GB1320589A - Surface cleaning compositions for copper and copper alloys - Google Patents
Surface cleaning compositions for copper and copper alloysInfo
- Publication number
- GB1320589A GB1320589A GB1320589DA GB1320589A GB 1320589 A GB1320589 A GB 1320589A GB 1320589D A GB1320589D A GB 1320589DA GB 1320589 A GB1320589 A GB 1320589A
- Authority
- GB
- United Kingdom
- Prior art keywords
- composition
- copper
- feb
- hcl
- ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
1320589 Cleaning and tarnish-inhibiting of Cu FORMICA INTERNATIONAL Ltd 3 Feb 1972 [5 Feb 1971] 4039/71 Headings C7E and C7U A tarnish inhibiting cleaning composition used with Cu and its alloys comprises an aqueous solution of sulphamic acid and a compound giving rise to hexavalent Cr ions. The source of Cr ions may be CrO 3 or a chromate or dichromate of alkali metal or ammonium. The composition may also contain (i) a water-miscible organic solvent such as a lower alkoxyethanol, ethylene glycol or diacetone alcohol and/or (2) a non-ionic surfactant, typically polyethylene oxide-based and/or (3) HCl or a soluble carboxylic acid; typical amounts per 100 weight parts of composition are 1-40 NH 2 SO 3 H, 1-20 Cr source, 0À01-10 surfactant, 1-25 organic solvent and 1-10 HCl or carboxylic acid; the composition is applied by immersion or spraying with or without mechanical agitation or abrasion, followed by rinsing and drying.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB403971 | 1971-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1320589A true GB1320589A (en) | 1973-06-13 |
Family
ID=9769589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1320589D Expired GB1320589A (en) | 1971-02-05 | 1971-02-05 | Surface cleaning compositions for copper and copper alloys |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1320589A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2317374A1 (en) * | 1975-07-11 | 1977-02-04 | Siemens Ag | METHOD FOR IMPROVING THE WELDABILITY OF ELECTRIC PADS WITH PRINTED CIRCUIT |
| EP0367074A3 (en) * | 1988-10-31 | 1991-06-12 | LeaRonal, Inc. | Preparing printed circuit boards for electroplating |
| US5700389A (en) * | 1994-08-12 | 1997-12-23 | Mec Co., Ltd. | Etching solution for copper or copper alloy |
| US6270590B1 (en) | 1995-08-03 | 2001-08-07 | Europa Metalli S.P.A. | Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same |
| US6461534B2 (en) | 1997-11-19 | 2002-10-08 | Europa Metalli S. P. A. | Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same |
-
1971
- 1971-02-05 GB GB1320589D patent/GB1320589A/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2317374A1 (en) * | 1975-07-11 | 1977-02-04 | Siemens Ag | METHOD FOR IMPROVING THE WELDABILITY OF ELECTRIC PADS WITH PRINTED CIRCUIT |
| EP0367074A3 (en) * | 1988-10-31 | 1991-06-12 | LeaRonal, Inc. | Preparing printed circuit boards for electroplating |
| US5700389A (en) * | 1994-08-12 | 1997-12-23 | Mec Co., Ltd. | Etching solution for copper or copper alloy |
| US6270590B1 (en) | 1995-08-03 | 2001-08-07 | Europa Metalli S.P.A. | Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same |
| US6461534B2 (en) | 1997-11-19 | 2002-10-08 | Europa Metalli S. P. A. | Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same |
| US6770215B2 (en) | 1997-11-19 | 2004-08-03 | Europa Metalli S.P.A. | Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |