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GB2576032B - Liquid cooled server module - Google Patents

Liquid cooled server module Download PDF

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Publication number
GB2576032B
GB2576032B GB1812595.5A GB201812595A GB2576032B GB 2576032 B GB2576032 B GB 2576032B GB 201812595 A GB201812595 A GB 201812595A GB 2576032 B GB2576032 B GB 2576032B
Authority
GB
United Kingdom
Prior art keywords
server module
liquid cooled
cooled server
liquid
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1812595.5A
Other versions
GB201812595D0 (en
GB2576032A (en
Inventor
Wilson Cathal
Baudin Nicolas
Cagnin Raphael
Robinson Anthony
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
College of the Holy and Undivided Trinity of Queen Elizabeth near Dublin
Original Assignee
College of the Holy and Undivided Trinity of Queen Elizabeth near Dublin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by College of the Holy and Undivided Trinity of Queen Elizabeth near Dublin filed Critical College of the Holy and Undivided Trinity of Queen Elizabeth near Dublin
Priority to GB1812595.5A priority Critical patent/GB2576032B/en
Publication of GB201812595D0 publication Critical patent/GB201812595D0/en
Priority to PCT/EP2019/070715 priority patent/WO2020025717A1/en
Publication of GB2576032A publication Critical patent/GB2576032A/en
Application granted granted Critical
Publication of GB2576032B publication Critical patent/GB2576032B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB1812595.5A 2018-08-02 2018-08-02 Liquid cooled server module Active GB2576032B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB1812595.5A GB2576032B (en) 2018-08-02 2018-08-02 Liquid cooled server module
PCT/EP2019/070715 WO2020025717A1 (en) 2018-08-02 2019-07-31 Liquid cooled server module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1812595.5A GB2576032B (en) 2018-08-02 2018-08-02 Liquid cooled server module

Publications (3)

Publication Number Publication Date
GB201812595D0 GB201812595D0 (en) 2018-09-19
GB2576032A GB2576032A (en) 2020-02-05
GB2576032B true GB2576032B (en) 2021-04-21

Family

ID=63518373

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1812595.5A Active GB2576032B (en) 2018-08-02 2018-08-02 Liquid cooled server module

Country Status (2)

Country Link
GB (1) GB2576032B (en)
WO (1) WO2020025717A1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11907759B2 (en) 2018-06-05 2024-02-20 Intel Corporation Technologies for providing predictive thermal management
US12035507B2 (en) 2020-07-09 2024-07-09 Intel Corporation Technologies for dynamic cooling in a multi-chip package with programmable impingement valves
US12131977B2 (en) 2019-08-06 2024-10-29 Intel Corporation Electronic systems with inverted circuit board with heat sink to chassis attachment
US12133357B2 (en) 2020-06-08 2024-10-29 Intel Corporation Cold plate architecture for liquid cooling of devices
US12169180B2 (en) 2020-12-23 2024-12-17 Intel Corporation Optical leak detection of liquid cooling components within an electronic system
US12248344B2 (en) 2021-03-26 2025-03-11 Intel Corporation Technologies for liquid cooling interfaces
US12262478B2 (en) 2021-09-13 2025-03-25 Intel Corporation Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systems
US12293956B2 (en) 2020-07-31 2025-05-06 Intel Corporation Boiling enhancement structures for immersion cooled electronic systems
US12309966B2 (en) 2021-06-30 2025-05-20 Intel Corporation Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force
US12453054B2 (en) 2022-02-18 2025-10-21 Intel Corporation Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass
US12501538B2 (en) 2023-03-14 2025-12-16 Intel Corporation Thermal solutions for cooling electronic devices

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11917790B2 (en) 2019-04-26 2024-02-27 Intel Corporation Thermal control for processor-based devices
US11678444B2 (en) 2019-05-15 2023-06-13 Intel Corporation Loading mechanism with integrated heatsink
CN111409414A (en) * 2020-03-19 2020-07-14 英业达科技有限公司 Liquid cooling seal box and case lid, on-vehicle cooling system thereof
US12082370B2 (en) 2020-06-03 2024-09-03 Intel Corporation System device aggregation in a liquid cooling environment
US12063759B2 (en) 2020-07-13 2024-08-13 Intel Corporation Conformable cold plate for fluid cooling applications
CN112650373A (en) * 2020-12-04 2021-04-13 中国船舶重工集团公司第七一六研究所 Heterogeneous liquid cooling server with semiconductor dehumidification device
US12442712B2 (en) 2020-12-23 2025-10-14 Intel Corporation Liquid cooling system leak detection improvements
US12191230B2 (en) 2021-03-26 2025-01-07 Intel Corporation Technologies for liquid cooling systems
US11792962B2 (en) 2021-05-05 2023-10-17 Microsoft Technology Licensing, Llc Systems and methods for immersion-cooled datacenters
US12279395B2 (en) 2021-09-14 2025-04-15 Intel Corporation Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention
TWI833311B (en) 2022-08-02 2024-02-21 緯創資通股份有限公司 Immersion cooling unit and electronic apparatus
FR3146728A1 (en) * 2023-03-14 2024-09-20 Valeo Systemes Thermiques Heat exchanger for an electronic component cooling system

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090262495A1 (en) * 2008-04-16 2009-10-22 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
US20110303394A1 (en) * 2010-08-26 2011-12-15 Asetek A/S Liquid cooling system for a server
US20130284618A1 (en) * 2012-04-27 2013-10-31 Hon Hai Precision Industry Co., Ltd. Container data center
US20140096930A1 (en) * 2012-10-10 2014-04-10 International Business Machines Corporation Facilitating fluid level sensing
US20150021000A1 (en) * 2013-07-16 2015-01-22 Lsis Co., Ltd. Cabinet for power electronic apparatus
US20150062806A1 (en) * 2013-02-01 2015-03-05 Dell Products L.P. Immersion Server, Immersion Server Drawer, and Rack-Mountable Immersion Server Drawer-Based Cabinet
US20150109730A1 (en) * 2013-10-21 2015-04-23 International Business Machines Corporation Direct coolant contact vapor condensing
US20150373882A1 (en) * 2014-06-24 2015-12-24 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US20170031393A1 (en) * 2015-07-30 2017-02-02 Dell Products L.P. Chassis external wall liquid cooling system

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090262495A1 (en) * 2008-04-16 2009-10-22 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
US20110303394A1 (en) * 2010-08-26 2011-12-15 Asetek A/S Liquid cooling system for a server
US20130284618A1 (en) * 2012-04-27 2013-10-31 Hon Hai Precision Industry Co., Ltd. Container data center
US20140096930A1 (en) * 2012-10-10 2014-04-10 International Business Machines Corporation Facilitating fluid level sensing
US20150062806A1 (en) * 2013-02-01 2015-03-05 Dell Products L.P. Immersion Server, Immersion Server Drawer, and Rack-Mountable Immersion Server Drawer-Based Cabinet
US20150021000A1 (en) * 2013-07-16 2015-01-22 Lsis Co., Ltd. Cabinet for power electronic apparatus
US20150109730A1 (en) * 2013-10-21 2015-04-23 International Business Machines Corporation Direct coolant contact vapor condensing
US20150373882A1 (en) * 2014-06-24 2015-12-24 David Lane Smith System and method for fluid cooling of electronic devices installed in a sealed enclosure
US20170031393A1 (en) * 2015-07-30 2017-02-02 Dell Products L.P. Chassis external wall liquid cooling system

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11907759B2 (en) 2018-06-05 2024-02-20 Intel Corporation Technologies for providing predictive thermal management
US12131977B2 (en) 2019-08-06 2024-10-29 Intel Corporation Electronic systems with inverted circuit board with heat sink to chassis attachment
US12133357B2 (en) 2020-06-08 2024-10-29 Intel Corporation Cold plate architecture for liquid cooling of devices
US12035507B2 (en) 2020-07-09 2024-07-09 Intel Corporation Technologies for dynamic cooling in a multi-chip package with programmable impingement valves
US12293956B2 (en) 2020-07-31 2025-05-06 Intel Corporation Boiling enhancement structures for immersion cooled electronic systems
US12169180B2 (en) 2020-12-23 2024-12-17 Intel Corporation Optical leak detection of liquid cooling components within an electronic system
US12248344B2 (en) 2021-03-26 2025-03-11 Intel Corporation Technologies for liquid cooling interfaces
US12309966B2 (en) 2021-06-30 2025-05-20 Intel Corporation Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force
US12262478B2 (en) 2021-09-13 2025-03-25 Intel Corporation Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systems
US12453054B2 (en) 2022-02-18 2025-10-21 Intel Corporation Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass
US12501538B2 (en) 2023-03-14 2025-12-16 Intel Corporation Thermal solutions for cooling electronic devices
US12504799B2 (en) 2024-06-26 2025-12-23 Intel Corporation Flexible and modular top and bottom side processor unit module cooling

Also Published As

Publication number Publication date
GB201812595D0 (en) 2018-09-19
GB2576032A (en) 2020-02-05
WO2020025717A1 (en) 2020-02-06

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