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GB0412436D0 - Semiconductor package with transparent lid - Google Patents

Semiconductor package with transparent lid

Info

Publication number
GB0412436D0
GB0412436D0 GBGB0412436.8A GB0412436A GB0412436D0 GB 0412436 D0 GB0412436 D0 GB 0412436D0 GB 0412436 A GB0412436 A GB 0412436A GB 0412436 D0 GB0412436 D0 GB 0412436D0
Authority
GB
United Kingdom
Prior art keywords
wafers
wafer
glass frit
semiconductor package
transparent lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0412436.8A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Melexis NV
Original Assignee
Melexis NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melexis NV filed Critical Melexis NV
Priority to GBGB0412436.8A priority Critical patent/GB0412436D0/en
Publication of GB0412436D0 publication Critical patent/GB0412436D0/en
Priority to PCT/IB2005/001590 priority patent/WO2005119756A1/en
Priority to EP05748145A priority patent/EP1751792A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Abstract

A transparent wafer (101), typically a glass wafer, is placed over a silicon wafer (100) having an integrated circuit with one or more optically active elements (106) provided thereon. The transparent wafer (101) is securely sealed to the silicon wafer (100) by a pattern of glass frit material (104) applied to one or both wafers (100, 101). The glass frit pattern (104) is screen printed on to the appropriate wafer (100, 101) and is arranged so as to surround the or each optically active element or elements (106) of each integrated circuit. The two wafers (100, 101) are aligned and brought together. The wafers (100, 101) are then raised in temperature to cause the glass frit material (105) to reflow and seal the wafers together. In this manner, the glass frit (105) seals the gap between the two wafers (100, 101).
GBGB0412436.8A 2004-06-04 2004-06-04 Semiconductor package with transparent lid Ceased GB0412436D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB0412436.8A GB0412436D0 (en) 2004-06-04 2004-06-04 Semiconductor package with transparent lid
PCT/IB2005/001590 WO2005119756A1 (en) 2004-06-04 2005-06-06 Semiconductor package with transparent lid
EP05748145A EP1751792A1 (en) 2004-06-04 2005-06-06 Semiconductor package with transparent lid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0412436.8A GB0412436D0 (en) 2004-06-04 2004-06-04 Semiconductor package with transparent lid

Publications (1)

Publication Number Publication Date
GB0412436D0 true GB0412436D0 (en) 2004-07-07

Family

ID=32696635

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0412436.8A Ceased GB0412436D0 (en) 2004-06-04 2004-06-04 Semiconductor package with transparent lid

Country Status (3)

Country Link
EP (1) EP1751792A1 (en)
GB (1) GB0412436D0 (en)
WO (1) WO2005119756A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3166146B1 (en) * 2015-11-06 2019-04-17 ams AG Optical package and method of producing an optical package
DE102020207343A1 (en) 2020-06-15 2021-12-16 Robert Bosch Gesellschaft mit beschränkter Haftung Process for the production of optical and / or optoelectronic systems with improved heat dissipation and improved thermal and / or mechanical stability, as well as optical and / or optoelectronic systems obtained by means of this process
KR102494691B1 (en) * 2020-09-11 2023-02-02 주식회사 옵트론텍 Optical filter carrier, image sensor package having optical filter, and method of fabricating the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57136869A (en) * 1981-02-18 1982-08-24 Hitachi Ltd Solid image pickup device
JPS5825777A (en) * 1981-08-07 1983-02-16 Hitachi Ltd Solid-state image pickup device
JPS59224145A (en) * 1983-06-03 1984-12-17 Hitachi Ltd Semiconductor device
JPS61131690A (en) * 1984-11-30 1986-06-19 Toshiba Corp Solid-state image pick-up device
JPS6381995A (en) * 1986-09-26 1988-04-12 Hitachi Ltd Opto-electronic device and manufacture thereof
KR940001333A (en) * 1992-06-16 1994-01-11 문정환 Resin-sealed solid state image pickup device package and manufacturing method thereof
US6583444B2 (en) * 1997-02-18 2003-06-24 Tessera, Inc. Semiconductor packages having light-sensitive chips
AU7381200A (en) * 1999-09-17 2001-04-17 Motorola, Inc. Semiconductor wafer level package
WO2002074686A2 (en) * 2000-12-05 2002-09-26 Analog Devices, Inc. A method and device for protecting micro electromechanical systems structures during dicing of a wafer
EP1246235A1 (en) * 2001-03-26 2002-10-02 European Semiconductor Assembly (Eurasem) B.V. Method for encapsulating a chip having a sensitive surface
US6893574B2 (en) * 2001-10-23 2005-05-17 Analog Devices Inc MEMS capping method and apparatus

Also Published As

Publication number Publication date
EP1751792A1 (en) 2007-02-14
WO2005119756A1 (en) 2005-12-15

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)