GB2366612A - Heat dissipating apparatus for spacecraft using heat pipes - Google Patents
Heat dissipating apparatus for spacecraft using heat pipes Download PDFInfo
- Publication number
- GB2366612A GB2366612A GB0117434A GB0117434A GB2366612A GB 2366612 A GB2366612 A GB 2366612A GB 0117434 A GB0117434 A GB 0117434A GB 0117434 A GB0117434 A GB 0117434A GB 2366612 A GB2366612 A GB 2366612A
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat
- heat pipes
- faceskins
- outer panel
- spacecraft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000012530 fluid Substances 0.000 claims abstract description 14
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims abstract description 9
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims abstract description 9
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000001273 butane Substances 0.000 claims abstract description 3
- 239000011159 matrix material Substances 0.000 claims abstract description 3
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 238000013459 approach Methods 0.000 description 2
- IHPYMWDTONKSCO-UHFFFAOYSA-N 2,2'-piperazine-1,4-diylbisethanesulfonic acid Chemical compound OS(=O)(=O)CCN1CCN(CCS(O)(=O)=O)CC1 IHPYMWDTONKSCO-UHFFFAOYSA-N 0.000 description 1
- 239000007990 PIPES buffer Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/10—Liquid materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
- B64G1/506—Heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
- B64G1/503—Radiator panels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Sustainable Development (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Environmental Sciences (AREA)
- Remote Sensing (AREA)
- Biodiversity & Conservation Biology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
A heat dissipating apparatus 10 for use in a spacecraft comprises first and second radiator panels 11a, 11b and one or more heat pipes 14, 15 coupled to the first and second radiator panels 11a, 11b that contain a working fluid. The working fluid may comprise a selected one of: toluene, methanol, butane, water, heptane or pentane. The one or more heat pipes 14, 15 may comprise first and second heat pipe networks 13 including first and second sets of heat pipes arranged as a matrix and which are in thermal communication. The first and second radiator panels 11a, 11b may each comprise inner and outer faceskins 17, 18 wherein the one or more heat pipes 14, 15 are embedded between the inner and outer panel faceskins 17, 18 and a honeycomb core 24 disposed between the inner and outer panel faceskins 17, 18 surround the heat pipes 14, 15. The honeycomb core 24 thermally and structurally bridges the heat pipe networks 13 to the opposing faceskin 17, 18.
Description
2366612 SPACECRAFT HEAT DISSIPATING APPARATUS USING HEAT PIPES CONTAINING
A MEDIUM TEMPERATURE WORKING FLUID The present invention relates generally to satellites or spacecraft, and more 5 specifically, to heat dissipating apparatus comprising a spacecraft or satellite radiator system that employs a heat pipe network containing a medium temperature working fluid.
The assignee of the present invention manufactures and deploys spacecraft or satellites into geosynchronous and -low earth orbits. Such spacecraft have heat pipes lo that are used to dissipate heat from heat generating components and subsystems. The heat pipes transfer thermal energy from the heat generating components and subsystems to spacecraft radiator panels from which it is radiated into space. For reference purposes, conventional spacecraft radiator panels are disclosed in U.S.
Patent No. 3,749,156 issued to Fletcher, U.S. Patent No. 5,351,746 issued to Mackey, 15 and U.S. Patent No. 5,806,803 issued to Wafts, for example.
Ammonia heat pipes have been extensively used on prior art spacecraft to distribute and transfer heat from heat sources. such as the power bus and RF equipment, for example, that operate at relatively low temperatures, typically in the range from -200C to +70C. To dissipate heat derived from heat sources that operate 2o above this temperature, typically in the +800C to +1800C temperature range, which is above the operating regime of conventional ammonia heat pipes, prior art solutions used massive heat sinks. Such massive heat sinks add unnecessary weight to the spacecraft and are also relatively inefficient.
25 The present invention seeks to provide heat dissipating apparatus for use in a spacecraft or satellite. According to a first aspect of the present invention, there is provided a heat dissipating apparatus for use in a spacecraft, comprising: first and second radiator panels; and one or more heat pipes coupled to the first and second radiator panels that contain a medium temperature working fluid. The heat dissipating 3o apparatus comprises a network of (one or more) heat pipes containing a medium temperature working fluid, such as toluene, for example. The heat dissipating apparatus comprising the network of medium temperature working fluid, toluene-based heat pipes efficiently dissipates heat derived from heat sources that operate at relatively high operating temperatures, typically in the +800C to + 1800C temperature range.
The network of toluene-based heat pipes dissipates heat to spacecraft radiator panels which radiate the heat into space. The network of toluenebased heat pipes 5 efficiently dissipates heat generated by equipment whose operating temperatures are above the operating temperature regime of conventional ammonia heat pipes.
The network of toluene-based heat pipes provided by the present invention has never before been used in spacecraft applications. The present invention provides for a significant mass savings over conventional heat sink approaches.
10 The present invention thus uses heat pipes containing the medium temperature working fluid to distribute and transfer heat derived from equipment that operates at relatively high temperatures, typically in the range from +80C to + 180C. By dissipating heat from equipment that operates at these higher temperatures using the toluene-based heat pipes, heat rejection from spacecraft surfaces via radiative heat 15 transfer into space is significantly improved and is significantly more efficient.
The various features and advantages of the present invention may be more readily understood with reference to the following detailed description taken in conjunction with the accompanying drawing, wherein like reference numerals designate 20 like structural elements, and in which:
Fig. 1 illustrates heat dissipating apparatus in accordance with the principles of the present invention comprising an exemplary spacecraft radiator system disposed on a typical three-axis body-stabilized spacecraft or satellite; and Fig. 2 illustrates details of an exemplary embodiment of the heat dissipating 25 apparatus of the present invention.
Referring to the drawing figures, Fig. 1 illustrates heat dissipating apparatus 10 in accordance with the principles of the present invention comprising an exemplary spacecraft radiator system 10 employed in a typical three-axis body- stabilized 30 spacecraft 30 or satellite 30. The exemplary heat dissipating apparatus 10 or spacecraft radiator system 10 comprises first and second radiator panels 11 a, 11 b that each include one or more heat pipes 14, 15 that form a heat pipe network 13. The locations of the radiator panels I I a, 11 b are exemplary, an may be located on any surface of the spacecraft 30. For example, the radiator panels 11 a, 11 b may be located on east and west, north and south and/or aft and earth sides or surfaces of the spacecraft 30.
In a first embodiment of the present invention illustrated in Fig. 1, the heat pipe network 13 is embedded between inner and outer panel faceskins 17, 18 of the 5 respective radiator panels 11 a, 11 b. A honeycomb core 24 is disposed between the inner and outer panel faceskins 17, 18 and surrounds the respective heat pipe networks 13 that are embedded therebetween. The -honeycomb core 24 thermally and structurally bridges the heat pipe networks 13 to the opposing faceskin 17, 18.
Each heat pipe network 13 comprises first and second heat pipes 14, 15, or first lo and second sets of heat pipes 14, 15, arranged as a matrix, for example, and which are in thermal communication. The first set of heat pipes 14 (or lateral heat pipes 14) are roughly perpendicular to the second set of heat pipes 15 (or header heat pipes-715). In the first embodiment, heat dissipating equipment 25 is mounted adjacent to the first set of lateral heat pipes 14 on the inner panel faceskins 17 of the first and second radiator 15 panels 11 a, 11 b. The second set of header heat pipes 15 is used to efficiently distribute the heat derived from the heat dissipating equipment 25 to the respective outer panel faceskins 18.
Fig. 2 illustrates details of an exemplary second embodiment of the heat dissipating apparatus 10 of the present invention. In the second embodiment, and as is 20 shown in Fig. 2, the heat pipe network 13 is secured to an outer surface of the radiator panels Ila, llb. In the second embodiment, the heat dissipating equipment 25 is secured to an inner surface of the radiator panels Ila, llb (the rear surface of the radiator panel 11 a shown in Fig. 2).
The heat pipe networks 13 contain a medium temperature working fluid, such as 25 toluene, for example. Other examples of the medium temperature working fluid include methanol, water, butane, heptane and pentane, for example. The heat dissipating apparatus 10 comprising the medium temperature working fluid, toluene-based heat pipe networks 13 efficiently dissipates heat derived from the heat dissipating equipment 25. The heat dissipating equipment 25 comprise heat sources that operate at relatively 30 high operating temperatures, typically in the +800C to + 180C temperature range.
The toluene-based h heat pipe networks 13 dissipates heat to the outer panel faceskin 18 of the radiator panels 11 a, 11 b, which in turn radiate the heat into space.
The toluene-based heat pipe networks 13 thus efficiently dissipates heat generated by equipment 25 whose operating temperatures are above the operating temperature regime of conventional ammonia heat pipes.
The present invention provides for a significant mass savings over conventional heat sink approaches using the massive heat sinks discussed in the Background
5 section. Also, by using the toluene-based heat pipe networks 13, the present invention is able to dissipate heat derived from equipment 25 that operates at higher temperatures compared with conventional heat pipe systems. Consequently, heat rejection from spacecraft surfaces via radiative heat transfer into space is improved and is significantly more efficient.
10 Thus, heat dissipating apparatus comprising a spacecraft or satellite radiator system that employs a heat pipe network containing a medium temperature working fluid has been disclosed.
Claims (13)
1. A heat dissipating apparatus for use in a spacecraft, comprising:
first and second radiator panels; and 5 one or more heat pipes, coupled to the first and second radiator panels that contain a medium temperature working fluid.
2. An apparatus according to Claim 1, wherein the medium temperature working fluid comprises a selected one of: toluene, methanol, butane, water, heptane or 10 pentane.
3. An apparatus according to Claim I or 2, further comprising heat dissipating equipment thermally coupled to the heat pipes.
15
4. An apparatus according to Claim 1, 2 or 3, wherein the one or more heat pipes comprise first and second heat pipe networks including first and second sets of heat pipes arranged as a matrix and which are in thermal communication.
5. An apparatus according to Claim 4, wherein the first set of heat pipes are 20 generally perpendicular to the second set of heat pipes.
6. An apparatus according to any preceding Claim, wherein the first and second radiator panels each comprise:
inner and outer panel faceskins; 25 wherein the one or more heat pipes are embedded between the inner and outer panel faceskins; and a honeycomb core disposed between the inner and outer panel faceskins that surround the heat pipes.
30
7. An apparatus according to any of Claims 1 to 6, wherein the first and second radiator panels each comprise:
inner and outer panel faceskins; a honeycomb core disposed between the inner and outer panel faceskins; and wherein the one or more heat pipes are mounted on a selected one of the inner and outer panel faceskins.
5
8. An apparatus according to any preceding Claim, comprising a plurality of heat pipes coupled to the respective radiator panels.
9. An apparatus according to Claim 8, wherein the plurality of heat pipes are disposed between the inner and outer panels.
10. An apparatus according to Claim 8, wherein the plurality of heat pipes are mounted on selected ones of the inner and outer panels.
11. An apparatus according to Claim 6, wherein the honeycomb core thermally 15 and structurally bridges the heat pipe networks to opposing faceskin.
12. An apparatus according to Claim 6, further comprising heat dissipating equipment thermally coupled to inner surfaces of the inner and outer panel faceskins.
20
13. An apparatus according to any preceding Claim, wherein the heat dissipating equipment operates at temperatures between +800C to + 180'OC.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62415000A | 2000-07-24 | 2000-07-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB0117434D0 GB0117434D0 (en) | 2001-09-12 |
| GB2366612A true GB2366612A (en) | 2002-03-13 |
Family
ID=24500842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0117434A Withdrawn GB2366612A (en) | 2000-07-24 | 2001-07-18 | Heat dissipating apparatus for spacecraft using heat pipes |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2002046700A (en) |
| FR (1) | FR2811963A1 (en) |
| GB (1) | GB2366612A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8096512B2 (en) | 2004-02-19 | 2012-01-17 | Astrium Limited | Payload modules |
