FR3050023B1 - Procede et systeme d'inspection et de mesure optique d'une face d'un objet - Google Patents
Procede et systeme d'inspection et de mesure optique d'une face d'un objet Download PDFInfo
- Publication number
- FR3050023B1 FR3050023B1 FR1653158A FR1653158A FR3050023B1 FR 3050023 B1 FR3050023 B1 FR 3050023B1 FR 1653158 A FR1653158 A FR 1653158A FR 1653158 A FR1653158 A FR 1653158A FR 3050023 B1 FR3050023 B1 FR 3050023B1
- Authority
- FR
- France
- Prior art keywords
- face
- measurement
- signal
- optical inspection
- inspecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005259 measurement Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 4
- 238000007689 inspection Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
- 238000000605 extraction Methods 0.000 abstract 2
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02083—Interferometers characterised by particular signal processing and presentation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02083—Interferometers characterised by particular signal processing and presentation
- G01B9/02084—Processing in the Fourier or frequency domain when not imaged in the frequency domain
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/0209—Low-coherence interferometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1653158A FR3050023B1 (fr) | 2016-04-11 | 2016-04-11 | Procede et systeme d'inspection et de mesure optique d'une face d'un objet |
| EP17719184.8A EP3443295A1 (fr) | 2016-04-11 | 2017-04-05 | Procede et systeme d'inspection et de mesure optique d'une face d'un objet |
| CN201780022856.0A CN109073355A (zh) | 2016-04-11 | 2017-04-05 | 用于光学检查和测量物体表面的方法和系统 |
| PCT/EP2017/058145 WO2017178306A1 (fr) | 2016-04-11 | 2017-04-05 | Procede et systeme d'inspection et de mesure optique d'une face d'un objet |
| KR1020187029944A KR20180127412A (ko) | 2016-04-11 | 2017-04-05 | 물체의 면을 광학적으로 측정하고 검사하기 위한 방법 및 시스템 |
| US16/092,751 US20190137265A1 (en) | 2016-04-11 | 2017-04-05 | Method and system for the optical inspection and measurement of a face of an object |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1653158A FR3050023B1 (fr) | 2016-04-11 | 2016-04-11 | Procede et systeme d'inspection et de mesure optique d'une face d'un objet |
| FR1653158 | 2016-04-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR3050023A1 FR3050023A1 (fr) | 2017-10-13 |
| FR3050023B1 true FR3050023B1 (fr) | 2020-02-14 |
Family
ID=56322099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1653158A Active FR3050023B1 (fr) | 2016-04-11 | 2016-04-11 | Procede et systeme d'inspection et de mesure optique d'une face d'un objet |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20190137265A1 (fr) |
| EP (1) | EP3443295A1 (fr) |
| KR (1) | KR20180127412A (fr) |
| CN (1) | CN109073355A (fr) |
| FR (1) | FR3050023B1 (fr) |
| WO (1) | WO2017178306A1 (fr) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3089286B1 (fr) * | 2018-11-30 | 2022-04-01 | Unity Semiconductor | Procédé et système pour mesurer une surface d’un objet comprenant des structures différentes par interférométrie à faible cohérence |
| WO2020215050A1 (fr) | 2019-04-19 | 2020-10-22 | Arizona Board Of Regents On Behalf Of The University Of Arizona | Dispositif d'imagerie entièrement mise au point et méthode associée |
| US11921285B2 (en) * | 2019-04-19 | 2024-03-05 | Arizona Board Of Regents On Behalf Of The University Of Arizona | On-chip signal processing method and pixel-array signal |
| CN110160450B (zh) * | 2019-05-13 | 2020-12-25 | 天津大学 | 基于白光干涉光谱的大台阶高度的快速测量方法 |
| JP7312278B2 (ja) * | 2019-06-07 | 2023-07-20 | フォーガル ナノテック | 光学素子の界面を測定するための装置および方法 |
| CN111386441B (zh) * | 2020-02-24 | 2021-02-19 | 长江存储科技有限责任公司 | 用于半导体芯片表面形貌计量的系统 |
| CN111356897B (zh) * | 2020-02-24 | 2021-02-19 | 长江存储科技有限责任公司 | 用于半导体芯片表面形貌计量的系统和方法 |
| CN111406198B (zh) | 2020-02-24 | 2021-02-19 | 长江存储科技有限责任公司 | 用于半导体芯片表面形貌计量的系统和方法 |
| CN111356896B (zh) | 2020-02-24 | 2021-01-12 | 长江存储科技有限责任公司 | 用于半导体芯片表面形貌计量的系统和方法 |
| CN113465534B (zh) * | 2021-06-25 | 2022-04-19 | 浙江大学 | 一种基于白光干涉的微纳深沟槽结构快速测量方法 |
| CN114383528A (zh) * | 2022-01-10 | 2022-04-22 | 湖南伊鸿健康科技有限公司 | 计数池深度标定方法及系统、智能终端与存储介质 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5471303A (en) * | 1994-04-29 | 1995-11-28 | Wyko Corporation | Combination of white-light scanning and phase-shifting interferometry for surface profile measurements |
| JP2000097648A (ja) * | 1998-09-25 | 2000-04-07 | Toshiba Corp | 段差測定装置および段差測定方法 |
| JP2003065724A (ja) * | 2001-08-29 | 2003-03-05 | Shin Etsu Handotai Co Ltd | Ftir法による膜厚測定方法および半導体ウェーハの製造方法 |
| CN100587394C (zh) * | 2007-09-20 | 2010-02-03 | 华中科技大学 | 一种微纳深沟槽结构测量方法及装置 |
| US8004688B2 (en) * | 2008-11-26 | 2011-08-23 | Zygo Corporation | Scan error correction in low coherence scanning interferometry |
-
2016
- 2016-04-11 FR FR1653158A patent/FR3050023B1/fr active Active
-
2017
- 2017-04-05 WO PCT/EP2017/058145 patent/WO2017178306A1/fr not_active Ceased
- 2017-04-05 EP EP17719184.8A patent/EP3443295A1/fr not_active Withdrawn
- 2017-04-05 KR KR1020187029944A patent/KR20180127412A/ko not_active Withdrawn
- 2017-04-05 CN CN201780022856.0A patent/CN109073355A/zh active Pending
- 2017-04-05 US US16/092,751 patent/US20190137265A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN109073355A (zh) | 2018-12-21 |
| KR20180127412A (ko) | 2018-11-28 |
| FR3050023A1 (fr) | 2017-10-13 |
| EP3443295A1 (fr) | 2019-02-20 |
| WO2017178306A1 (fr) | 2017-10-19 |
| US20190137265A1 (en) | 2019-05-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PLFP | Fee payment |
Year of fee payment: 2 |
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| PLSC | Publication of the preliminary search report |
Effective date: 20171013 |
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| TP | Transmission of property |
Owner name: UNITY SEMICONDUCTOR, FR Effective date: 20180316 |
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| PLFP | Fee payment |
Year of fee payment: 3 |
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| PLFP | Fee payment |
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