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FR2926890B1 - Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques - Google Patents

Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques

Info

Publication number
FR2926890B1
FR2926890B1 FR0850582A FR0850582A FR2926890B1 FR 2926890 B1 FR2926890 B1 FR 2926890B1 FR 0850582 A FR0850582 A FR 0850582A FR 0850582 A FR0850582 A FR 0850582A FR 2926890 B1 FR2926890 B1 FR 2926890B1
Authority
FR
France
Prior art keywords
electronic modules
handling
equipment
transporting
testing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0850582A
Other languages
English (en)
Other versions
FR2926890A1 (fr
Inventor
Philippe Planelle
Rene Monnet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Grenoble 2 SAS
Original Assignee
STMicroelectronics Grenoble 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0850582A priority Critical patent/FR2926890B1/fr
Application filed by STMicroelectronics Grenoble 2 SAS filed Critical STMicroelectronics Grenoble 2 SAS
Priority to KR1020107017550A priority patent/KR20100129724A/ko
Priority to US12/864,867 priority patent/US8448332B2/en
Priority to EP09705834A priority patent/EP2238466A1/fr
Priority to JP2010544680A priority patent/JP5406856B2/ja
Priority to PCT/EP2009/050903 priority patent/WO2009095389A1/fr
Priority to CN200980103610.1A priority patent/CN101971041B/zh
Publication of FR2926890A1 publication Critical patent/FR2926890A1/fr
Application granted granted Critical
Publication of FR2926890B1 publication Critical patent/FR2926890B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53022—Means to assemble or disassemble with means to test work or product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
FR0850582A 2008-01-30 2008-01-30 Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques Expired - Fee Related FR2926890B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR0850582A FR2926890B1 (fr) 2008-01-30 2008-01-30 Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques
US12/864,867 US8448332B2 (en) 2008-01-30 2009-01-28 Method and device for transporting electronic modules
EP09705834A EP2238466A1 (fr) 2008-01-30 2009-01-28 Procédé et dispositif pour transporter des modules électroniques
JP2010544680A JP5406856B2 (ja) 2008-01-30 2009-01-28 電子モジュールの移送のための方法及びデバイス
KR1020107017550A KR20100129724A (ko) 2008-01-30 2009-01-28 전자 모듈 전송을 위한 방법 및 장치
PCT/EP2009/050903 WO2009095389A1 (fr) 2008-01-30 2009-01-28 Procédé et dispositif pour transporter des modules électroniques
CN200980103610.1A CN101971041B (zh) 2008-01-30 2009-01-28 用于传送电子模块的方法和装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0850582A FR2926890B1 (fr) 2008-01-30 2008-01-30 Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques

Publications (2)

Publication Number Publication Date
FR2926890A1 FR2926890A1 (fr) 2009-07-31
FR2926890B1 true FR2926890B1 (fr) 2011-01-07

Family

ID=39712617

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0850582A Expired - Fee Related FR2926890B1 (fr) 2008-01-30 2008-01-30 Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques

Country Status (7)

Country Link
US (1) US8448332B2 (fr)
EP (1) EP2238466A1 (fr)
JP (1) JP5406856B2 (fr)
KR (1) KR20100129724A (fr)
CN (1) CN101971041B (fr)
FR (1) FR2926890B1 (fr)
WO (1) WO2009095389A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012209353B4 (de) * 2012-06-04 2018-12-06 Continental Automotive Gmbh Prüfvorrichtung zum Testen einer Flachbaugruppe
TWI566918B (zh) * 2015-07-29 2017-01-21 財團法人工業技術研究院 立體列印系統
US9698040B2 (en) 2015-10-29 2017-07-04 Stmicroelectronics (Malta) Ltd Semiconductor device carrier tape with image sensor detectable dimples
CN115870746B (zh) * 2022-12-09 2024-12-06 苏州浪潮智能科技有限公司 组装设备

Family Cites Families (30)

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US3785507A (en) * 1968-12-19 1974-01-15 Teledyne Inc Die sorting system
GB1294973A (fr) * 1969-02-12 1972-11-01
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US3949925A (en) * 1974-10-03 1976-04-13 The Jade Corporation Outer lead bonder
US4149665A (en) * 1977-11-04 1979-04-17 Nasa Bonding machine for forming a solar array strip
US4624358A (en) * 1983-03-07 1986-11-25 Tokyo Shibaura Denki Kabushiki Kaisha Device for transferring lead frame
DE3336606A1 (de) * 1983-10-07 1985-04-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur mikropackherstellung
US4801561A (en) * 1984-07-05 1989-01-31 National Semiconductor Corporation Method for making a pre-testable semiconductor die package
JPS62220460A (ja) * 1986-03-14 1987-09-28 松下電器産業株式会社 電子部品集合体
JPH0266474A (ja) * 1988-09-01 1990-03-06 Tokyo Electron Ltd 半導体素子の検査方法
US5173451A (en) * 1991-06-04 1992-12-22 Micron Technology, Inc. Soft bond for semiconductor dies
US5203143A (en) * 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
BE1007866A3 (nl) * 1993-12-10 1995-11-07 Koninkl Philips Electronics Nv Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager.
JPH0969636A (ja) * 1995-08-30 1997-03-11 Fuji Electric Co Ltd 複合ダイオードチップ及びブリッジ整流器
EP0962777A3 (fr) * 1998-06-02 2002-12-11 Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation) Appareil pour tester des plaques de circuits imprimés
US6136137A (en) * 1998-07-06 2000-10-24 Micron Technology, Inc. System and method for dicing semiconductor components
US6543512B1 (en) * 1998-10-28 2003-04-08 Micron Technology, Inc. Carrier, method and system for handling semiconductor components
US6433360B1 (en) * 1999-01-15 2002-08-13 Xilinx, Inc. Structure and method of testing failed or returned die to determine failure location and type
TW451372B (en) * 1999-06-17 2001-08-21 Shinkawa Kk Die-holding mechanism, die-packing device and die-bonding device
US6790710B2 (en) * 2002-01-31 2004-09-14 Asat Limited Method of manufacturing an integrated circuit package
JP2003066109A (ja) * 2001-08-28 2003-03-05 Fujitsu Ltd 半導体試験装置及び半導体試験方法
US7127805B2 (en) * 2002-11-20 2006-10-31 Intel Corporation Electronic device carrier and manufacturing tape
JP2004170337A (ja) * 2002-11-22 2004-06-17 Kawasaki Microelectronics Kk Ｉｃパッケージトレイ、ｉｃテスト装置およびテスト方法
JP4408690B2 (ja) * 2003-12-09 2010-02-03 Ｎｅｃエレクトロニクス株式会社 半導体パッケージのテストシステム及びテスト方法
US7257887B2 (en) * 2004-06-14 2007-08-21 David Lee Die holding apparatus for bonding systems
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JP4403458B2 (ja) * 2004-10-28 2010-01-27 東洋精密工業株式会社 チップトレイ
US8069636B1 (en) * 2008-03-05 2011-12-06 Charles Gutentag Method and apparatus to facilitate retention and removal of components placed on adhesive backed carrier tape for automated handling
US8793650B2 (en) * 2010-06-11 2014-07-29 Microsoft Corporation Dynamic web application notifications including task bar overlays

Also Published As

Publication number Publication date
WO2009095389A1 (fr) 2009-08-06
EP2238466A1 (fr) 2010-10-13
CN101971041A (zh) 2011-02-09
KR20100129724A (ko) 2010-12-09
US8448332B2 (en) 2013-05-28
FR2926890A1 (fr) 2009-07-31
JP5406856B2 (ja) 2014-02-05
CN101971041B (zh) 2014-08-20
JP2011512522A (ja) 2011-04-21
US20100325870A1 (en) 2010-12-30

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20150930