GB1227995A - - Google Patents
Info
- Publication number
- GB1227995A GB1227995A GB1227995DA GB1227995A GB 1227995 A GB1227995 A GB 1227995A GB 1227995D A GB1227995D A GB 1227995DA GB 1227995 A GB1227995 A GB 1227995A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- leads
- bonded
- lands
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 abstract 12
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000004382 potting Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
1,227,995. Soldering. FERRANTI Ltd. 20 March, 1969 [21 March, 1968], No. 13663/68. Heading B3R. [Also in Division H1] In order that the leads 16 extending from a substrate member 11 of a circuit assembly 10 are strongly mechanically bonded within the circuit assembly the leads are cranked at one end 21 with different parts 23, 24 of the cranked end portion being bonded to a terminal 22A on the substrate 11 and to an anchorage 22B on a second substrate 14, respectively. A glass rectangular substrate member 11 having deposited on surface 13 thereof a thin film resistor 12 and/ or semi-conductor device &c. is secured by adhesive 26 to printed circuit board 14 extending beyond the substrate 11 on all sides and with lands 22B formed on the parts projecting from the substrate 11. Lands 22A in line with lands 22B are formed on the substrate 11 and some are connected to the resistor network by conductors (not shown) on surface 13. After mounting the substrate members 11, 14 on jig 30 a rectangular lead frame 17 is positioned so that holes 19 in the boundary frame thereof fit over pins 31. Pressure is applied to the lead frame so that the parts 24 of the cranked end portions 21 of the leads 16 are forced into contact with tinned lands 22B and parts 23 with tinned lands 22A. A heated platen is placed on the leads 16 adjacent parts 24 so that the leads 16 are soft soldered to the lands 22A, 22B simultaneously, the bond at 22B being stronger than that at 22A. After potting the assembly to leave the leads extending the boundary frame of the lead frame is removed. The leads 16 may be bonded to the members 11, 14 by a conductive resin adhesive. Also the leads may be secured to the substrate 14 by each lead having a protrusion adapted to be a press-fit in an aperture in the substrate 14 the lead being soldered to adjacent parts of the substrate. Instead of the extremities 23 of the cranked portions 21 being bonded to substrate 11 they may be bonded to circuit board 14 in which case part 24 is bonded to member 11. The leads may be bonded to the side edges of 11,14.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1366368 | 1968-03-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1227995A true GB1227995A (en) | 1971-04-15 |
Family
ID=10027142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1227995D Expired GB1227995A (en) | 1968-03-21 | 1968-03-21 |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1227995A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4507710A (en) * | 1981-07-23 | 1985-03-26 | Siemens Aktiengesellschaft | Electronic components and system carrier assembly |
-
1968
- 1968-03-21 GB GB1227995D patent/GB1227995A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4507710A (en) * | 1981-07-23 | 1985-03-26 | Siemens Aktiengesellschaft | Electronic components and system carrier assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |