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FR3059152B1 - Dispositif de transfert thermique, de connexion electrique et dispositif electronique - Google Patents

Dispositif de transfert thermique, de connexion electrique et dispositif electronique Download PDF

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Publication number
FR3059152B1
FR3059152B1 FR1661261A FR1661261A FR3059152B1 FR 3059152 B1 FR3059152 B1 FR 3059152B1 FR 1661261 A FR1661261 A FR 1661261A FR 1661261 A FR1661261 A FR 1661261A FR 3059152 B1 FR3059152 B1 FR 3059152B1
Authority
FR
France
Prior art keywords
heat
thermal transfer
electrical connection
transfer device
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1661261A
Other languages
English (en)
Other versions
FR3059152A1 (fr
Inventor
Rafael Augusto Prieto Herrera
Jean-Philippe Colonna
Perceval Coudrain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
STMicroelectronics Crolles 2 SAS
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
STMicroelectronics SA
STMicroelectronics Crolles 2 SAS
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, STMicroelectronics SA, STMicroelectronics Crolles 2 SAS, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR1661261A priority Critical patent/FR3059152B1/fr
Priority to US15/801,505 priority patent/US10480833B2/en
Publication of FR3059152A1 publication Critical patent/FR3059152A1/fr
Application granted granted Critical
Publication of FR3059152B1 publication Critical patent/FR3059152B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B15/00—Sorption machines, plants or systems, operating continuously, e.g. absorption type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Dispositif de transfert thermique comprenant un empilement qui comprend : au moins une couche conductrice de la chaleur (3), présentant au moins une portion de récupération de chaleur (5), apte à être placée en regard d'une source de chaleur, et une portion d'évacuation de chaleur (6), apte à être placée en regard d'un puits thermique, et au moins une couche d'absorption de la chaleur (4), incluant une matière à changement de phase, dont une face est accolée à au moins une partie d'au moins une face de ladite couche conductrice de la chaleur. Dispositif électronique comprenant un tel dispositif de transfert thermique.
FR1661261A 2016-11-21 2016-11-21 Dispositif de transfert thermique, de connexion electrique et dispositif electronique Expired - Fee Related FR3059152B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1661261A FR3059152B1 (fr) 2016-11-21 2016-11-21 Dispositif de transfert thermique, de connexion electrique et dispositif electronique
US15/801,505 US10480833B2 (en) 2016-11-21 2017-11-02 Heat-transferring and electrically connecting device and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1661261A FR3059152B1 (fr) 2016-11-21 2016-11-21 Dispositif de transfert thermique, de connexion electrique et dispositif electronique
FR1661261 2016-11-21

Publications (2)

Publication Number Publication Date
FR3059152A1 FR3059152A1 (fr) 2018-05-25
FR3059152B1 true FR3059152B1 (fr) 2019-01-25

Family

ID=57590705

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1661261A Expired - Fee Related FR3059152B1 (fr) 2016-11-21 2016-11-21 Dispositif de transfert thermique, de connexion electrique et dispositif electronique

Country Status (2)

Country Link
US (1) US10480833B2 (fr)
FR (1) FR3059152B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10700036B2 (en) * 2018-10-19 2020-06-30 Toyota Motor Engineering & Manufacturing North America, Inc. Encapsulated stress mitigation layer and power electronic assemblies incorporating the same
TWI712105B (zh) * 2019-10-31 2020-12-01 新唐科技股份有限公司 半導體裝置與其製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5224030A (en) * 1990-03-30 1993-06-29 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Semiconductor cooling apparatus
EP0544329A3 (en) * 1991-11-28 1993-09-01 Kabushiki Kaisha Toshiba Semiconductor package
US6940721B2 (en) * 2000-02-25 2005-09-06 Richard F. Hill Thermal interface structure for placement between a microelectronic component package and heat sink
US6392883B1 (en) * 2000-06-30 2002-05-21 Intel Corporation Heat exchanger having phase change material for a portable computing device
US6639799B2 (en) * 2000-12-22 2003-10-28 Intel Corporation Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
US7131487B2 (en) * 2001-12-14 2006-11-07 Intel Corporation Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
US7246940B2 (en) * 2003-06-24 2007-07-24 Halliburton Energy Services, Inc. Method and apparatus for managing the temperature of thermal components
US7501699B2 (en) * 2005-06-30 2009-03-10 Intel Corporation Method and apparatus for electrical isolation of semiconductor device
KR20070016342A (ko) * 2005-08-03 2007-02-08 삼성전자주식회사 영상 신호를 외부로 무선 전송하는 장치 및 그에 따른 방법
TW200823886A (en) * 2006-11-23 2008-06-01 Inventec Corp Heat-dissipation apparatus for hard disk
US20080160330A1 (en) * 2006-12-29 2008-07-03 David Song Copper-elastomer hybrid thermal interface material to cool under-substrate silicon
JP5096010B2 (ja) * 2007-02-01 2012-12-12 ポリマテック株式会社 熱拡散シート及び熱拡散シートの位置決め方法
US8081468B2 (en) * 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
FR2977121B1 (fr) * 2011-06-22 2014-04-25 Commissariat Energie Atomique Systeme de gestion thermique a materiau a volume variable
US9271427B2 (en) * 2012-11-28 2016-02-23 Hamilton Sundstrand Corporation Flexible thermal transfer strips
US20150348895A1 (en) * 2013-01-21 2015-12-03 Pbt Pte. Ltd. Substrate for semiconductor packaging and method of forming same
KR102173141B1 (ko) * 2014-02-04 2020-11-02 삼성전자주식회사 히트 파이프를 포함하는 휴대 장치
US9329646B2 (en) * 2014-03-20 2016-05-03 Qualcomm Incorporated Multi-layer heat dissipating apparatus for an electronic device
US9532458B2 (en) * 2014-11-17 2016-12-27 Tyco Electronics Corporation Electrical assembly within a connector housing
US9941450B2 (en) * 2015-06-18 2018-04-10 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor device
US9918407B2 (en) * 2016-08-02 2018-03-13 Qualcomm Incorporated Multi-layer heat dissipating device comprising heat storage capabilities, for an electronic device

Also Published As

Publication number Publication date
FR3059152A1 (fr) 2018-05-25
US10480833B2 (en) 2019-11-19
US20180142923A1 (en) 2018-05-24

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