FR3052291B1 - Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant. - Google Patents
Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant. Download PDFInfo
- Publication number
- FR3052291B1 FR3052291B1 FR1655067A FR1655067A FR3052291B1 FR 3052291 B1 FR3052291 B1 FR 3052291B1 FR 1655067 A FR1655067 A FR 1655067A FR 1655067 A FR1655067 A FR 1655067A FR 3052291 B1 FR3052291 B1 FR 3052291B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- nonvolatile memory
- corresponding device
- diode network
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1655067A FR3052291B1 (fr) | 2016-06-03 | 2016-06-03 | Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant. |
| CN201621453065.2U CN206163529U (zh) | 2016-06-03 | 2016-11-23 | 半导体器件和非易失性存储器 |
| CN201611240241.9A CN107464814B (zh) | 2016-06-03 | 2016-11-23 | 用于非易失性存储器的二极管阵列的制造方法及对应器件 |
| US15/365,143 US10002906B2 (en) | 2016-06-03 | 2016-11-30 | Method for fabricating an array of diodes, in particular for a non-volatile memory, and corresponding device |
| US16/004,195 US10541270B2 (en) | 2016-06-03 | 2018-06-08 | Method for fabricating an array of diodes, in particular for a non-volatile memory, and corresponding device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1655067 | 2016-06-03 | ||
| FR1655067A FR3052291B1 (fr) | 2016-06-03 | 2016-06-03 | Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR3052291A1 FR3052291A1 (fr) | 2017-12-08 |
| FR3052291B1 true FR3052291B1 (fr) | 2018-11-23 |
Family
ID=56404237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1655067A Expired - Fee Related FR3052291B1 (fr) | 2016-06-03 | 2016-06-03 | Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant. |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US10002906B2 (fr) |
| CN (2) | CN206163529U (fr) |
| FR (1) | FR3052291B1 (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3052291B1 (fr) * | 2016-06-03 | 2018-11-23 | Stmicroelectronics (Rousset) Sas | Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant. |
| US11404480B2 (en) * | 2019-12-26 | 2022-08-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory arrays including continuous line-shaped random access memory strips and method forming same |
| CN114530469B (zh) * | 2022-01-17 | 2025-03-18 | 浙江大学 | 一种基于绝缘层上硅衬底的二维材料/硅异质结阵列及其制备方法 |
Family Cites Families (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4268339A (en) * | 1979-07-17 | 1981-05-19 | General Electric Company | Process for radiation cured continuous laminates |
| US5414245A (en) * | 1992-08-03 | 1995-05-09 | Hewlett-Packard Corporation | Thermal-ink heater array using rectifying material |
| US6653733B1 (en) * | 1996-02-23 | 2003-11-25 | Micron Technology, Inc. | Conductors in semiconductor devices |
| US6865117B2 (en) * | 2000-02-11 | 2005-03-08 | Axon Technologies Corporation | Programming circuit for a programmable microelectronic device, system including the circuit, and method of forming the same |
| US6905937B2 (en) * | 2001-06-28 | 2005-06-14 | Sharp Laboratories Of America, Inc. | Methods of fabricating a cross-point resistor memory array |
| US6825058B2 (en) * | 2001-06-28 | 2004-11-30 | Sharp Laboratories Of America, Inc. | Methods of fabricating trench isolated cross-point memory array |
| US6952043B2 (en) * | 2002-06-27 | 2005-10-04 | Matrix Semiconductor, Inc. | Electrically isolated pillars in active devices |
| CN100345299C (zh) * | 2002-11-27 | 2007-10-24 | 旺宏电子股份有限公司 | 含有二极管的掩模式只读存储器及其制造方法 |
| US7402847B2 (en) * | 2005-04-13 | 2008-07-22 | Axon Technologies Corporation | Programmable logic circuit and method of using same |
| DE102005046942A1 (de) * | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Verfahren zur Verbindung von Schichten, entsprechendes Bauelement und organische Leuchtdiode |
| JP5225549B2 (ja) * | 2006-03-15 | 2013-07-03 | 日本碍子株式会社 | 半導体素子 |
| US7989328B2 (en) * | 2006-12-19 | 2011-08-02 | Spansion Llc | Resistive memory array using P-I-N diode select device and methods of fabrication thereof |
| WO2008091837A2 (fr) * | 2007-01-22 | 2008-07-31 | Cree Led Lighting Solutions, Inc. | Émetteurs de lumière insensibles aux défaillances, systèmes comportant des émetteurs de lumière insensibles aux défaillances et procédé de fabrication d'émetteurs de lumière insensibles aux défaillances |
| EP3848970A1 (fr) * | 2007-01-22 | 2021-07-14 | Cree, Inc. | Émetteur à diodes électroluminescentes multiples |
| CN100550409C (zh) * | 2007-06-21 | 2009-10-14 | 复旦大学 | 基于二极管单元选通的相变存储器及其制造方法 |
| JP2009252974A (ja) * | 2008-04-04 | 2009-10-29 | Toshiba Corp | 不揮発性半導体記憶装置とその製造方法 |
| US9458109B2 (en) * | 2008-09-03 | 2016-10-04 | Mallinckrodt Llc | Substituted berbines and processes for their synthesis |
| US7897453B2 (en) * | 2008-12-16 | 2011-03-01 | Sandisk 3D Llc | Dual insulating layer diode with asymmetric interface state and method of fabrication |
| US8089137B2 (en) * | 2009-01-07 | 2012-01-03 | Macronix International Co., Ltd. | Integrated circuit memory with single crystal silicon on silicide driver and manufacturing method |
| US8168538B2 (en) * | 2009-05-26 | 2012-05-01 | Macronix International Co., Ltd. | Buried silicide structure and method for making |
| US20110037054A1 (en) * | 2009-08-17 | 2011-02-17 | Chan-Long Shieh | Amoled with cascaded oled structures |
| TWI492432B (zh) * | 2009-12-17 | 2015-07-11 | Hitachi Ltd | Semiconductor memory device and manufacturing method thereof |
| IT1403137B1 (it) * | 2010-06-28 | 2013-10-04 | Selex Sistemi Integrati Spa | Metodo di fabbricazione di diodi pin verticali |
| US9818478B2 (en) * | 2012-12-07 | 2017-11-14 | Attopsemi Technology Co., Ltd | Programmable resistive device and memory using diode as selector |
| US8659944B2 (en) * | 2010-09-01 | 2014-02-25 | Macronix International Co., Ltd. | Memory architecture of 3D array with diode in memory string |
| CN102412179B (zh) * | 2010-09-21 | 2013-07-17 | 中国科学院上海微系统与信息技术研究所 | 双浅沟道隔离的外延二极管阵列的制备方法 |
| US20120261804A1 (en) * | 2011-04-15 | 2012-10-18 | International Business Machines Corporation | Vertical substrate diode, method of manufacture and design structure |
| FR2981190B1 (fr) * | 2011-10-06 | 2014-03-21 | St Microelectronics Rousset | Circuit d'ecoulement de charges electriques pour une mesure temporelle |
| US8871600B2 (en) * | 2011-11-11 | 2014-10-28 | International Business Machines Corporation | Schottky barrier diodes with a guard ring formed by selective epitaxy |
| US9219056B2 (en) * | 2012-03-27 | 2015-12-22 | International Business Machines Corporation | Passive devices for FinFET integrated circuit technologies |
| US8680573B2 (en) * | 2012-04-25 | 2014-03-25 | International Business Machines Corporation | Diode-triggered silicon controlled rectifier with an integrated diode |
| US9188009B2 (en) * | 2012-10-30 | 2015-11-17 | United Technologies Corporation | Bore cavity thermal conditioning system |
| US9059044B2 (en) * | 2012-11-15 | 2015-06-16 | International Business Machines Corporation | On-chip diode with fully depleted semiconductor devices |
| US9093566B2 (en) * | 2012-12-31 | 2015-07-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | High efficiency FinFET diode |
| US8946766B2 (en) * | 2013-02-27 | 2015-02-03 | International Business Machines Corporation | Bi-directional silicon controlled rectifier structure |
| KR102126967B1 (ko) * | 2013-10-11 | 2020-07-08 | 삼성전자주식회사 | 메모리 소자 및 그 제조 방법 |
| US9318622B1 (en) * | 2015-06-23 | 2016-04-19 | International Business Machines Corporation | Fin-type PIN diode array |
| JP6512025B2 (ja) * | 2015-08-11 | 2019-05-15 | 富士電機株式会社 | 半導体素子及び半導体素子の製造方法 |
| US9793262B1 (en) * | 2016-04-27 | 2017-10-17 | Globalfoundries Inc. | Fin diode with increased junction area |
| FR3051969A1 (fr) * | 2016-05-31 | 2017-12-01 | Stmicroelectronics Rousset | Procede de fabrication de diodes de puissance, en particulier pour former un pont de graetz, et dispositif correspondant |
| FR3052291B1 (fr) * | 2016-06-03 | 2018-11-23 | Stmicroelectronics (Rousset) Sas | Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant. |
| US10290681B2 (en) * | 2017-09-21 | 2019-05-14 | Sandisk Technologies Llc | Array of hole-type surround gate vertical field effect transistors and method of making thereof |
-
2016
- 2016-06-03 FR FR1655067A patent/FR3052291B1/fr not_active Expired - Fee Related
- 2016-11-23 CN CN201621453065.2U patent/CN206163529U/zh not_active Withdrawn - After Issue
- 2016-11-23 CN CN201611240241.9A patent/CN107464814B/zh active Active
- 2016-11-30 US US15/365,143 patent/US10002906B2/en active Active
-
2018
- 2018-06-08 US US16/004,195 patent/US10541270B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20180294313A1 (en) | 2018-10-11 |
| CN206163529U (zh) | 2017-05-10 |
| US20170352703A1 (en) | 2017-12-07 |
| CN107464814B (zh) | 2021-07-20 |
| US10541270B2 (en) | 2020-01-21 |
| CN107464814A (zh) | 2017-12-12 |
| FR3052291A1 (fr) | 2017-12-08 |
| US10002906B2 (en) | 2018-06-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PLFP | Fee payment |
Year of fee payment: 2 |
|
| PLSC | Publication of the preliminary search report |
Effective date: 20171208 |
|
| PLFP | Fee payment |
Year of fee payment: 3 |
|
| PLFP | Fee payment |
Year of fee payment: 4 |
|
| ST | Notification of lapse |
Effective date: 20210206 |