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GB1468974A - Manufacture of semiconductor devices - Google Patents

Manufacture of semiconductor devices

Info

Publication number
GB1468974A
GB1468974A GB3226974A GB3226974A GB1468974A GB 1468974 A GB1468974 A GB 1468974A GB 3226974 A GB3226974 A GB 3226974A GB 3226974 A GB3226974 A GB 3226974A GB 1468974 A GB1468974 A GB 1468974A
Authority
GB
United Kingdom
Prior art keywords
wire
conductor
bonding
spark
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3226974A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Priority to GB3226974A priority Critical patent/GB1468974A/en
Publication of GB1468974A publication Critical patent/GB1468974A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/22—Severing by resistance heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45015—Cross-sectional shape being circular
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
    • H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

1468974 Welding by pressure; spark erosion machines FERRANTI Ltd 24 May 1975 [20 July 1974] 32269/74 Headings B3R and B3V [Also in Division H1] In a method of wire bonding including bonding a wire 17, usually Au or Al, to a semiconductor device contact (e.g. of a transistor 10) and to another terminal (e.g. a conductor terminal 19), in either order, the wire is severed, either before or after the second bonding action, but after the bonding to the semi-conductor device, by an electric spark between two electrodes 30, 31 (Fig. 6), e.g. of tungsten wire, raised to the same potential but of opposite polarity such that at the point of severing, i.e. the centre of the spark the potential is zero, resulting in a negligible inadvertent current flow back into the semi-conductor. In operation, a ball 26 on the wire 17 is thermooompression bonded to a contact on the transistor 10, e.g. with ultrasonic vibrations, by a tungsten carbide nozzle 25 at 180‹ C. The nozzle is then indexed to a position above a Ag coating 28 of a terminal 19 of a conductor (15, Fig. 1, not shown) whereupon a second thermocompression bond is completed. The wire is then severed by the electric spark to produce two ball ends (26<SP>1</SP>, 33, Fig. 7, not shown) on the wire. The ball end (26<SP>1</SP>) adjacent the nozzle 25 may be used to restart the sequence. An electric circuit to produce the electric spark (Fig. 8, not shown) comprises a capacitor (36) and an pulse transformer.
GB3226974A 1975-05-23 1975-05-23 Manufacture of semiconductor devices Expired GB1468974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3226974A GB1468974A (en) 1975-05-23 1975-05-23 Manufacture of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3226974A GB1468974A (en) 1975-05-23 1975-05-23 Manufacture of semiconductor devices

Publications (1)

Publication Number Publication Date
GB1468974A true GB1468974A (en) 1977-03-30

Family

ID=10335986

Family Applications (1)

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GB3226974A Expired GB1468974A (en) 1975-05-23 1975-05-23 Manufacture of semiconductor devices

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2401522A1 (en) * 1977-07-26 1979-03-23 Welding Inst METHOD AND APPARATUS FOR FIXING ALUMINUM CONDUCTIVE WIRES
FR2493044A1 (en) * 1980-10-29 1982-04-30 Philips Nv METHOD FOR PROVIDING A WIRE CONNECTION
FR2522629A1 (en) * 1982-03-02 1983-09-09 Centre Nat Rech Scient Rough casting prehension and transfer system - uses moving arm with electrode at tip allowing current to pass between electrode and casting to create spot weld
GB2165178A (en) * 1984-10-05 1986-04-09 Hitachi Ltd Method and apparatus for wire bonding
EP0133118A3 (en) * 1983-07-25 1986-04-23 Fairchild Semiconductor Corporation Method and apparatus for forming ball bonds
EP0064010A3 (en) * 1981-04-27 1986-06-11 FAIRCHILD CAMERA &amp; INSTRUMENT CORPORATION System and process for automatic wire welding
WO1991008857A1 (en) * 1989-12-20 1991-06-27 Raychem Corporation Weakening wire supplied through a wire bonder
EP0533164A3 (en) * 1987-02-06 1993-07-14 Dynapert Delvotec Gmbh Ball bonding method and apparatus for using the same
US5773780A (en) * 1993-11-16 1998-06-30 Formfactor, Inc. Method of severing bond wires and forming balls at their ends
EP0964446A3 (en) * 1998-06-04 2001-02-07 Ford Motor Company An electronic circuit assembly
EP1232828A1 (en) * 1995-05-26 2002-08-21 Formfactor, Inc. Wire bonding, severing, and ball forming

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2401522A1 (en) * 1977-07-26 1979-03-23 Welding Inst METHOD AND APPARATUS FOR FIXING ALUMINUM CONDUCTIVE WIRES
FR2493044A1 (en) * 1980-10-29 1982-04-30 Philips Nv METHOD FOR PROVIDING A WIRE CONNECTION
EP0064010A3 (en) * 1981-04-27 1986-06-11 FAIRCHILD CAMERA &amp; INSTRUMENT CORPORATION System and process for automatic wire welding
FR2522629A1 (en) * 1982-03-02 1983-09-09 Centre Nat Rech Scient Rough casting prehension and transfer system - uses moving arm with electrode at tip allowing current to pass between electrode and casting to create spot weld
EP0133118A3 (en) * 1983-07-25 1986-04-23 Fairchild Semiconductor Corporation Method and apparatus for forming ball bonds
GB2165178A (en) * 1984-10-05 1986-04-09 Hitachi Ltd Method and apparatus for wire bonding
EP0533164A3 (en) * 1987-02-06 1993-07-14 Dynapert Delvotec Gmbh Ball bonding method and apparatus for using the same
WO1991008857A1 (en) * 1989-12-20 1991-06-27 Raychem Corporation Weakening wire supplied through a wire bonder
US5095187A (en) * 1989-12-20 1992-03-10 Raychem Corporation Weakening wire supplied through a wire bonder
US5773780A (en) * 1993-11-16 1998-06-30 Formfactor, Inc. Method of severing bond wires and forming balls at their ends
EP1232828A1 (en) * 1995-05-26 2002-08-21 Formfactor, Inc. Wire bonding, severing, and ball forming
EP0964446A3 (en) * 1998-06-04 2001-02-07 Ford Motor Company An electronic circuit assembly

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