GB2578568A - Compliant conductive device - Google Patents
Compliant conductive device Download PDFInfo
- Publication number
- GB2578568A GB2578568A GB1815446.8A GB201815446A GB2578568A GB 2578568 A GB2578568 A GB 2578568A GB 201815446 A GB201815446 A GB 201815446A GB 2578568 A GB2578568 A GB 2578568A
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- GB
- United Kingdom
- Prior art keywords
- substrate
- polymer base
- layer
- flexible device
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 30
- 229920000052 poly(p-xylylene) Polymers 0.000 claims abstract description 24
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 16
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims abstract description 16
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 16
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims abstract description 14
- 239000010931 gold Substances 0.000 claims abstract description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052737 gold Inorganic materials 0.000 claims abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000001301 oxygen Substances 0.000 claims abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 3
- 229920000642 polymer Polymers 0.000 claims description 42
- 239000010410 layer Substances 0.000 claims description 39
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- -1 polyethylene Polymers 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000002033 PVDF binder Substances 0.000 claims description 3
- 239000004697 Polyetherimide Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 229920002873 Polyethylenimine Polymers 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 229920003231 aliphatic polyamide Polymers 0.000 claims description 3
- 229920001903 high density polyethylene Polymers 0.000 claims description 3
- 239000004700 high-density polyethylene Substances 0.000 claims description 3
- 229920001684 low density polyethylene Polymers 0.000 claims description 3
- 239000004702 low-density polyethylene Substances 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 229920001896 polybutyrate Polymers 0.000 claims description 3
- 229920001601 polyetherimide Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 3
- 229920006012 semi-aromatic polyamide Polymers 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims 2
- LNYIYOTVCVLDST-UHFFFAOYSA-N 3-amino-6-chloro-n-(diaminomethylidene)-5-[methyl(propan-2-yl)amino]pyrazine-2-carboxamide Chemical compound CC(C)N(C)C1=NC(N)=C(C(=O)N=C(N)N)N=C1Cl LNYIYOTVCVLDST-UHFFFAOYSA-N 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000678 plasma activation Methods 0.000 description 2
- VRBFTYUMFJWSJY-UHFFFAOYSA-N 28804-46-8 Chemical compound ClC1CC(C=C2)=CC=C2C(Cl)CC2=CC=C1C=C2 VRBFTYUMFJWSJY-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
A polymeric substrate (eg PDMS) is attached to a poly-para-xylylene layer (eg parylene) and a conductive layer (eg a gold electrode) is attached to the parylene layer to form a laminate structure. The polymeric substrate surface and the poly-para-xylylene surface may be exposed to an oxygen plasma to enhance the bond strength between the layers of the laminate. The laminate may form a flexible electronic device such as a sensor for soft robotic applications.
Description
Compliant Conductive Device
FIELD OF THE INVENTION
This invention pertains generally to the field of compliant and flexible conductive and electronic devices, to substrates for use in making flexible conductive and electronic devices, to their use as force sensors and to methods of manufacture.
BACKGROUND OF THE INVENTION
There is considerable development in the field of flexible electronic devices. There remain some significant difficulties, particularly as regards the development of flexible conductive devices that are required to be conformable, such as sensors for soft robotic applications.
Devices having a conductive layer or patterned conductive layer on a polymer substrate suitable for a flexible application tend to suffer from cracking on flexing of the device or thermal expansion and contraction. This results in short lifetimes and/or inconsistent function.
PROBLEM TO BE SOLVED BY THE INVENTION
There is a need for improvements in flexible and conformable conductive devices, for example for use as force sensors.
It is an object of this invention to provide a substrate for use in the manufacture of a flexible conductive device which is durable and effective.
It is an object of this invention to provide a flexible conductive device which has a long lifetime and does not become irreparably damaged during normal use.
SUMMARY OF THE INVENTION
In accordance with a first aspect of the invention, there is provided a flexible conductive or electronic device comprising: a polymer base; a poly-para-xylylene layer which is bonded to the polymer base by a first adhesive layer; and a -1 -conductive layer which is bonded to the poly-para-xylylene layer by a second adhesive layer.
