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FR3057391B1 - Equipement de traitement thermique avec dispositif collecteur - Google Patents

Equipement de traitement thermique avec dispositif collecteur Download PDF

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Publication number
FR3057391B1
FR3057391B1 FR1659810A FR1659810A FR3057391B1 FR 3057391 B1 FR3057391 B1 FR 3057391B1 FR 1659810 A FR1659810 A FR 1659810A FR 1659810 A FR1659810 A FR 1659810A FR 3057391 B1 FR3057391 B1 FR 3057391B1
Authority
FR
France
Prior art keywords
collecting device
treatment equipment
enclosure
gas
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1659810A
Other languages
English (en)
Other versions
FR3057391A1 (fr
Inventor
Didier Landru
Oleg Kononchuk
Sebastien Simon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR1659810A priority Critical patent/FR3057391B1/fr
Priority to TW106134093A priority patent/TWI736684B/zh
Priority to JP2017193750A priority patent/JP7034656B2/ja
Priority to US15/728,953 priority patent/US10510565B2/en
Priority to CN201710939859.2A priority patent/CN107919302B/zh
Priority to KR1020170131077A priority patent/KR102399773B1/ko
Priority to SG10201708389SA priority patent/SG10201708389SA/en
Publication of FR3057391A1 publication Critical patent/FR3057391A1/fr
Application granted granted Critical
Publication of FR3057391B1 publication Critical patent/FR3057391B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens or the like for the charge within the furnace
    • F27D5/0037—Supports specially adapted for semi-conductors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining or circulating atmospheres in heating chambers
    • F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Furnace Details (AREA)

Abstract

L'invention concerne un équipement de traitement thermique (100) comprenant une enceinte (2) apte à recevoir une pluralité de substrats (10), une voie d'entrée (5) d'un gaz dans une partie distale de l'enceinte (2) et une voie de sortie (6) du gaz et d'espèces volatiles générées au cours du traitement thermique, dans une partie proximale de l'enceinte (2). L'équipement de traitement thermique (100) est remarquable en ce qu'il comprend un dispositif collecteur (200), dans la partie proximale de l'enceinte (2), définissant un compartiment en communication avec la voie de sortie (6) et dans lequel le gaz et les espèces volatiles sont destinés à circuler, afin de favoriser le dépôt (7) des espèces volatiles sur des surfaces internes du dispositif collecteur (200).
FR1659810A 2016-10-11 2016-10-11 Equipement de traitement thermique avec dispositif collecteur Active FR3057391B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR1659810A FR3057391B1 (fr) 2016-10-11 2016-10-11 Equipement de traitement thermique avec dispositif collecteur
TW106134093A TWI736684B (zh) 2016-10-11 2017-10-02 具有收集器裝置之熱處理系統
JP2017193750A JP7034656B2 (ja) 2016-10-11 2017-10-03 回収装置を有する熱処理システム
US15/728,953 US10510565B2 (en) 2016-10-11 2017-10-10 Thermal treatment system with collector device
CN201710939859.2A CN107919302B (zh) 2016-10-11 2017-10-11 具有收集器装置的热处理系统
KR1020170131077A KR102399773B1 (ko) 2016-10-11 2017-10-11 수집 장치를 구비한 열처리 시스템
SG10201708389SA SG10201708389SA (en) 2016-10-11 2017-10-11 Thermal treatment system with collector device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1659810 2016-10-11
FR1659810A FR3057391B1 (fr) 2016-10-11 2016-10-11 Equipement de traitement thermique avec dispositif collecteur

Publications (2)

Publication Number Publication Date
FR3057391A1 FR3057391A1 (fr) 2018-04-13
FR3057391B1 true FR3057391B1 (fr) 2019-03-29

Family

ID=57861004

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1659810A Active FR3057391B1 (fr) 2016-10-11 2016-10-11 Equipement de traitement thermique avec dispositif collecteur

Country Status (7)

Country Link
US (1) US10510565B2 (fr)
JP (1) JP7034656B2 (fr)
KR (1) KR102399773B1 (fr)
CN (1) CN107919302B (fr)
FR (1) FR3057391B1 (fr)
SG (1) SG10201708389SA (fr)
TW (1) TWI736684B (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101393235B1 (ko) * 2012-11-13 2014-05-27 공주대학교 산학협력단 고장 감내형 ｐｗｍ 스위칭에 의한 전력변환장치 및 그 제어방법
KR102188604B1 (ko) * 2019-04-02 2020-12-09 주식회사 미래보 반도체 공정의 반응부산물 포집장치
CN113395819A (zh) 2020-03-13 2021-09-14 华为技术有限公司 一种线缆组件、信号传输结构和电子设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5188672A (en) * 1990-06-28 1993-02-23 Applied Materials, Inc. Reduction of particulate contaminants in chemical-vapor-deposition apparatus
US5312245A (en) * 1993-07-16 1994-05-17 International Business Machines Corporation Particulate trap for vertical furnace
US5827370A (en) * 1997-01-13 1998-10-27 Mks Instruments, Inc. Method and apparatus for reducing build-up of material on inner surface of tube downstream from a reaction furnace
JPH10223538A (ja) * 1997-02-07 1998-08-21 Tokyo Electron Ltd 縦型熱処理装置
US6900413B2 (en) * 1998-08-12 2005-05-31 Aviza Technology, Inc. Hot wall rapid thermal processor
US6814813B2 (en) * 2002-04-24 2004-11-09 Micron Technology, Inc. Chemical vapor deposition apparatus
FR2842193B1 (fr) * 2002-07-12 2004-10-01 Messier Bugatti Procede et installation pour le traitement thermique a haute temperature et la densification par infiltration chimique en phase vapeur de textures en carbone
AU2003249028A1 (en) * 2002-07-15 2004-02-02 Aviza Technology, Inc. Thermal processing apparatus and method for evacuating a process chamber
JP4734950B2 (ja) * 2005-02-17 2011-07-27 株式会社デンソー 熱処理装置
US7312422B2 (en) * 2006-03-17 2007-12-25 Momentive Performance Materials Inc. Semiconductor batch heating assembly
US7632354B2 (en) * 2006-08-08 2009-12-15 Tokyo Electron Limited Thermal processing system with improved process gas flow and method for injecting a process gas into a thermal processing system
JP2008053515A (ja) 2006-08-25 2008-03-06 Seiko Instruments Inc 半導体装置およびその製造方法
JP2011129567A (ja) 2009-12-15 2011-06-30 Hitachi Kokusai Electric Inc 熱処理装置
DE202010015018U1 (de) * 2010-11-07 2011-04-14 Bohnet, Hans Anordnung zur Herstellung von strukturierten Substraten
JP5779957B2 (ja) * 2011-04-20 2015-09-16 東京エレクトロン株式会社 ローディングユニット及び処理システム

Also Published As

Publication number Publication date
KR102399773B1 (ko) 2022-05-20
US10510565B2 (en) 2019-12-17
US20180102264A1 (en) 2018-04-12
JP2018064094A (ja) 2018-04-19
JP7034656B2 (ja) 2022-03-14
CN107919302B (zh) 2023-05-02
TW201816956A (zh) 2018-05-01
FR3057391A1 (fr) 2018-04-13
SG10201708389SA (en) 2018-05-30
KR20180040112A (ko) 2018-04-19
TWI736684B (zh) 2021-08-21
CN107919302A (zh) 2018-04-17

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