[go: up one dir, main page]

GB2599393B - Method and apparatus for sputter deposition - Google Patents

Method and apparatus for sputter deposition Download PDF

Info

Publication number
GB2599393B
GB2599393B GB2015461.3A GB202015461A GB2599393B GB 2599393 B GB2599393 B GB 2599393B GB 202015461 A GB202015461 A GB 202015461A GB 2599393 B GB2599393 B GB 2599393B
Authority
GB
United Kingdom
Prior art keywords
sputter deposition
sputter
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2015461.3A
Other versions
GB202015461D0 (en
GB2599393A (en
Inventor
Edward Rendall Michael
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dyson Technology Ltd
Original Assignee
Dyson Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dyson Technology Ltd filed Critical Dyson Technology Ltd
Priority to GB2015461.3A priority Critical patent/GB2599393B/en
Publication of GB202015461D0 publication Critical patent/GB202015461D0/en
Priority to CN202111134030.8A priority patent/CN114318273A/en
Publication of GB2599393A publication Critical patent/GB2599393A/en
Application granted granted Critical
Publication of GB2599393B publication Critical patent/GB2599393B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0047—Activation or excitation of reactive gases outside the coating chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0063—Reactive sputtering characterised by means for introducing or removing gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
GB2015461.3A 2020-09-30 2020-09-30 Method and apparatus for sputter deposition Active GB2599393B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB2015461.3A GB2599393B (en) 2020-09-30 2020-09-30 Method and apparatus for sputter deposition
CN202111134030.8A CN114318273A (en) 2020-09-30 2021-09-27 Method and apparatus for sputter deposition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2015461.3A GB2599393B (en) 2020-09-30 2020-09-30 Method and apparatus for sputter deposition

Publications (3)

Publication Number Publication Date
GB202015461D0 GB202015461D0 (en) 2020-11-11
GB2599393A GB2599393A (en) 2022-04-06
GB2599393B true GB2599393B (en) 2024-12-18

Family

ID=73005641

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2015461.3A Active GB2599393B (en) 2020-09-30 2020-09-30 Method and apparatus for sputter deposition

Country Status (2)

Country Link
CN (1) CN114318273A (en)
GB (1) GB2599393B (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5962080A (en) * 1995-04-17 1999-10-05 Read-Rite Corporation Deposition of insulating thin film by a plurality of ion beams
CN101457343A (en) * 2007-12-14 2009-06-17 中国电子科技集团公司第十八研究所 Method for preparing lithium ion solid electrolyte film
JP2009140899A (en) * 2007-12-07 2009-06-25 Sungkyunkwan Univ Foundation For Corporate Collaboration Plasma source with ferrite structure and plasma generator employing the same
US20110226617A1 (en) * 2010-03-22 2011-09-22 Applied Materials, Inc. Dielectric deposition using a remote plasma source
WO2011131921A1 (en) * 2010-04-20 2011-10-27 Plasma Quest Limited High density plasma source
US20140087092A1 (en) * 2012-09-26 2014-03-27 Kai Wei NIEH Plasma deposition on a partially formed battery through a mesh screen
US20160079042A1 (en) * 2014-09-11 2016-03-17 Varian Semiconductor Equipment Associates, Inc. Uniformity Control using Adjustable Internal Antennas
US20160248117A1 (en) * 2015-02-23 2016-08-25 Front Edge Technology, Inc. Solid-state lithium battery with electrolyte
WO2019131490A1 (en) * 2017-12-28 2019-07-04 ランテクニカルサービス株式会社 Method for bonding substrate, transparent substrate laminate, and device provided with substrate laminate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3880135T2 (en) * 1988-09-08 1993-09-16 Asahi Glass Co Ltd SPRAYING METHOD BY MEANS OF A BAND-SHAPED PLASMA FLOW AND DEVICE FOR HANDLING THIS METHOD.
GB2576543A (en) * 2018-08-23 2020-02-26 Dyson Technology Ltd An apparatus

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5962080A (en) * 1995-04-17 1999-10-05 Read-Rite Corporation Deposition of insulating thin film by a plurality of ion beams
JP2009140899A (en) * 2007-12-07 2009-06-25 Sungkyunkwan Univ Foundation For Corporate Collaboration Plasma source with ferrite structure and plasma generator employing the same
CN101457343A (en) * 2007-12-14 2009-06-17 中国电子科技集团公司第十八研究所 Method for preparing lithium ion solid electrolyte film
US20110226617A1 (en) * 2010-03-22 2011-09-22 Applied Materials, Inc. Dielectric deposition using a remote plasma source
WO2011131921A1 (en) * 2010-04-20 2011-10-27 Plasma Quest Limited High density plasma source
US20140087092A1 (en) * 2012-09-26 2014-03-27 Kai Wei NIEH Plasma deposition on a partially formed battery through a mesh screen
US20160079042A1 (en) * 2014-09-11 2016-03-17 Varian Semiconductor Equipment Associates, Inc. Uniformity Control using Adjustable Internal Antennas
US20160248117A1 (en) * 2015-02-23 2016-08-25 Front Edge Technology, Inc. Solid-state lithium battery with electrolyte
WO2019131490A1 (en) * 2017-12-28 2019-07-04 ランテクニカルサービス株式会社 Method for bonding substrate, transparent substrate laminate, and device provided with substrate laminate

Also Published As

Publication number Publication date
GB202015461D0 (en) 2020-11-11
CN114318273A (en) 2022-04-12
GB2599393A (en) 2022-04-06

Similar Documents

Publication Publication Date Title
GB2588949B (en) Method and apparatus for sputter deposition
GB2588939B (en) Sputter deposition apparatus and method
EP3937558A4 (en) Method and apparatus for positioning
SG10202011423RA (en) Substrate processing method and plasma processing apparatus
EP4076726A4 (en) Apparatus and method for thin film deposition
KR102185623B9 (en) Thin film deposition apparatus and thin film deposition method
EP4001457A4 (en) High-throughput vapor deposition apparatus and vapor deposition method
EP4100556C0 (en) Method and apparatus for tuning film properties during thin film deposition
GB2587358B (en) Apparatus and method for flipping and positioning articles
GB201905138D0 (en) Apparatus and method for processing a substrate
GB2599392B (en) Sputter deposition apparatus and method
GB2599393B (en) Method and apparatus for sputter deposition
GB2599394B (en) Method and apparatus for sputter deposition
GB2599391B (en) Sputter deposition apparatus and method
GB2616646B (en) Methods and apparatus for droplet deposition
PL4110617T3 (en) Apparatus and method for depositing veneers
EP4249625A4 (en) Method and apparatus for treating metallic member
EP3959355A4 (en) Apparatus and method for atomic layer deposition (ald)
GB2594290B (en) Methods and apparatus for powder deposition
GB2598936B (en) Method and apparatus for plasma processing
GB2598934B (en) Method and apparatus for plasma processing
PL3696889T3 (en) Method and device for removing coatings from coated films
EP4065745A4 (en) Substrate processing apparatus and method
GB2616859B (en) Methods and apparatus for droplet deposition
GB202303633D0 (en) Vapour deposition apparatus and method