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GB0815096D0 - Printed circuit boards - Google Patents

Printed circuit boards

Info

Publication number
GB0815096D0
GB0815096D0 GBGB0815096.3A GB0815096A GB0815096D0 GB 0815096 D0 GB0815096 D0 GB 0815096D0 GB 0815096 A GB0815096 A GB 0815096A GB 0815096 D0 GB0815096 D0 GB 0815096D0
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit boards
boards
printed
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0815096.3A
Other versions
GB2462824A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CROMBIE 123 Ltd
Original Assignee
CROMBIE 123 Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CROMBIE 123 Ltd filed Critical CROMBIE 123 Ltd
Priority to GB0815096A priority Critical patent/GB2462824A/en
Publication of GB0815096D0 publication Critical patent/GB0815096D0/en
Priority to CN2009801355060A priority patent/CN102150480A/en
Priority to PCT/GB2009/001966 priority patent/WO2010020753A2/en
Priority to KR1020117006208A priority patent/KR101574374B1/en
Priority to US13/059,602 priority patent/US9055700B2/en
Priority to SG2013062617A priority patent/SG193213A1/en
Priority to CN201610133298.2A priority patent/CN105744751B/en
Priority to MYPI2011000729A priority patent/MY155804A/en
Priority to CA2733765A priority patent/CA2733765C/en
Priority to JP2011523441A priority patent/JP5645821B2/en
Priority to KR1020147019126A priority patent/KR101591619B1/en
Priority to CA2957997A priority patent/CA2957997C/en
Priority to MX2011001775A priority patent/MX2011001775A/en
Priority to BRPI0917289A priority patent/BRPI0917289A8/en
Priority to AU2009283992A priority patent/AU2009283992B2/en
Priority to CN201610131380.1A priority patent/CN105744750B/en
Priority to EP09784909A priority patent/EP2327283A2/en
Priority to RU2011110260/07A priority patent/RU2533162C2/en
Priority to SG10201701218UA priority patent/SG10201701218UA/en
Priority to TW098127585A priority patent/TWI459878B/en
Publication of GB2462824A publication Critical patent/GB2462824A/en
Priority to US13/030,684 priority patent/US8618420B2/en
Priority to RU2014121727A priority patent/RU2685692C2/en
Priority to JP2014224131A priority patent/JP5813850B2/en
Priority to PH12015500087A priority patent/PH12015500087A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/06—Organic materials
    • C09K21/08—Organic materials containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
GB0815096A 2008-08-18 2008-08-18 Printed circuit board encapsulation Withdrawn GB2462824A (en)

Priority Applications (24)

Application Number Priority Date Filing Date Title
GB0815096A GB2462824A (en) 2008-08-18 2008-08-18 Printed circuit board encapsulation
SG10201701218UA SG10201701218UA (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
MX2011001775A MX2011001775A (en) 2008-08-18 2009-08-11 HALO-HYDROCARBON POLYMER COATING.
AU2009283992A AU2009283992B2 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
KR1020117006208A KR101574374B1 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
US13/059,602 US9055700B2 (en) 2008-08-18 2009-08-11 Apparatus with a multi-layer coating and method of forming the same
SG2013062617A SG193213A1 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
CN201610133298.2A CN105744751B (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
MYPI2011000729A MY155804A (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
CA2733765A CA2733765C (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
JP2011523441A JP5645821B2 (en) 2008-08-18 2009-08-11 Halohydrocarbon polymer coating
KR1020147019126A KR101591619B1 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
CA2957997A CA2957997C (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
CN2009801355060A CN102150480A (en) 2008-08-18 2009-08-11 Halocarbon polymer coating
BRPI0917289A BRPI0917289A8 (en) 2008-08-18 2009-08-11 halo polymeric coating
PCT/GB2009/001966 WO2010020753A2 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
CN201610131380.1A CN105744750B (en) 2008-08-18 2009-08-11 Halogenated hydrocarbon polymer coating
EP09784909A EP2327283A2 (en) 2008-08-18 2009-08-11 Halo-hydrocarbon polymer coating
RU2011110260/07A RU2533162C2 (en) 2008-08-18 2009-08-11 Halogen-hydrocarbon polymer coating
TW098127585A TWI459878B (en) 2008-08-18 2009-08-17 Circuit board device containing halogen-hydrocarbon polymer coating and preparation method thereof
US13/030,684 US8618420B2 (en) 2008-08-18 2011-02-18 Apparatus with a wire bond and method of forming the same
RU2014121727A RU2685692C2 (en) 2008-08-18 2014-05-28 Printed board and method for production thereof
JP2014224131A JP5813850B2 (en) 2008-08-18 2014-11-04 Halohydrocarbon polymer coating
PH12015500087A PH12015500087A1 (en) 2008-08-18 2015-01-14 Halo-hydrocarbon polymer coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0815096A GB2462824A (en) 2008-08-18 2008-08-18 Printed circuit board encapsulation

Publications (2)

Publication Number Publication Date
GB0815096D0 true GB0815096D0 (en) 2008-09-24
GB2462824A GB2462824A (en) 2010-02-24

Family

ID=39812229

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0815096A Withdrawn GB2462824A (en) 2008-08-18 2008-08-18 Printed circuit board encapsulation

Country Status (1)

Country Link
GB (1) GB2462824A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201003067D0 (en) * 2010-02-23 2010-04-07 Semblant Ltd Plasma-polymerized polymer coating
DE102010045035A1 (en) * 2010-09-10 2012-03-15 Siemens Aktiengesellschaft Encapsulation and manufacture of an encapsulated assembled printed circuit board
CA2864202A1 (en) * 2012-03-06 2013-09-12 Semblant Limited Coated electrical assembly
GB201305500D0 (en) * 2013-03-26 2013-05-08 Semblant Ltd Coated electrical assembly
ES2881976T3 (en) * 2015-09-24 2021-11-30 Europlasma Nv Methods for the deposition of polymeric coatings
GB201621177D0 (en) * 2016-12-13 2017-01-25 Semblant Ltd Protective coating

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2048044B1 (en) * 1969-06-30 1973-01-12 Fmc Corp
JPS5219875B2 (en) * 1974-02-07 1977-05-31
US4136225A (en) * 1977-07-08 1979-01-23 Bell Telephone Laboratories, Incorporated Cover coatings for printed circuits
JPS5439873A (en) * 1977-09-06 1979-03-27 Nippon Denso Co Incombustible ypet flexible printed wiring board
US4797178A (en) * 1987-05-13 1989-01-10 International Business Machines Corporation Plasma etch enhancement with large mass inert gas
JPH02120351A (en) * 1988-10-29 1990-05-08 Japan Synthetic Rubber Co Ltd Flame-retarding resin composition
DE59202994D1 (en) * 1991-02-07 1995-08-31 Siemens Ag Micro multilayer wiring.
JPH05275487A (en) * 1991-11-22 1993-10-22 Sumitomo 3M Ltd Electronic component surface protective material, electronic component provided with the surface protective material, and electrical connection method of electronic component using the surface protective material
JPH0827453A (en) * 1994-07-14 1996-01-30 Nitto Denko Corp Flame retardant adhesive
JPH08143846A (en) * 1994-11-24 1996-06-04 Nitto Denko Corp Flame retardant adhesive
DE10026714A1 (en) * 2000-05-30 2001-12-13 Hueck Folien Gmbh Composite film, process for its production and its use
DE10114897A1 (en) * 2001-03-26 2002-10-24 Infineon Technologies Ag Electronic component
JP4409134B2 (en) * 2001-10-09 2010-02-03 パナソニック株式会社 Mounting system
JP4075379B2 (en) * 2002-01-08 2008-04-16 株式会社デンソー Surface treatment method of fluororesin and method of manufacturing printed wiring board using fluororesin
US20030215588A1 (en) * 2002-04-09 2003-11-20 Yeager Gary William Thermoset composition, method, and article
US6776827B2 (en) * 2002-09-23 2004-08-17 Syed M. Hasan Method and solution for treating fluorocarbon surfaces
US20050121226A1 (en) * 2003-10-21 2005-06-09 Park Electrochemical Corporation Laminates having a low dielectric constant, low disapation factor bond core and method of making same
JP4195365B2 (en) * 2003-12-05 2008-12-10 アルプス電気株式会社 Circuit board with flame resistance and moisture resistance
US7985677B2 (en) * 2004-11-30 2011-07-26 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
US7579134B2 (en) * 2005-03-15 2009-08-25 E. I. Dupont De Nemours And Company Polyimide composite coverlays and methods and compositions relating thereto
JP2007010794A (en) * 2005-06-28 2007-01-18 Hitachi Chem Co Ltd Photosensitive resin composition and photosensitive element
JP4722669B2 (en) * 2005-10-26 2011-07-13 株式会社日立ハイテクインスツルメンツ Plasma cleaning device
US7527915B2 (en) * 2006-07-19 2009-05-05 E. I. Du Pont De Nemours And Company Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto
GB0703172D0 (en) * 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
JP2009051876A (en) * 2007-08-23 2009-03-12 Three M Innovative Properties Co Coating composition and article using the same
US20090110884A1 (en) * 2007-10-29 2009-04-30 Integrated Surface Technologies Surface Coating

Also Published As

Publication number Publication date
GB2462824A (en) 2010-02-24

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20100923 AND 20100929

WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)