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GB2362515B - Connection of a junction to an electrical conductor track on a plate - Google Patents

Connection of a junction to an electrical conductor track on a plate

Info

Publication number
GB2362515B
GB2362515B GB0108435A GB0108435A GB2362515B GB 2362515 B GB2362515 B GB 2362515B GB 0108435 A GB0108435 A GB 0108435A GB 0108435 A GB0108435 A GB 0108435A GB 2362515 B GB2362515 B GB 2362515B
Authority
GB
United Kingdom
Prior art keywords
plate
conductor track
connection
junction
electrical conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0108435A
Other versions
GB2362515A (en
GB0108435D0 (en
Inventor
Roland Schnabel
Kurt Schaupert
Harry Engelmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss AG
Original Assignee
Carl Zeiss AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10018415A external-priority patent/DE10018415C1/en
Application filed by Carl Zeiss AG filed Critical Carl Zeiss AG
Publication of GB0108435D0 publication Critical patent/GB0108435D0/en
Publication of GB2362515A publication Critical patent/GB2362515A/en
Application granted granted Critical
Publication of GB2362515B publication Critical patent/GB2362515B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • H—ELECTRICITY
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
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    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Surface Heating Bodies (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

A connection of an electrical junction (13) to a conductor track (5) applied to a glass or glass ceramic plate (1) is to be resistant to temperature change and traction and conductive. For this purpose an electrically conductive connecting element (11) is ultrasonically welded to the composite consisting of the conductor track (5) and plate (1). The connecting element (11) extends to the terminal (13) which is fastened to the plate (1).
GB0108435A 2000-04-13 2001-04-04 Connection of a junction to an electrical conductor track on a plate Expired - Fee Related GB2362515B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10018415A DE10018415C1 (en) 2000-04-03 2000-04-13 Connection between sensor terminal and conductor path applied to glass plate uses conductive connection element ultrasonically welded to conductor path

Publications (3)

Publication Number Publication Date
GB0108435D0 GB0108435D0 (en) 2001-05-23
GB2362515A GB2362515A (en) 2001-11-21
GB2362515B true GB2362515B (en) 2003-09-24

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GB0108435A Expired - Fee Related GB2362515B (en) 2000-04-13 2001-04-04 Connection of a junction to an electrical conductor track on a plate

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FR (1) FR2807907B1 (en)
GB (1) GB2362515B (en)

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US4437604A (en) * 1982-03-15 1984-03-20 Kulicke & Soffa Industries, Inc. Method of making fine wire interconnections
EP0465173A1 (en) * 1990-06-28 1992-01-08 Aue Institute Limited Electronic circuit connectors and method of manufacturing same
EP0607929A2 (en) * 1993-01-19 1994-07-27 Canon Kabushiki Kaisha Flexible printed circuit board and ink jet recording head using the same
WO1996017405A1 (en) * 1994-11-26 1996-06-06 Phet Ireland Limited Electrical connection method

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GB2047476B (en) * 1979-02-26 1983-06-15 Secr Defence Applying circuit elements to a substrate
IL85008A0 (en) * 1987-01-21 1988-06-30 Hughes Aircraft Co Method for connecting leadless chip packages and articles
DE4022845A1 (en) * 1990-07-18 1992-01-23 Schott Glaswerke TEMPERATURE SENSOR OR SENSOR ARRANGEMENT MADE OF GLASS CERAMIC AND CONTACTING FILM RESISTORS
EP0518422B1 (en) * 1991-06-12 1995-09-06 Koninklijke Philips Electronics N.V. Method of selectively metallizing a pattern of a material other than glass on a glass substrate by electroless metallization
DE19707664C9 (en) * 1996-03-02 2008-04-17 AEG Hausgeräte GmbH Apparatus and method for controlling or regulating the temperature of heated surfaces
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330704A (en) * 1980-08-08 1982-05-18 Raychem Corporation Electrical devices comprising conductive polymers
US4437604A (en) * 1982-03-15 1984-03-20 Kulicke & Soffa Industries, Inc. Method of making fine wire interconnections
EP0465173A1 (en) * 1990-06-28 1992-01-08 Aue Institute Limited Electronic circuit connectors and method of manufacturing same
EP0607929A2 (en) * 1993-01-19 1994-07-27 Canon Kabushiki Kaisha Flexible printed circuit board and ink jet recording head using the same
WO1996017405A1 (en) * 1994-11-26 1996-06-06 Phet Ireland Limited Electrical connection method

Also Published As

Publication number Publication date
GB2362515A (en) 2001-11-21
FR2807907B1 (en) 2005-01-28
GB0108435D0 (en) 2001-05-23
FR2807907A1 (en) 2001-10-19

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