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GB2177262B - Electrical circuits - Google Patents

Electrical circuits

Info

Publication number
GB2177262B
GB2177262B GB08516477A GB8516477A GB2177262B GB 2177262 B GB2177262 B GB 2177262B GB 08516477 A GB08516477 A GB 08516477A GB 8516477 A GB8516477 A GB 8516477A GB 2177262 B GB2177262 B GB 2177262B
Authority
GB
United Kingdom
Prior art keywords
electrical circuits
circuits
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08516477A
Other versions
GB2177262A (en
GB8516477D0 (en
Inventor
Martin Paul Mobberley
Maurice Lionel Apthorp
Maurice Clifford Heard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Company PLC
Original Assignee
General Electric Company PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Company PLC filed Critical General Electric Company PLC
Priority to GB08516477A priority Critical patent/GB2177262B/en
Publication of GB8516477D0 publication Critical patent/GB8516477D0/en
Publication of GB2177262A publication Critical patent/GB2177262A/en
Application granted granted Critical
Publication of GB2177262B publication Critical patent/GB2177262B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Methods (AREA)
GB08516477A 1985-06-28 1985-06-28 Electrical circuits Expired GB2177262B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08516477A GB2177262B (en) 1985-06-28 1985-06-28 Electrical circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08516477A GB2177262B (en) 1985-06-28 1985-06-28 Electrical circuits

Publications (3)

Publication Number Publication Date
GB8516477D0 GB8516477D0 (en) 1985-07-31
GB2177262A GB2177262A (en) 1987-01-14
GB2177262B true GB2177262B (en) 1988-08-10

Family

ID=10581518

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08516477A Expired GB2177262B (en) 1985-06-28 1985-06-28 Electrical circuits

Country Status (1)

Country Link
GB (1) GB2177262B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2614109A1 (en) * 1987-04-15 1988-10-21 Bleys Dominique ELECTRONIC ALARM LABEL
US4791006A (en) * 1987-06-04 1988-12-13 Avx Corporation High accuracy variable thickness laydown method for electronic components
FR2709038B1 (en) * 1993-08-10 1995-11-10 Leroux Gilles Sa Manufacturing process for plastic support, manufacturing device for such support and use of the process for manufacturing integrated circuit cards.
CA2224236A1 (en) * 1995-10-07 1997-04-17 Img Group Limited An electrical circuit component formed of a conductive liquid printed directly onto a substrate
TW340296B (en) 1997-02-21 1998-09-11 Ricoh Microelectronics Kk Method and apparatus of concave plate printing, method and apparatus for formation of wiring diagram, the contact electrode and the printed wiring nickel substrate
US6225205B1 (en) * 1998-01-22 2001-05-01 Ricoh Microelectronics Company, Ltd. Method of forming bump electrodes
US20040003734A1 (en) * 2002-07-02 2004-01-08 Shively J. Thomas Method and apparatus for printing using an electrically conductive ink

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB712865A (en) * 1951-03-15 1954-08-04 British Thomson Houston Co Ltd Improvements in and relating to a gravure printing method and apparatus therefor
GB715697A (en) * 1951-09-03 1954-09-22 Mccorquodale Colour Display Improvements in and relating to the production of printed electrical circuits and elements for use in electrical circuits
GB1196201A (en) * 1967-09-19 1970-06-24 Tokyo Shibaura Electric Co A method of Printing Electrical Circuits onto Substrates
US4479432A (en) * 1980-05-15 1984-10-30 Toppan Printing Co., Ltd. Thick film printing method
JPS597071A (en) * 1982-07-06 1984-01-14 Dainippon Screen Mfg Co Ltd Pin hole remover for printing

Also Published As

Publication number Publication date
GB2177262A (en) 1987-01-14
GB8516477D0 (en) 1985-07-31

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee