FR3031243B1 - Ancrage d'un fil conducteur dans un support plastique - Google Patents
Ancrage d'un fil conducteur dans un support plastique Download PDFInfo
- Publication number
- FR3031243B1 FR3031243B1 FR1463316A FR1463316A FR3031243B1 FR 3031243 B1 FR3031243 B1 FR 3031243B1 FR 1463316 A FR1463316 A FR 1463316A FR 1463316 A FR1463316 A FR 1463316A FR 3031243 B1 FR3031243 B1 FR 3031243B1
- Authority
- FR
- France
- Prior art keywords
- plastic support
- conductive wire
- anchoring
- plastic
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Conductive Materials (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Fil (1) conducteur apte à être inséré dans un support plastique, comprenant un moyen d'ancrage dans ledit support plastique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1463316A FR3031243B1 (fr) | 2014-12-24 | 2014-12-24 | Ancrage d'un fil conducteur dans un support plastique |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1463316A FR3031243B1 (fr) | 2014-12-24 | 2014-12-24 | Ancrage d'un fil conducteur dans un support plastique |
| FR1463316 | 2014-12-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR3031243A1 FR3031243A1 (fr) | 2016-07-01 |
| FR3031243B1 true FR3031243B1 (fr) | 2019-05-31 |
Family
ID=53269577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1463316A Active FR3031243B1 (fr) | 2014-12-24 | 2014-12-24 | Ancrage d'un fil conducteur dans un support plastique |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR3031243B1 (fr) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU709049B2 (en) * | 1996-02-12 | 1999-08-19 | Smartrac Ip B.V. | Process and device for contacting a wire conductor |
| FR2820548A1 (fr) * | 2001-02-02 | 2002-08-09 | Schlumberger Systems & Service | Objet portatif a puce et a antenne, module destine a former un objet portatif a puce et a antenne et leurs procedes de fabrication |
| DE20217828U1 (de) * | 2002-11-19 | 2003-03-06 | Cubit Electronics GmbH, 99099 Erfurt | Kontaktloser Transponder für Haftfolien |
| US9444213B2 (en) * | 2009-03-09 | 2016-09-13 | Nucurrent, Inc. | Method for manufacture of multi-layer wire structure for high efficiency wireless communication |
| US20130075134A1 (en) * | 2010-10-11 | 2013-03-28 | Feinics Amatech Nominee Limited | Preparing a substrate for embedding wire |
-
2014
- 2014-12-24 FR FR1463316A patent/FR3031243B1/fr active Active
Also Published As
| Publication number | Publication date |
|---|---|
| FR3031243A1 (fr) | 2016-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PLFP | Fee payment |
Year of fee payment: 2 |
|
| PLSC | Publication of the preliminary search report |
Effective date: 20160701 |
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| PLFP | Fee payment |
Year of fee payment: 3 |
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| PLFP | Fee payment |
Year of fee payment: 4 |
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| CD | Change of name or company name |
Owner name: IDEMIA FRANCE, FR Effective date: 20180910 |
|
| CJ | Change in legal form |
Effective date: 20180910 |
|
| PLFP | Fee payment |
Year of fee payment: 6 |
|
| CA | Change of address |
Effective date: 20200909 |
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| PLFP | Fee payment |
Year of fee payment: 7 |
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| PLFP | Fee payment |
Year of fee payment: 8 |
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| PLFP | Fee payment |
Year of fee payment: 9 |
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| PLFP | Fee payment |
Year of fee payment: 10 |
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| PLFP | Fee payment |
Year of fee payment: 11 |
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| PLFP | Fee payment |
Year of fee payment: 12 |