GB2103980A - Soldering components to a substrate - Google Patents
Soldering components to a substrate Download PDFInfo
- Publication number
- GB2103980A GB2103980A GB08125129A GB8125129A GB2103980A GB 2103980 A GB2103980 A GB 2103980A GB 08125129 A GB08125129 A GB 08125129A GB 8125129 A GB8125129 A GB 8125129A GB 2103980 A GB2103980 A GB 2103980A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solder
- substrate
- composition
- component
- bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 23
- 238000005476 soldering Methods 0.000 title claims description 7
- 229910000679 solder Inorganic materials 0.000 claims abstract description 41
- 239000000203 mixture Substances 0.000 claims abstract description 13
- 230000004907 flux Effects 0.000 claims abstract description 10
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 9
- 239000000956 alloy Substances 0.000 claims abstract description 9
- 239000011236 particulate material Substances 0.000 claims abstract description 9
- 239000007787 solid Substances 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 2
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 230000004927 fusion Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000012798 spherical particle Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000002939 deleterious effect Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A solder paste composition includes a particulate solder alloy, a flux, and a solid particulate material, e.g. copper, having a melting point higher than that of the solder alloy. Components (11) soldered to a substrate with the solder paste composition are spaced from the substrate by the solid particles (21) therebetween. This facilitates removal of flux residues from the space between the component and the substrate. <IMAGE>
Description
SPECIFICATION
Soldering components
This invention relates to the fabrication of circuits wherein components are soldered to a substrate.
There are a variety of electronic circuit constructions, for example film circuits, wherein individual components are soldered to a substrate.
The solder bonds provide the dual purpose of attaching the components to the substrate and of providing eiectrical connection to conductors disposed in the substrate. To effect soldering the interfaces between the substrate and the various components are treated with a paste comprising a particulate solder alloy and a flux. The assembly is heated to fuse the solder and effect the solder bond.
It will be appreciated that, as in any soldering process, there will be flux residues which, if not removed, will cause corrosion over an extended period. This produces degradation of the soldered joint with a consequent adverse effect on the electrical function of the circuit. Removal of these flux residues is difficult as, owing to the very small clearance between the individual components and the substrate on which they are mounted, they become trapped in a region where the effects of corrosion damage are most deleterious.
The object of the invention is to minimise or to overcome this disadvantage.
According to one aspect of the invention there is provided a solder composition comprising a particulate solder alloy, a flux, and a particulate material of higher melting point than the solder, said material being such that it does not reduce the integrity of a solder bond formed by fusion of the solder composition.
According to another aspect of the invention there is provided a method of soldering a component to a substrate, said method including forming a solder bond between the component and the substrate, and incorporating into said bond a solid particulate material whereby the component is spaced from the substrate, and wherein said material is of higher melting point than the solder and is such that is does not reduce the integrity of the solder bond.
An embodiment of the invention will now be described with reference to the accompanying drawings in which Figs. 1 and 2 are cross sec.ions of a component and substrate assembly respectively before and after formation of a solder bond therebetween.
Referring to Fig. 1, a component 1 1 having terminal contacts 12 is mounted on a substrate 1 3 provided with conductor tracks 14, e.g. of copper. A quantity of a solder paste 1 5 is disposed between each terminal contact 12 and the corresponding track 1 4. The solder paste comprises a particulate solder alloy. a flux which also provides the liquid vehicle of the composition, and a solid particulate material having a melting point higher than that of the working temperature of the solder. Typically the paste is applied to the substrate by a screen printing process and the component is placed in position on top of the paste.
Preferably the solid particulate material is in the form of spheres of a substantially uniform diameter. Typically we employ copper spheres having a diameter of 20 to 200 microns, but other conductive or non-conductive materials may be used, for example steel, glass or silica. The material may be in the form of spheres, powder, or short lengths of wire or fibre. It is of course necessary that the material does not interact to any deleterious extent with the solder.
It will be appreciated that if spherical particles are used this will facilitate movement of the components in any necessary adjustment to a fixed exact position on the substrate. In situations where such movement is not necessary then it is immaterial whether the particles are spherical or irregular. It is of course preferable that the particles should be of such a size that the paste can be applied by a screen printing process.
Solder bonding is effected by heating the assembly to fuse the solder. During this process the surface tension of the molten solder draws the component towards the bond and into abutment with the solid particles 21 (Fig. 2) which thus space the component a precisely defined distance from the substrate. We have also found that, where substantially spherical solid particles are used, the surface tension of the molten solder between the terminal contacts 1 2 and the respective conductor track 1 4 tends to orientate the component such that the contacts 12 and tracks 14 are brought into register thus correcting any slight misalignment of the component 11.
After the solder has cooled and solidified the assembly may be washed to remove flux residues.
As the component 11 is spaced from the substrate 13 by the particles 21 the risk of entrapment of flux residues between the component and the substrate is minimised.
The techniques described herein may be used in a variety of applications. Thus they may be employed not only in thin film and thick film circuit applications but also in the production of conventional printed circuits. The solder alloy will typically comprise a tin/lead alloy, but for certain specialised applications other solder alloys may of course be employed.
Claims (10)
1. A solder composition comprising a particulate solder alloy, a flux. and a particulate material of higher melting point that the solder.
said material being such that it does not reduce the integrity of a solder bond formed by fusion of the solder composition.
2. A composition as claimed in claim 1, whereto the particulate material comprises substantially spherical particles.
3. A composition as claimed in claim 2 wherein said spheres have a diameter of 20 to 200 microns.
4. A composition as claimed in claim 1. 2 or 3.
wherein the particulate material is copper, glass, silica, steel or mixtures thereof.
5. A composition as claimed in any one of claims 1 to 4, wherein said solder alloy is a tin/lead alloy.
6. A solder composition substantially as described herein with reference to the accompanying drawings.
7. A method of soldering a component to a substrate, said method including forming a solder bond between the component and the substrate, and incorporating into said bond a solid particulate material whereby the component is spaced from the substrate, and wherein said material is of higher melting point than the solder and is such that it does not reduce the integrity of the solder bond.
8. A method as claimed in claim 7, wherein said solder bond is devised from a solder paste applied by a screen printing process.
9. A method of soldering substantially as described herein with reference to the accompanying drawings.
10. A circuit arrangement incorporating components soldered by a method as claimed in claim 7, 8 or 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08125129A GB2103980B (en) | 1981-08-18 | 1981-08-18 | Soldering components to a substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08125129A GB2103980B (en) | 1981-08-18 | 1981-08-18 | Soldering components to a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2103980A true GB2103980A (en) | 1983-03-02 |
| GB2103980B GB2103980B (en) | 1986-01-22 |
Family
ID=10524003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08125129A Expired GB2103980B (en) | 1981-08-18 | 1981-08-18 | Soldering components to a substrate |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2103980B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0164906A1 (en) * | 1984-05-14 | 1985-12-18 | RAYCHEM CORPORATION (a Delaware corporation) | Solder composition |
| EP0259635A1 (en) * | 1986-09-05 | 1988-03-16 | Forschungszentrum Jülich Gmbh | Method for the production of thermally highly stressed cooling elements |
| EP0612577A1 (en) * | 1993-02-22 | 1994-08-31 | AT&T Corp. | Article comprising solder with improved mechical properties, and method of making the solder |
| WO1997035683A1 (en) * | 1996-03-22 | 1997-10-02 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Soldered metal honeycomb structures with spacers in the solder gaps and process and solder for its production |
| WO2004065050A3 (en) * | 2003-01-14 | 2004-09-30 | Molex Inc | Method and system for solder connecting electrical devices |
| WO2004107832A1 (en) * | 2003-05-22 | 2004-12-09 | Rf Micro Devices, Inc. | Solder filler |
| EP1009202A4 (en) * | 1997-06-04 | 2005-08-17 | Ibiden Co Ltd | SOLDERING ELEMENT FOR PRINTED PCB |
| EP1496733A3 (en) * | 2003-07-10 | 2007-03-28 | Delphi Technologies, Inc. | Electronic package having controlled height stand-off solder joint |
| GB2603488A (en) * | 2021-02-04 | 2022-08-10 | Rockwood Composites | A soldering compound |
-
1981
- 1981-08-18 GB GB08125129A patent/GB2103980B/en not_active Expired
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0164906A1 (en) * | 1984-05-14 | 1985-12-18 | RAYCHEM CORPORATION (a Delaware corporation) | Solder composition |
| EP0259635A1 (en) * | 1986-09-05 | 1988-03-16 | Forschungszentrum Jülich Gmbh | Method for the production of thermally highly stressed cooling elements |
| EP0612577A1 (en) * | 1993-02-22 | 1994-08-31 | AT&T Corp. | Article comprising solder with improved mechical properties, and method of making the solder |
| WO1997035683A1 (en) * | 1996-03-22 | 1997-10-02 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Soldered metal honeycomb structures with spacers in the solder gaps and process and solder for its production |
| JP2000507160A (en) * | 1996-03-22 | 2000-06-13 | エミテツク ゲゼルシヤフト フユア エミツシオンステクノロギー ミツト ベシユレンクテル ハフツング | Brazed metal honeycomb body with spacers in brazing gap, brazing method and brazing method for use |
| CN1081967C (en) * | 1996-03-22 | 2002-04-03 | 发射技术有限公司 | Soldered metal honeycomb structures with spacers in solder gaps and process and solder for its prodn. |
| EP1009202A4 (en) * | 1997-06-04 | 2005-08-17 | Ibiden Co Ltd | SOLDERING ELEMENT FOR PRINTED PCB |
| WO2004065050A3 (en) * | 2003-01-14 | 2004-09-30 | Molex Inc | Method and system for solder connecting electrical devices |
| WO2004107832A1 (en) * | 2003-05-22 | 2004-12-09 | Rf Micro Devices, Inc. | Solder filler |
| EP1496733A3 (en) * | 2003-07-10 | 2007-03-28 | Delphi Technologies, Inc. | Electronic package having controlled height stand-off solder joint |
| GB2603488A (en) * | 2021-02-04 | 2022-08-10 | Rockwood Composites | A soldering compound |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2103980B (en) | 1986-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |