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FR3052291B1 - Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant. - Google Patents

Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant. Download PDF

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Publication number
FR3052291B1
FR3052291B1 FR1655067A FR1655067A FR3052291B1 FR 3052291 B1 FR3052291 B1 FR 3052291B1 FR 1655067 A FR1655067 A FR 1655067A FR 1655067 A FR1655067 A FR 1655067A FR 3052291 B1 FR3052291 B1 FR 3052291B1
Authority
FR
France
Prior art keywords
manufacturing
nonvolatile memory
corresponding device
diode network
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1655067A
Other languages
English (en)
Other versions
FR3052291A1 (fr
Inventor
Francesco La Rosa
Stephan Niel
Arnaud Regnier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Rousset SAS
Original Assignee
STMicroelectronics Rousset SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Rousset SAS filed Critical STMicroelectronics Rousset SAS
Priority to FR1655067A priority Critical patent/FR3052291B1/fr
Priority to CN201621453065.2U priority patent/CN206163529U/zh
Priority to CN201611240241.9A priority patent/CN107464814B/zh
Priority to US15/365,143 priority patent/US10002906B2/en
Publication of FR3052291A1 publication Critical patent/FR3052291A1/fr
Priority to US16/004,195 priority patent/US10541270B2/en
Application granted granted Critical
Publication of FR3052291B1 publication Critical patent/FR3052291B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B69/00Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/20Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR1655067A 2016-06-03 2016-06-03 Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant. Expired - Fee Related FR3052291B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1655067A FR3052291B1 (fr) 2016-06-03 2016-06-03 Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant.
CN201621453065.2U CN206163529U (zh) 2016-06-03 2016-11-23 半导体器件和非易失性存储器
CN201611240241.9A CN107464814B (zh) 2016-06-03 2016-11-23 用于非易失性存储器的二极管阵列的制造方法及对应器件
US15/365,143 US10002906B2 (en) 2016-06-03 2016-11-30 Method for fabricating an array of diodes, in particular for a non-volatile memory, and corresponding device
US16/004,195 US10541270B2 (en) 2016-06-03 2018-06-08 Method for fabricating an array of diodes, in particular for a non-volatile memory, and corresponding device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1655067 2016-06-03
FR1655067A FR3052291B1 (fr) 2016-06-03 2016-06-03 Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant.

Publications (2)

Publication Number Publication Date
FR3052291A1 FR3052291A1 (fr) 2017-12-08
FR3052291B1 true FR3052291B1 (fr) 2018-11-23

Family

ID=56404237

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1655067A Expired - Fee Related FR3052291B1 (fr) 2016-06-03 2016-06-03 Procede de fabrication d'un reseau de diodes, en particulier pour une memoire non volatile, et dispositif correspondant.

Country Status (3)

Country Link
US (2) US10002906B2 (fr)
CN (2) CN206163529U (fr)
FR (1) FR3052291B1 (fr)

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* Cited by examiner, † Cited by third party
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US11404480B2 (en) * 2019-12-26 2022-08-02 Taiwan Semiconductor Manufacturing Company, Ltd. Memory arrays including continuous line-shaped random access memory strips and method forming same
CN114530469B (zh) * 2022-01-17 2025-03-18 浙江大学 一种基于绝缘层上硅衬底的二维材料/硅异质结阵列及其制备方法

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Also Published As

Publication number Publication date
US20180294313A1 (en) 2018-10-11
CN206163529U (zh) 2017-05-10
US20170352703A1 (en) 2017-12-07
CN107464814B (zh) 2021-07-20
US10541270B2 (en) 2020-01-21
CN107464814A (zh) 2017-12-12
FR3052291A1 (fr) 2017-12-08
US10002906B2 (en) 2018-06-19

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