GB0308249D0 - Method of depositing piezoelectric films - Google Patents

Method of depositing piezoelectric films

Info

Publication number: GB0308249D0
Authority: GB; United Kingdom
Prior art keywords: piezoelectric films; depositing piezoelectric; depositing; films; piezoelectric
Prior art date: 2003-04-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Ceased

Application number

GBGB0308249.2A

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Trikon Technologies Ltd

Original Assignee

Trikon Technologies Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-04-10

Filing date

2003-04-10

Publication date

2003-05-14

2003-04-10 Application filed by Trikon Technologies Ltd filed Critical Trikon Technologies Ltd

2003-04-10 Priority to GBGB0308249.2A priority Critical patent/GB0308249D0/en

2003-05-14 Publication of GB0308249D0 publication Critical patent/GB0308249D0/en

2004-03-25 Priority to DE102004014718A priority patent/DE102004014718A1/en

2004-04-02 Priority to GB0407506A priority patent/GB2400490B/en

2004-04-06 Priority to US10/817,888 priority patent/US7227292B2/en

2004-04-07 Priority to JP2004113316A priority patent/JP2004320759A/en

2010-12-10 Priority to JP2010276137A priority patent/JP2011061867A/en

Status Ceased legal-status Critical Current

Classifications

- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/027—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the microelectro-mechanical [MEMS] type
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
- H03H2003/0421—Modification of the thickness of an element
- H03H2003/0428—Modification of the thickness of an element of an electrode
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
- H03H2003/0421—Modification of the thickness of an element
- H03H2003/0435—Modification of the thickness of an element of a piezoelectric layer
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
- H03H2003/0478—Resonance frequency in a process for mass production

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Physical Vapour Deposition (AREA)
Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

GBGB0308249.2A 2003-04-10 2003-04-10 Method of depositing piezoelectric films Ceased GB0308249D0 (en)

Priority Applications (6)

Application Number	Priority Date	Filing Date	Title
GBGB0308249.2A GB0308249D0 (en)	2003-04-10	2003-04-10	Method of depositing piezoelectric films
DE102004014718A DE102004014718A1 (en)	2003-04-10	2004-03-25	Process for the deposition of piezoelectric thin layers
GB0407506A GB2400490B (en)	2003-04-10	2004-04-02	Methods of depositing piezoelectric films
US10/817,888 US7227292B2 (en)	2003-04-10	2004-04-06	Methods of depositing piezoelectric films
JP2004113316A JP2004320759A (en)	2003-04-10	2004-04-07	Layer stack deposition method, resonator formation method, piezoelectric layer deposition method, and resonator
JP2010276137A JP2011061867A (en)	2003-04-10	2010-12-10	Method for stack deposition of layer, method of forming resonator, and method for deposition of piezoelectric layer

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GBGB0308249.2A GB0308249D0 (en)	2003-04-10	2003-04-10	Method of depositing piezoelectric films

Publications (1)

Publication Number	Publication Date
GB0308249D0 true GB0308249D0 (en)	2003-05-14

Family

ID=9956522

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
GBGB0308249.2A Ceased GB0308249D0 (en)	2003-04-10	2003-04-10	Method of depositing piezoelectric films
GB0407506A Expired - Lifetime GB2400490B (en)	2003-04-10	2004-04-02	Methods of depositing piezoelectric films

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
GB0407506A Expired - Lifetime GB2400490B (en)	2003-04-10	2004-04-02	Methods of depositing piezoelectric films

Country Status (3)

Country	Link
JP (2)	JP2004320759A (en)
DE (1)	DE102004014718A1 (en)
GB (2)	GB0308249D0 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7543496B2 (en) *	2006-03-27	2009-06-09	Georgia Tech Research Corporation	Capacitive bulk acoustic wave disk gyroscopes
WO2011026100A1 (en)	2009-08-31	2011-03-03	Georgia Tech Research Corporation	Bulk acoustic wave gyroscope with spoked structure
CN104579233B (en) *	2013-10-23	2018-12-04	中兴通讯股份有限公司	A kind of production method and device of film Resonator
US11401601B2 (en)	2019-09-13	2022-08-02	Qorvo Us, Inc.	Piezoelectric bulk layers with tilted c-axis orientation and methods for making the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4502932A (en) *	1983-10-13	1985-03-05	The United States Of America As Represented By The United States Department Of Energy	Acoustic resonator and method of making same
US5864261A (en) *	1994-05-23	1999-01-26	Iowa State University Research Foundation	Multiple layer acoustical structures for thin-film resonator based circuits and systems
JPH1064886A (en) *	1996-08-20	1998-03-06	Sony Corp	Dry etching apparatus and dry etching method
US6051907A (en) *	1996-10-10	2000-04-18	Nokia Mobile Phones Limited	Method for performing on-wafer tuning of thin film bulk acoustic wave resonators (FBARS)
JPH10280153A (en) *	1997-04-11	1998-10-20	Toshiba Mach Co Ltd	Plasma cvd device
US6329305B1 (en) *	2000-02-11	2001-12-11	Agere Systems Guardian Corp.	Method for producing devices having piezoelectric films
US6342134B1 (en) *	2000-02-11	2002-01-29	Agere Systems Guardian Corp.	Method for producing piezoelectric films with rotating magnetron sputtering system
JP2002031523A (en) *	2000-05-10	2002-01-31	Rigaku Corp	Thin film measuring device, thin film measuring method, and thin film forming system
JP4575586B2 (en) *	2000-12-19	2010-11-04	キヤノンアネルバ株式会社	Deposition equipment
US6518860B2 (en) *	2001-01-05	2003-02-11	Nokia Mobile Phones Ltd	BAW filters having different center frequencies on a single substrate and a method for providing same
US6611576B1 (en) *	2001-02-12	2003-08-26	Advanced Micro Devices, Inc.	Automated control of metal thickness during film deposition
US6456173B1 (en) *	2001-02-15	2002-09-24	Nokia Mobile Phones Ltd.	Method and system for wafer-level tuning of bulk acoustic wave resonators and filters
JP2002350370A (en) *	2001-03-22	2002-12-04	Rigaku Corp	X-ray measuring apparatus, system for measuring/forming thin film, and method for measuring/forming thin film
JP3954319B2 (en) *	2001-03-28	2007-08-08	株式会社東芝	Thin film thickness monitoring method and substrate temperature measurement method
US6472954B1 (en) *	2001-04-23	2002-10-29	Agilent Technologies, Inc.	Controlled effective coupling coefficients for film bulk acoustic resonators
US6480074B1 (en) *	2001-04-27	2002-11-12	Nokia Mobile Phones Ltd.	Method and system for wafer-level tuning of bulk acoustic wave resonators and filters by reducing thickness non-uniformity
US6601276B2 (en) *	2001-05-11	2003-08-05	Agere Systems Inc.	Method for self alignment of patterned layers in thin film acoustic devices
JP3984441B2 (en) *	2001-07-26	2007-10-03	松下電器産業株式会社	Piezoelectric thin film vibrator and filter
JP4288914B2 (en) *	2002-08-21	2009-07-01	パナソニック株式会社	Resonant device manufacturing method

2003
- 2003-04-10 GB GBGB0308249.2A patent/GB0308249D0/en not_active Ceased
2004
- 2004-03-25 DE DE102004014718A patent/DE102004014718A1/en not_active Withdrawn
- 2004-04-02 GB GB0407506A patent/GB2400490B/en not_active Expired - Lifetime
- 2004-04-07 JP JP2004113316A patent/JP2004320759A/en not_active Withdrawn
2010
- 2010-12-10 JP JP2010276137A patent/JP2011061867A/en active Pending

Also Published As

Publication number	Publication date
JP2004320759A (en)	2004-11-11
GB0407506D0 (en)	2004-05-05
DE102004014718A1 (en)	2004-10-21
GB2400490A (en)	2004-10-13
JP2011061867A (en)	2011-03-24
GB2400490B (en)	2006-06-28

Publication	Publication Date	Title
GB0323295D0 (en)	2003-11-05	Deposition of thin films
GB0316926D0 (en)	2003-08-27	Method of coating
EP1614768A4 (en)	2007-07-04	Method for forming film
GB2413977B (en)	2006-04-12	Method of manufacturing thin wall isogrid casings
AU2003900810A0 (en)	2003-03-13	Method of scheduling
PL377259A1 (en)	2006-01-23	Method of depositing dlc on substrate
GB2400613B (en)	2006-01-25	Plasma deposition method
GB2401563B (en)	2005-07-27	Method for forming plural-layered coated film
GB0323671D0 (en)	2003-11-12	Vapour deposition method
IL150438A0 (en)	2002-12-01	Method of thin films measurement
EP1492159A4 (en)	2007-07-11	Method of depositing cvd thin film
EP1645338A4 (en)	2006-11-02	Adhesive layer forming method
AU2003301498A8 (en)	2004-06-07	Thin films and methods for forming thin films utilizing ecae-targets
AU2003297044A1 (en)	2004-09-06	Method of forming sub-micron-size structures over a substrate
EP1614766A4 (en)	2011-07-06	Method for forming porous thin film
GB0308249D0 (en)	2003-05-14	Method of depositing piezoelectric films
GB2404886B (en)	2006-04-12	Coating method
GB0306205D0 (en)	2003-04-23	Production of nanoparticulate thin films
EP1477580A3 (en)	2004-12-29	Deposition method using multiple deposition chambers
GB2399351B (en)	2005-12-07	Method for forming film
GB0305819D0 (en)	2003-04-16	Method of preparing PbTiO3 thin films
GB0605431D0 (en)	2006-04-26	Method of preparing a LiNb1-xTaxO3 film
AU2003900491A0 (en)	2003-02-20	Method of curing a substrate
AU2003290512A1 (en)	2005-04-14	Method of weldbonding
AU2003299623A1 (en)	2004-08-10	Method of making mercaptoalkylalkyldialkoxysilanes

Legal Events

Date	Code	Title	Description
2004-06-02	AT	Applications terminated before publication under section 16(1)