In a second aspect of the invention, there is provided a substrate for use in the manufacture of a flexible conductive or electronic device, the substrate comprising: a polymer base; and a poly-para-xylylene layer which is bonded to the polymer base by a first adhesive layer.
ADVANTAGES OF THE INVENTION
The conductive device of the invention provides a flexible and even conformable substrate and a conductive, typically patterned, layer for a functional use such as a force sensor that is robust, survives flexing and thermal expansion and may be incorporated into other substrates for use.
DETAILED DESCRIPTION OF THE INVENTION
The invention provides for an improved flexible conductive or electronic device and to a substrate for making such a device. The substrate according to one aspect comprises a polymer base and a poly-para-xylylene layer which is bonded to the polymer base by a first adhesive layer. Preferably a second adhesive layer is disposed on the poly-para-xylylene layer on the side opposing the side bonded to the polymer base. The flexible conductive device according to another aspect comprises the substrate above having a conductive layer (e.g. a patterned conductive layer) disposed thereon and bonded thereto by a second adhesive layer.
Preferably, the device and substrate are conformable.
The polymer base may be of any suitable base and may comprise one or more of PDMS, PI, polybutyrate, polycarbonate, PI'vIMA, am/ate, polyethylene, HDPE, LDPE, PET, TPU, polyurethane, PVC, PEI,PEN, PP, polystyrene, aliphatic or semi-aromatic polyamide, PTFE, PVDF or a blend thereof.
The polymer base preferably comprises a polymer and more preferably is a polymer having a Young's modulus of up to 5 GPa (e.g. polyimide -2 -being around 4 GPa), preferably up to 1 GPa and more preferably is a flexible material, e.g. having a Young's modulus of up to 1.5 MPa, more preferably up to 1.2 MPa, still more preferably up to 1 MPa and preferably at least 500 kPa, such as in the range 700 kPa to 1 MPa, e.g. 700 to 800 kPa.
Preferably, the polymer base comprises or is PDMS and/or PI (polyimide), more preferably PDMS (polydimethyl siloxane).
The polymer base may be of any suitable thickness but is preferably thin enough to achieve the desired flexibility or conformity. The polymer base may, for example, be in the range 0.5 to 200 pm. For example, the polymer base may be TPU having a thickness of 20 to 50 pm, or a polyimide having a thickness of 8 to 50 pm or a PET having a thickness of 0.5 to 50 pm.
Preferably, the polymer base, which is preferably PDMS, has a thickness of up to 1.5 mm, more preferably from 60 to 400 pm, still more preferably from 65 to 240 pm, such as from 80 to 170 pm, more preferably 85 to 110 pm. Alternatively, the polymer base (preferably PDMS) has a thickness in the range 135 to 155 pm.
The first adhesive layer and second adhesive layer can each be any suitable adhesive. This may be an adhesive layer created by plasma activation (e.g. Ar and/or 02 plasma activation) of the polymer. This has previously been done with PDMS (see, for example, Park, D., Shin, S. J., & Oh, T. S. (2017). Stretchable Characteristics of Thin Au Film on Polydimethylsiloxane Substrate with Parylene Intermediate Layer for Stretchable Electronic Packaging. Journal of Electronic Materials, 47(1), 9-17. https://doi.org/10.1007/s11664-017-5722-3) or may be a click chemistry bonding material.
The first adhesive layer and/or the second adhesive layer is preferably an 0, plasma activated surface. The reactive species generated by the 0, plasma attack the surface of the polymers, temporarily forming reactive bonds across their surface that easily bond to other polymers and metals. These bonds may include, but are not limited to, carbonyl groups, hydroxide groups, and other oxygen containing chain ends. In the case of PDMS this a SiO, silica-like layer may -3 -form underneath this reactive layer, as the reactive species attacks the siloxane backbone.
Preferably, the poly-para-xylylene layer is a parylene layer, more preferably a parylene-C layer.
The poly-para-xylylene layer preferably has a thickness in the range nm to 10 pm. It may comprise a single layer of poly-para-xylylene or a plurality of two or more layers of poly-para-xylylene bonded together, e.g. 3 layers of from 20 to 100 nm bonded by an adhesive such as the 0, plasma-derived adhesive referred to above. Preferably, the poly-para-xylylene layer has a thickness in the range 50 nm to 500 nm.
In the conductive device of the invention, the conductive layer may comprise a graphene, a graphite, a metal oxide, a metal alloy or a metal, which is preferably patterned as required (e.g. by screen printing, photolithography or shadow masking application techiniques).
The conductive layer preferably comprises a metal selected from one or more of zinc, aluminium, copper, gold, silver, platinum, chromium, tungsten or titanium. More preferably, the conductive layer comprises gold.
The conductive layer has a thickness of from 20 nm to 250 nm, preferably 50 nm to 150 nm.
The substrate and device as described herein may be manufactured by any suitable method known in the art.
The invention has been described with reference to a preferred embodiment. However, it will be appreciated that variations and modifications can be effected by a person of ordinary skill in the art without departing from the scope of the invention. -4 -
Claims (29)
- CLAIMS: 1. A flexible conductive or electronic device comprising: a polymer base; a poly-para-xylylene layer which is bonded to the polymer base by a first adhesive layer; and a conductive layer which is bonded to the poly-para-xylylene layer by a second adhesive layer.
- 2. A flexible device as claimed in claim 1, which is a conformable device.
- 3. A flexible device as claimed in claim 1 or claim 2, wherein the polymer base has a thickness of from 80 to 170 p.m.
- 4. A flexible device as claimed in claim 3, wherein the polymer base has a thickness of from 85 to 110 p.m.
- 5. A flexible device as claimed in claim 3, wherein the polymer base has a thickness of from 135 to 155 pm.
- 6. A flexible device as claimed in any one of the preceding claims, wherein the conductive layer comprises a graphene, a graphite, a metal oxide, a metal alloy or a metal.
- 7. A flexible device as claimed in 6, wherein the conductive layer compriess a metal selected from one or more of zinc, aluminium, copper, gold, silver, platinum, chromium, tungsten or titanium.
- 8. A flexible device as claimed in claim 7, wherein the conductive layer comprises gold. -5 -
- 9. A flexible device as claimed in any one of the preceding claims, wherein the conductive layer has a thickness of from 110 to 230 nm, preferably 125 to 225 nm, more preferably 130 to 180 nm.
- 10. A flexible device as claimed in any one of the preceding claims, wherein the polymer base comprises one or more of PDMS, PI, polybutyrate, PC, PMMA, acrylate, polyethylene, HDPE, LDPE, PET, TPU, polyurethane, PVC, PEI,PEN, PP, polystyrene, aliphatic or semi-aromatic polyamide, PTFE, PVDF or a blend thereof.
- 11. A flexible device as claimed in any one of preceding claims, wherein the polymer base comprises a polymer having a Young's modulus of up to 1.5 MPa.
- 12. A flexible device as claimed in any one of the preceding claims, wherein the polymer base has a Young's modulus of up to 1.5 MiPa.
- 13. A flexible device as claimed in any one of the preceding claims, wherein the polymer base comprises PDMS and/or PI.
- 14 A flexible device as claimed in any one of the preceding claims, wherein the polymer base comprises PDMS.
- 15. A flexible device as claimed in any one of the preceding claims, wherein the poly-para-xylylene layer is a parylene layer.
- 16. A flexible device as claimed in any one of the preceding claims, wherein the adhesive layer comprises adhesion with oxygen plasma.
- 17. A substrate for use in the manufacture of a flexible conductive or electronic device, the substrate comprising: a polymer base; and -6 -a poly-para-xylylene layer which is bonded to the polymer base by a first adhesive layer.
- 18. A substrate as claimed in claim 17, which further comprises disposed on the poly-para xylylene layer a second adhesive layer.
- 19. A substrate as claimed in claim 17 or claim 18, wherein the substrate is for use in manufacturing a flexible conductive or electronic device by deposition of a metal or metal oxide layer by shadow mask deposition.
- 20. A substrate as claimed in any one of claims 17 to 19, which is a conformable substrate.
- 21. A substrate as claimed in any one of claims 17 to 20, wherein the polymer base has a thickness of from 80 to 170 gm.
- 22. A substrate as claimed in claim 21, wherein the polymer base has a thickness of from 85 to 110 pm.
- 23. A substrate as claimed in claim 21, wherein the polymer base has a thickness of from 135 to 155 pm
- 24. A substrate as claimed in any one of claims 17 to 23, wherein the polymer base comprises one or more of PDMS, PI, polybutyrate, PI PMMA, acrylate, polyethylene, HDPE, LDPE, PET, TPU, polyurethane, PVC, PEI,PEN, PP, polystyrene, aliphatic or semi-aromatic polyamide, PTTE, PVDF or a blend thereof.
- 25. A substrate as claimed in any one of claims 17 to 24, wherein the polymer 30 base comprises a polymer having a Young's modulus of up to 1.5 MPa. -7 -
- 26. A substrate as claimed in any one of claims 17 to 25, wherein the polymer base has a Young's modulus of up to 1.5 MPa.
- 27. A substrate as claimed in any one of claims 17 to 26, wherein the polymer 5 base comprises PDMS and/or PI.
- 28. A substrate as claimed in any one of claims 17 to 27, wherein the polymer base comprises PDMS.
- 29. A substrate as claimed in any one of claims 17 to 28, wherein the poly-para-xylylene layer is a parylene layer. -8 -
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1815446.8A GB2578568A (en) | 2018-09-21 | 2018-09-21 | Compliant conductive device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1815446.8A GB2578568A (en) | 2018-09-21 | 2018-09-21 | Compliant conductive device |
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| Publication Number | Publication Date |
|---|---|
| GB201815446D0 GB201815446D0 (en) | 2018-11-07 |
| GB2578568A true GB2578568A (en) | 2020-05-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1815446.8A Withdrawn GB2578568A (en) | 2018-09-21 | 2018-09-21 | Compliant conductive device |
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| Country | Link |
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| GB (1) | GB2578568A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2584825B (en) * | 2019-05-08 | 2021-12-01 | Wootzano Ltd | Substrates for electronic skins |
| GB2600420B (en) * | 2020-10-27 | 2023-03-01 | Wootzano Ltd | System and method for sorting and/or packing items |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170319092A1 (en) * | 2014-11-11 | 2017-11-09 | Braincare Oy | An implantable electrode device and a method for manufacturing thereof |
| GB2570857A (en) * | 2017-11-27 | 2019-08-14 | Wootzano Ltd | Flexible conductive device |
-
2018
- 2018-09-21 GB GB1815446.8A patent/GB2578568A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170319092A1 (en) * | 2014-11-11 | 2017-11-09 | Braincare Oy | An implantable electrode device and a method for manufacturing thereof |
| GB2570857A (en) * | 2017-11-27 | 2019-08-14 | Wootzano Ltd | Flexible conductive device |
Non-Patent Citations (4)
| Title |
|---|
| 2012 IEEE 25th Conf MEMS, 29/1/2012, pages 247-250, "Fabrication of stretchable and flexible electrodes based on PDMS substrate" N Chou et al * |
| 2013 6th IEEE/EMBS Conf on neural engineering, 6/11/2013, pg 911-914, "Fabrication of flexible electrode array based on PDMS" J Jeong et al * |
| 2015 28th IEEE Conf MEMS, 18/1/2015, pages 467-469; "Bonding friendly PCPDMS: depositing parylene C into PDMS matrix at an elevated temperature" Y Liu et al * |
| 2016 Pan Pacific Microelectronics Symposium, "Formation of metal interconnects for stretchable packaging applications" D Park et al * |
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| GB201815446D0 (en) | 2018-11-07 |
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