| RU2463219C1 (en) * | 2011-04-26 | 2012-10-10 | Открытое акционерное общество "Военно-промышленная корпорация "Научно-производственное объединение машиностроения" | Space vehicle |
| RU2520811C1 (en) * | 2013-03-29 | 2014-06-27 | Открытое акционерное общество "Военно-промышленная корпорация "Научно-производственное объединение машиностроения" | Spacecraft |
| RU196175U1 (en) * | 2019-10-16 | 2020-02-19 | Акционерное общество «Информационные спутниковые системы» имени академика М.Ф. Решетнёва» | Spacecraft heat transfer panel |
| RU2763353C1 (en) * | 2020-12-22 | 2021-12-28 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Сибирский государственный университет науки и технологий имени академика М.Ф. Решетнева" (СибГУ им. М.Ф. Решетнева) | Heat transfer panel of a space vehicle |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2839040A1 (en) * | 2002-04-30 | 2003-10-31 | Cit Alcatel | ELECTRIC POWER RETURN DEVICE FOR SATELLITE |
| FR2945515B1 (en) * | 2009-05-12 | 2012-06-01 | Astrium Sas | SYSTEM COMPRISING A MOTHER SPACE PROBE FORMING CARRIER SPACE VEHICLE AND A PLURALITY OF SPATIAL GIRL PROBES |
| KR101425616B1 (en) * | 2012-12-17 | 2014-08-01 | 한국항공우주연구원 | Optical sensor module for geostationary satellite |
| WO2016193618A1 (en) * | 2015-06-02 | 2016-12-08 | Airbus Defence And Space Sas | Artificial satellite |
| CN110514051A (en) * | 2019-09-23 | 2019-11-29 | 中国科学院微小卫星创新研究院 | High power density single machine fluid circuit radiator on a kind of star |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5332030A (en) * | 1992-06-25 | 1994-07-26 | Space Systems/Loral, Inc. | Multi-directional cooler |
| US5372183A (en) * | 1991-08-22 | 1994-12-13 | Strickberger; Harold P. | Thermal control arrangements for a geosynchronous spacecraft |
| US5506032A (en) * | 1994-04-08 | 1996-04-09 | Martin Marietta Corporation | Structural panel having integral heat pipe network |
| EP0776827A1 (en) * | 1995-11-30 | 1997-06-04 | HE HOLDINGS, INC. dba HUGHES ELECTRONICS | Heat pipe network |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3749156A (en) | 1972-04-17 | 1973-07-31 | E Powers | Thermal control system for a spacecraft modular housing |
| US5351746A (en) | 1992-09-21 | 1994-10-04 | General Electric Co. | Spacecraft thermal panels & make-break thermal joints |
-
2001
- 2001-06-12 JP JP2001176654A patent/JP2002046700A/en active Pending
- 2001-06-19 FR FR0108054A patent/FR2811963A1/en not_active Withdrawn
- 2001-07-18 GB GB0117434A patent/GB2366612A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5372183A (en) * | 1991-08-22 | 1994-12-13 | Strickberger; Harold P. | Thermal control arrangements for a geosynchronous spacecraft |
| US5332030A (en) * | 1992-06-25 | 1994-07-26 | Space Systems/Loral, Inc. | Multi-directional cooler |
| US5506032A (en) * | 1994-04-08 | 1996-04-09 | Martin Marietta Corporation | Structural panel having integral heat pipe network |
| EP0776827A1 (en) * | 1995-11-30 | 1997-06-04 | HE HOLDINGS, INC. dba HUGHES ELECTRONICS | Heat pipe network |
Non-Patent Citations (4)
| Title |
|---|
| Online (PAJ) abstract for JP070218162 A * |
| Online (PAJ) abstract for JP550060182 A * |
| Online (PAJ) abstract for JP580122980 A * |
| Online (WPI) abstract for DE003909105 A * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8096512B2 (en) | 2004-02-19 | 2012-01-17 | Astrium Limited | Payload modules |
| RU2463219C1 (en) * | 2011-04-26 | 2012-10-10 | Открытое акционерное общество "Военно-промышленная корпорация "Научно-производственное объединение машиностроения" | Space vehicle |
| RU2520811C1 (en) * | 2013-03-29 | 2014-06-27 | Открытое акционерное общество "Военно-промышленная корпорация "Научно-производственное объединение машиностроения" | Spacecraft |
| RU196175U1 (en) * | 2019-10-16 | 2020-02-19 | Акционерное общество «Информационные спутниковые системы» имени академика М.Ф. Решетнёва» | Spacecraft heat transfer panel |
| RU2763353C1 (en) * | 2020-12-22 | 2021-12-28 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Сибирский государственный университет науки и технологий имени академика М.Ф. Решетнева" (СибГУ им. М.Ф. Решетнева) | Heat transfer panel of a space vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0117434D0 (en) | 2001-09-12 |
| FR2811963A1 (en) | 2002-01-25 |
| JP2002046700A (en) | 2002-02-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |