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GB1358411A - Sputtering - Google Patents

Sputtering

Info

Publication number
GB1358411A
GB1358411A GB3993771A GB3993771A GB1358411A GB 1358411 A GB1358411 A GB 1358411A GB 3993771 A GB3993771 A GB 3993771A GB 3993771 A GB3993771 A GB 3993771A GB 1358411 A GB1358411 A GB 1358411A
Authority
GB
United Kingdom
Prior art keywords
substrate
work
sputtering
field
target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3993771A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELECTRICAL RES ASS
Original Assignee
ELECTRICAL RES ASS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ELECTRICAL RES ASS filed Critical ELECTRICAL RES ASS
Priority to GB3993771A priority Critical patent/GB1358411A/en
Publication of GB1358411A publication Critical patent/GB1358411A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

1358411 Cathodic sputtering ELECTRICAL RESEARCH ASSOCIATION Ltd 2 Nov 1972 [25 Aug 1971] 39937/71 Heading C7F In a method of sputtering material from a target electrode onto a substrate on a worktable 4 constituting a second electrode, a relatively weak magnetic field A is applied (e.g. by an electromagnet) along the common axis of target and work-table, and a relatively strong localised field L is applied in the region of work-table 4 so as to form a closed loop enclosing at least a portion of the work-table and to divert electrons away from the portion enclosed by the loop, and the substrate is located on this said portion. The field L may be generated by a horseshoe magnet 16 as shown so that electrons strike region 20, whereby heating of the substrate is avoided; sputtering is in inert gas, e.g. Ar, and may be D.C. or R.F.
GB3993771A 1972-11-02 1972-11-02 Sputtering Expired GB1358411A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3993771A GB1358411A (en) 1972-11-02 1972-11-02 Sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3993771A GB1358411A (en) 1972-11-02 1972-11-02 Sputtering

Publications (1)

Publication Number Publication Date
GB1358411A true GB1358411A (en) 1974-07-03

Family

ID=10412310

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3993771A Expired GB1358411A (en) 1972-11-02 1972-11-02 Sputtering

Country Status (1)

Country Link
GB (1) GB1358411A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4025410A (en) * 1975-08-25 1977-05-24 Western Electric Company, Inc. Sputtering apparatus and methods using a magnetic field
US4046660A (en) * 1975-12-29 1977-09-06 Bell Telephone Laboratories, Incorporated Sputter coating with charged particle flux control
US4060470A (en) * 1974-12-06 1977-11-29 Clarke Peter J Sputtering apparatus and method
US4301440A (en) * 1978-12-05 1981-11-17 Nissan Motor Co., Ltd. Level detecting device
GB2119817A (en) * 1982-05-12 1983-11-23 Dowty Electronics Ltd Vacuum deposition apparatus
US4525262A (en) * 1982-01-26 1985-06-25 Materials Research Corporation Magnetron reactive bias sputtering method and apparatus
GB2191787A (en) * 1986-06-23 1987-12-23 Balzers Hochvakuum Process and arrangement for sputtering a material by means of high frequency
US4871433A (en) * 1986-04-04 1989-10-03 Materials Research Corporation Method and apparatus for improving the uniformity ion bombardment in a magnetron sputtering system
GB2211861B (en) * 1987-10-30 1992-01-29 Pioneer Electronic Corp Photomagnetic memory medium having a non-columnar structure
DE4022708A1 (en) * 1990-07-17 1992-04-02 Balzers Hochvakuum ETCHING OR COATING PLANTS
DE4042417A1 (en) * 1990-07-17 1992-05-14 Balzers Hochvakuum Etching or coating appts. with divided chamber wall

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4060470A (en) * 1974-12-06 1977-11-29 Clarke Peter J Sputtering apparatus and method
US4025410A (en) * 1975-08-25 1977-05-24 Western Electric Company, Inc. Sputtering apparatus and methods using a magnetic field
US4046660A (en) * 1975-12-29 1977-09-06 Bell Telephone Laboratories, Incorporated Sputter coating with charged particle flux control
US4301440A (en) * 1978-12-05 1981-11-17 Nissan Motor Co., Ltd. Level detecting device
US4525262A (en) * 1982-01-26 1985-06-25 Materials Research Corporation Magnetron reactive bias sputtering method and apparatus
GB2119817A (en) * 1982-05-12 1983-11-23 Dowty Electronics Ltd Vacuum deposition apparatus
US4871433A (en) * 1986-04-04 1989-10-03 Materials Research Corporation Method and apparatus for improving the uniformity ion bombardment in a magnetron sputtering system
GB2191787A (en) * 1986-06-23 1987-12-23 Balzers Hochvakuum Process and arrangement for sputtering a material by means of high frequency
DE3706698A1 (en) * 1986-06-23 1988-01-14 Balzers Hochvakuum METHOD AND ARRANGEMENT FOR SPRAYING A MATERIAL AT HIGH FREQUENCY
GB2191787B (en) * 1986-06-23 1991-03-13 Balzers Hochvakuum Process and arrangement for sputtering a material by means of high frequency
GB2211861B (en) * 1987-10-30 1992-01-29 Pioneer Electronic Corp Photomagnetic memory medium having a non-columnar structure
US5135819A (en) * 1987-10-30 1992-08-04 Pioneer Electronic Corporation Photomagnetic memory medium having a non-columnar structure
DE4022708A1 (en) * 1990-07-17 1992-04-02 Balzers Hochvakuum ETCHING OR COATING PLANTS
DE4042417A1 (en) * 1990-07-17 1992-05-14 Balzers Hochvakuum Etching or coating appts. with divided chamber wall
US5460707A (en) * 1990-07-17 1995-10-24 Balzers Aktiengesellschaft Etching or coating method and a plant therefor

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees