external component 5 and the thermal contact area 15. This can optimise performance by reducing the thermal resistance (conversely, increasing thermal conductance) between the external component 5 and the heat sink block 6. The thermal interface material 15 may be thermal grease, thermal pads, thermal adhesive, or any other such thermal interface material as known in the art.

[43] Figure 3 shows the embodiment shown in Figure 2 from an alternative angle. Furthermore, it shows the components assembled. The same features as shown in another drawing are again indicated by identical reference numerals (also applicable to Figures 3(a), (b) and (c) as will be discussed below). In this embodiment, a heat transfer surface 17 of the heat sink block 6 is partially submerged in, and in direct contact with, the liquid coolant 8. An example of this can be seen in Figure 7, which shows a level 28 of the coolant 8 against the heat sink block 6. In other cases, the coolant level may completely cover the heat sink block 6, or may not cover the heat sink block 6 at all (that is, not even partially). The heat sink block 6 may be made from a metal such as aluminium or copper.

Alternatively, any other suitable material may be used (for example, a thermal conductor), depending on the thermal and structural requirements of the specific implementation.

[44] In an example mode of operation, the external component 5, which may be a QSFP connector, is connected to the PCBs 2 via cables 4 and is transmitting and receiving data between the heat generating components 3 within the housing 1 and an external server (not shown). This causes the QSFP connector to generate heat. This heat is transferred away from the component 5 through the heat sink block 6 and into the cooler liquid coolant 8. Heat is removed from the liquid coolant using any known method from removing heat from coolant in a liquid cooled computing system, for example a heat exchanger (not shown) which is preferably provided within the housing 1 but may alternatively be part of or located outside the housing 1. By removing heat from the external component 5, performance and lifetime can advantageously be increased.

[45] Figures 3(a) and 3(b) show the heat sink block of the previous embodiments with the addition of pins or fins, respectively. The pins or fins are mounted on, or form part of, the heat sink block 6 and extend horizontally into the housing 1. With reference to these drawings, the performance of the heat sink block 6 can be improved by increasing the surface area of the heat transfer surface 17. This may be achieved through the use of pins 18 or fins 19, depending on the cooling requirements. Other shapes or protrusions (equivalently, projections) can also be used to increase surface area. The pins 18, fins 19, or other protrusions may be formed as part of the heat sink block, or alternatively affixed onto the heat sink block 6 using any known method for fixing heat sinks to components, such as thermal adhesive.

[46] Figure 3(c) shows the heat sink block of Figure 3(b), with the fins extended vertically down into the housing. As shown, the heat transfer surface 17 may be extended to be larger than the window 29 so as to extend into the housing. In some embodiments, this allows for an even greater increase in the surface area of the heat transfer surface 17 that is in contact with the coolant 8, increasing the transfer of heat from the external component 5 to the coolant 8. Additionally or alternatively, extending the heat transfer surface 17 vertically downwards into the housing 1 allows a lower level of coolant 8 to be used whilst still maintaining thermal contact between the heat transfer surface 17 and the coolant 8. A lower level of coolant may reduce cost, reduce weight, and optimise cooling efficiency. The fins in this embodiment may equivalently be pins or any other shape protrusion extending into the housing.

[47] Figure 4 shows the heat sink block of Figure 3, with the addition of heat pipes to the heat sink block. This embodiment shows an alternative method of increasing the cooling efficiency, which is to use heat pipes 21 or vapour chambers. These may be directly or indirectly affixed onto the heat sink block 6 using any known method for fixing heat sinks to components, such as thermal adhesive. The heat pipes can also extend vertically downwards into the housing 1, increasing contact area with the coolant 8 or allowing a lower level of coolant 8 to be used.

[48] The embodiment shown in Figure 4 can be further improved as shown in Figure 4(a). This figure shows the heat pipes 21 of Figure 4 extended further into the coolant 8 and connected to a heat sink 23. The heat pipes can be further extended through the coolant 8 with extended heat pipes 22, increasing the contact area between the heat pipes and the coolant 8. Additionally, a heat sink 23, which may be submerged in the coolant 8, can be connected to the extended heat pipes 22. As well as allowing for increased surface area in contact with the coolant 8 and/or lower coolant 8 levels, the advantages of which have been previously discussed, the use of heat pipes 21 allows for the heat sink 23 to be positioned in an area of the housing 1 where the coolant 8 is naturally cooler or has more flow, for example, further away from heat generating components 3 or closer to a coolant pump. This increases cooling of the external component 5 without rearrangement of the internal heat generating components 3 or PCBs 2.

[49] Figure 5 shows the heat sink block of Figure 3, with the addition of a pumped first liquid coolant bath heat sink 25, as well as the coolant delivery pipe 24 to the bath heat sink 25. An alternative method of improving the removal of heat from the heat transfer block 6 will now be discussed with reference to Figure 5. In this embodiment, the coolant 8 is directly delivered to the heat transfer surface 17 through coolant delivery pipe 24. The coolant 8 may be poured over the heat sink block 6 (for example, as discussed in W02021/099772), or it may be poured into a bath heat sink 25. The liquid coolant bath heat sink 25 may be as described in WO-2019/048864, although other types of heat sink, for example as detailed in W02021/099770 or W02022/1 12799 may be used instead. Coolant is accumulated in the bath heat sink 25 adjacent the heat sink block 6, thereby effecting directed coolant. The level of coolant in the bath heat sink 25 is typically higher than the level of coolant in the housing 1. Coolant flows out (or overflows) the bath heat sink 25 back into the remaining coolant in the housing 1. In the previously discussed -10 -embodiments, the heat sink block 6 is cooled by coolant in the base of the housing 1. This coolant has also come into contact with the other heat generating components in the base of the housing, meaning it is not as cold as if it had come straight from the pump or heat exchanger. Therefore, by delivering coolant directly to the heat sink block 6, cooler coolant can be used to remove heat from the heat sink block 6, improving the cooling of the external component 5.

[50] Figure 6 shows the heat sink block of Figure 3, with the addition of hybrid cold plate 30 and separate pipes 28 for delivery of coolant to and from the cold plate. In the previously discussed embodiments, the same coolant is used for cooling the heat generating components 3 and the heat sink block 6. This coolant is generally a dielectric coolant, since it comes into direct contact with electrical components. In some embodiments however, a second liquid coolant, different from the first liquid coolant used to cool the lower power heat generating components 27, may be used to cool the heat sink block 6. This embodiment is shown in Figure 6. In this embodiment, a closed loop system is used to cool the heat sink block 6 via a cold plate 30. The cold plate 30 is in thermal contact with the heat sink block 6, and the second liquid coolant is delivered and removed from the cold plate 30 via pipes 26. As this is a closed loop system and the second liquid coolant never comes into direct contact with electrical devices, a coolant with a higher specific heat capacity such as water may be used. This means that heat can be more effectively removed from the heat sink block 6, improving cooling of the external component 5.

[51] Although specific embodiments have now been described, the skilled person will appreciate that various modifications and alternations are possible. The design of the housing 1 may be different in shape and/or structure, from that indicated (for example, it may not be cuboid). Alternative electronic devices from those shown as heat generating component 3 and/or external component 5 may be used, for example having different shapes, structures or applications. In some embodiments, there may be a different design of (or indeed, no) PCB 2, or there may be any number of PCBs (including just one). Furthermore, a different type of board, such as stripboard, may be used. The layout of PCBs 2 and/or components may be varied significantly. There are many different methods known to the skilled person for cooling the liquid coolant, and the equipment 31 is only provided as an example. Other methods or equipment may be used that do not physically resemble to equipment 31 but perform the same purpose of removing heat from the liquid coolant.

[52] The design of heat sink 23, or of the heat sink block 6, may be varied, for example by having different sizes and/or shapes. Different material constructions could be used to increase the surface area, such as laser sintered, honey cone or foams. Heat sink 23 may have any arrangement of pins, fins or other structures to increase the surface area. The fins 18 and pins 19 may have a different arrangement to those shown, such as different sizes and/or shapes. Alternative methods of fixing the components together may be provided, such as adhesive, rivets or other attachments forms.

[53] All of the features disclosed herein may be combined in any combination, except combinations where at least some of such features and/or steps are mutually exclusive. In particular, the preferred features of each aspect of the disclosure are generally applicable to all aspects of the disclosure and the features of all of the aspects may be used in any combination. Likewise, features described in non-essential combinations may be used separately (not in combination).

[54] A method of manufacturing and/or operating any of the devices disclosed herein is also provided. The method may comprise steps of providing each of features disclosed and/or configuring the respective feature for its stated function.

Claims

CLAIMS: 1. An electronic device cooling module comprising: a housing enclosing at least one first electronic device, said at least one first electronic device being in thermal contact with a first liquid coolant contained within the housing; a second electronic device disposed on an outer surface of the housing and electrically and/or communicatively connected to the at least one first electronic device contained within the housing; wherein the housing includes an access window in an outer wall that is covered by a thermally conductive portion that is in thermal contact with said first liquid coolant on a first surface and that is in thermal contact with the second electronic device on a second surface, so as to transfer heat from the second electronic device to the first liquid coolant.
2. An electronic device cooling module as claimed in claim 1, wherein the thermally conductive portion extends into the interior of the housing.
3. An electronic device cooling module as claimed in claim 2, wherein the thermally conductive portion comprises a plurality of pins protruding into the interior of the housing CO 20 through the access window.
4. An electronic device cooling module as claimed in claim 2, wherein the thermally conductive portion comprises a plurality of fins protruding into the interior of the housing through the access window.
5. An electronic device cooling module as claimed in claim 2, wherein the thermally conductive portion includes at least one heat pipe disposed within the housing and in thermal contact with the thermally conductive portion such that at least a tip of the heat pipe distal from the thermally conductive portion is in contact with the first liquid coolant.
6. An electronic device cooling module as claimed in claim 5, wherein the at least one heat pipe interconnects with a heatsink, said heatsink extending into the interior of the housing through the access window.
7. An electronic device cooling module as claimed in claim 6, wherein the heatsink is at least partially submerged in the first liquid coolant.
8. An electronic device cooling module as claimed in claim 2, wherein the thermally conductive portion comprises a first liquid coolant receptacle connected to a remote first liquid coolant supply source, said first liquid coolant receptable disposed within the housing.
9. An electronic device cooling module as claimed in claim 8, wherein the first liquid coolant receptacle includes a first liquid coolant outlet, the first liquid coolant outlet configured such that first liquid coolant received from the remote first liquid coolant supply source overflows from said first liquid coolant receptacle into the interior of the housing.
10. An electronic device cooling module as claimed in claim 2, wherein the thermally conductive portion includes a second liquid coolant receptacle containing a second liquid coolant and connected to a remote second liquid coolant supply source, said second liquid coolant receptable disposed within the housing.
11. An electronic device cooling module as claimed in claim 10, wherein the second liquid coolant receptacle comprises a sealed enclosure including a second liquid coolant inlet and CO 20 a second coolant outlet, said coolant inlet and said coolant outlet are interconnected with a second liquid coolant supply loop.
12. An electronic device cooling module as claimed in claim 10 or 11, wherein the second liquid coolant is water.
13. An electronic device cooling module as claimed in any preceding claim, wherein the first liquid coolant is a dielectric liquid coolant.
14. An electronic device cooling module as claimed in any preceding claim, wherein the second electronic device is a networking connector.
15. An electronic device cooling module as claimed in claim 14, wherein the networking connector is one of: a small form-factor pluggable module; a quad small form-factor pluggable module; and an octal small form-factor pluggable module.
16. An electronic device cooling module as claimed in any preceding claim, wherein the thermally conductive portion includes a conduit through which an electrical and/or communicative interconnection between the first electronic device and the second electronic device is provided.
17. An electronic device cooling module as claimed in claim 16, wherein the conduit is leakproof.
18. An electronic device cooling module as claimed in any preceding claim, wherein a thermal interface material is disposed between the thermally conductive portion and the second electronic device.
19. An electronic device cooling module as claimed in any preceding claim, wherein the thermally conductive portion is removably connected to the outer wall of the housing.
20. An electronic device cooling module as claimed in claim 19, wherein a gasket is disposed between the thermally conductive portion and the outer wall. CO 20