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FR2915625B1 - Procede de transfert d'une couche epitaxiale - Google Patents

Procede de transfert d'une couche epitaxiale

Info

Publication number
FR2915625B1
FR2915625B1 FR0754777A FR0754777A FR2915625B1 FR 2915625 B1 FR2915625 B1 FR 2915625B1 FR 0754777 A FR0754777 A FR 0754777A FR 0754777 A FR0754777 A FR 0754777A FR 2915625 B1 FR2915625 B1 FR 2915625B1
Authority
FR
France
Prior art keywords
transferring
epitaxial layer
epitaxial
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0754777A
Other languages
English (en)
Other versions
FR2915625A1 (fr
Inventor
Vaillant Yves Matthieu Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0754777A priority Critical patent/FR2915625B1/fr
Application filed by Soitec SA filed Critical Soitec SA
Priority to CN2008800066321A priority patent/CN101636833B/zh
Priority to KR1020097018793A priority patent/KR101527063B1/ko
Priority to PCT/IB2008/000967 priority patent/WO2008132569A1/fr
Priority to JP2010504889A priority patent/JP5380429B2/ja
Priority to US12/528,573 priority patent/US7981768B2/en
Priority to EP08737488A priority patent/EP2140488A1/fr
Publication of FR2915625A1 publication Critical patent/FR2915625A1/fr
Application granted granted Critical
Publication of FR2915625B1 publication Critical patent/FR2915625B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/0242—Crystalline insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02441—Group 14 semiconducting materials
    • H01L21/0245—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02455—Group 13/15 materials
    • H01L21/02458—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/0254—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/02546—Arsenides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
FR0754777A 2007-04-27 2007-04-27 Procede de transfert d'une couche epitaxiale Active FR2915625B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR0754777A FR2915625B1 (fr) 2007-04-27 2007-04-27 Procede de transfert d'une couche epitaxiale
KR1020097018793A KR101527063B1 (ko) 2007-04-27 2008-04-15 에피택시층 이동 방법
PCT/IB2008/000967 WO2008132569A1 (fr) 2007-04-27 2008-04-15 Procédé pour transférer une couche épitaxiale
JP2010504889A JP5380429B2 (ja) 2007-04-27 2008-04-15 エピタキシャル層を移動させる方法
CN2008800066321A CN101636833B (zh) 2007-04-27 2008-04-15 转移外延层的方法
US12/528,573 US7981768B2 (en) 2007-04-27 2008-04-15 Method for transferring an epitaxial layer
EP08737488A EP2140488A1 (fr) 2007-04-27 2008-04-15 Procédé pour transférer une couche épitaxiale

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0754777A FR2915625B1 (fr) 2007-04-27 2007-04-27 Procede de transfert d'une couche epitaxiale

Publications (2)

Publication Number Publication Date
FR2915625A1 FR2915625A1 (fr) 2008-10-31
FR2915625B1 true FR2915625B1 (fr) 2009-10-02

Family

ID=39212207

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0754777A Active FR2915625B1 (fr) 2007-04-27 2007-04-27 Procede de transfert d'une couche epitaxiale

Country Status (7)

Country Link
US (1) US7981768B2 (fr)
EP (1) EP2140488A1 (fr)
JP (1) JP5380429B2 (fr)
KR (1) KR101527063B1 (fr)
CN (1) CN101636833B (fr)
FR (1) FR2915625B1 (fr)
WO (1) WO2008132569A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2467935B (en) 2009-02-19 2013-10-30 Iqe Silicon Compounds Ltd Formation of thin layers of GaAs and germanium materials
US8492325B2 (en) 2010-03-01 2013-07-23 The Procter & Gamble Company Dual-usage liquid laundry detergents comprising a silicone anti-foam
DE102010046215B4 (de) * 2010-09-21 2019-01-03 Infineon Technologies Austria Ag Halbleiterkörper mit verspanntem Bereich, Elektronisches Bauelement und ein Verfahren zum Erzeugen des Halbleiterkörpers.
CN104335365A (zh) * 2012-02-07 2015-02-04 密歇根大学董事会 用于对在外延剥离之后的晶圆进行再利用的热表面处理
US9257339B2 (en) * 2012-05-04 2016-02-09 Silicon Genesis Corporation Techniques for forming optoelectronic devices
CN103839976A (zh) * 2012-11-27 2014-06-04 中国科学院微电子研究所 一种硅基绝缘体上砷化镓衬底结构及其制备方法
US9064789B2 (en) 2013-08-12 2015-06-23 International Business Machines Corporation Bonded epitaxial oxide structures for compound semiconductor on silicon substrates
JP2015065241A (ja) * 2013-09-24 2015-04-09 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
DE102013020693A1 (de) * 2013-12-04 2015-06-11 Siltectra Gmbh Verfahren zum Erzeugen großflächiger Festkörperschichten
CN108598218B (zh) * 2018-04-26 2020-08-11 上海空间电源研究所 一种外延层刚性-柔性衬底无机键合转移方法
CN109545999B (zh) * 2018-11-21 2021-05-04 京东方科技集团股份有限公司 初始显示装置和柔性显示面板的制造方法
CN111893566A (zh) * 2020-07-21 2020-11-06 璨隆科技发展有限公司 一种氮化镓晶体的制备方法
CN119230380A (zh) * 2023-06-29 2024-12-31 苏州能讯高能半导体有限公司 外延结构的制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2681472B1 (fr) 1991-09-18 1993-10-29 Commissariat Energie Atomique Procede de fabrication de films minces de materiau semiconducteur.
JP3112106B2 (ja) * 1991-10-11 2000-11-27 キヤノン株式会社 半導体基材の作製方法
EP1655633A3 (fr) * 1996-08-27 2006-06-21 Seiko Epson Corporation Procédé de détachement, procédé de transfert d' un dispositif à couche mince, d' un dispositif à circuit intégré à couche mince et d'un dispositif d'affichage à cristaux liquides
DE19640594B4 (de) * 1996-10-01 2016-08-04 Osram Gmbh Bauelement
US6210479B1 (en) * 1999-02-26 2001-04-03 International Business Machines Corporation Product and process for forming a semiconductor structure on a host substrate
JP2002110949A (ja) * 2000-09-28 2002-04-12 Canon Inc Ｓｏｉの熱処理方法及び製造方法
US6940089B2 (en) * 2001-04-04 2005-09-06 Massachusetts Institute Of Technology Semiconductor device structure
JP3803606B2 (ja) * 2001-04-13 2006-08-02 松下電器産業株式会社 Ｉｉｉ族窒化物半導体基板の製造方法
US6723165B2 (en) * 2001-04-13 2004-04-20 Matsushita Electric Industrial Co., Ltd. Method for fabricating Group III nitride semiconductor substrate
ATE393473T1 (de) * 2004-06-11 2008-05-15 Soitec Silicon On Insulator Verfahren zur herstellung eines verbundsubstrats
JP2006287166A (ja) * 2005-04-05 2006-10-19 Advanced Lcd Technologies Development Center Co Ltd 半導体素子保持装置、半導体素子の剥離方法および表示装置
JP2006344865A (ja) * 2005-06-10 2006-12-21 Toyoko Kagaku Co Ltd Ｓｏｉ基板及び該基板の製造方法
US7608471B2 (en) * 2005-08-09 2009-10-27 Avago Technologies General Ip (Singapore) Pte. Ltd. Method and apparatus for integrating III-V semiconductor devices into silicon processes

Also Published As

Publication number Publication date
CN101636833A (zh) 2010-01-27
FR2915625A1 (fr) 2008-10-31
JP2010525599A (ja) 2010-07-22
EP2140488A1 (fr) 2010-01-06
KR101527063B1 (ko) 2015-06-08
WO2008132569A1 (fr) 2008-11-06
US7981768B2 (en) 2011-07-19
US20110008948A1 (en) 2011-01-13
CN101636833B (zh) 2011-06-08
KR20100014953A (ko) 2010-02-11
JP5380429B2 (ja) 2014-01-08

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