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GB1186669A - Improvements relating to Target Electrodes for Sputtering Apparatus - Google Patents

Improvements relating to Target Electrodes for Sputtering Apparatus

Info

Publication number
GB1186669A
GB1186669A GB748469A GB748469A GB1186669A GB 1186669 A GB1186669 A GB 1186669A GB 748469 A GB748469 A GB 748469A GB 748469 A GB748469 A GB 748469A GB 1186669 A GB1186669 A GB 1186669A
Authority
GB
United Kingdom
Prior art keywords
sputtering apparatus
improvements relating
target electrodes
feb
different materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB748469A
Inventor
Jean Vergnolle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1186669A publication Critical patent/GB1186669A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

1,186,669. Sputtering apparatus. INTERNATIONAL BUSINESS MACHINES CORP. Feb.12, 1969 [Feb.21, 1968], No.7484/69. Heading C7F. A target electrode for sputtering, e.g. three different materials, comprises a mosaic of cells, each cell having members 7, 10, 12 made of or carrying the different materials and each electrically insulated from each other. All the heads of the same material may be connected to a supply of A.C. or D.C. voltage. The materials may be deposited simultaneously or successively, and may be Nb and Sn to form Nb 3 Sn.
GB748469A 1968-01-11 1969-02-12 Improvements relating to Target Electrodes for Sputtering Apparatus Expired GB1186669A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR135568 1968-01-11
FR6009034 1968-02-21

Publications (1)

Publication Number Publication Date
GB1186669A true GB1186669A (en) 1970-04-02

Family

ID=26181721

Family Applications (1)

Application Number Title Priority Date Filing Date
GB748469A Expired GB1186669A (en) 1968-01-11 1969-02-12 Improvements relating to Target Electrodes for Sputtering Apparatus

Country Status (3)

Country Link
DE (1) DE1908310A1 (en)
FR (2) FR1574686A (en)
GB (1) GB1186669A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0839926A1 (en) * 1996-11-04 1998-05-06 The BOC Group plc Sputtering processes and apparatus
WO2007070249A3 (en) * 2005-12-14 2007-08-30 Cardinal Cg Co Sputtering and methods for depositing a film containing tin and niobium
US20120298500A1 (en) * 2011-05-23 2012-11-29 Samsung Mobile Display Co., Ltd. Separated target apparatus for sputtering and sputtering method using the same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313815A (en) * 1978-04-07 1982-02-02 Varian Associates, Inc. Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor
GB2040315B (en) * 1978-12-13 1983-05-11 Glyco Metall Werke Laminar material or element and a process for its manufacture
DE2940369C2 (en) * 1979-10-05 1982-10-21 W.C. Heraeus Gmbh, 6450 Hanau Target
DE3030320A1 (en) * 1980-08-11 1982-03-11 W.C. Heraeus Gmbh, 6450 Hanau Composite targets for cathodic sputtering - where shrink-fits are used to hold one target material in corresp. recesses or holes in other target material
FR2573441B1 (en) * 1984-11-19 1987-08-07 Cit Alcatel TARGET CATHODE FOR DEPOSITION BY SPRAYING OF A COMPOSITE MATERIAL ONTO A SUBSTRATE

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0839926A1 (en) * 1996-11-04 1998-05-06 The BOC Group plc Sputtering processes and apparatus
WO2007070249A3 (en) * 2005-12-14 2007-08-30 Cardinal Cg Co Sputtering and methods for depositing a film containing tin and niobium
EP2293320A3 (en) * 2005-12-14 2011-05-04 Cardinal CG Company Sputtering targets and methods for depositing a film containing tin and niobium
US20120298500A1 (en) * 2011-05-23 2012-11-29 Samsung Mobile Display Co., Ltd. Separated target apparatus for sputtering and sputtering method using the same

Also Published As

Publication number Publication date
FR1562286A (en) 1969-04-04
FR1574686A (en) 1969-07-18
DE1908310A1 (en) 1969-09-25

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees