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FR2970116B1 - METHOD FOR ENCAPSULATING A MICROCOMPONENT - Google Patents

METHOD FOR ENCAPSULATING A MICROCOMPONENT

Info

Publication number
FR2970116B1
FR2970116B1 FR1150046A FR1150046A FR2970116B1 FR 2970116 B1 FR2970116 B1 FR 2970116B1 FR 1150046 A FR1150046 A FR 1150046A FR 1150046 A FR1150046 A FR 1150046A FR 2970116 B1 FR2970116 B1 FR 2970116B1
Authority
FR
France
Prior art keywords
microcomponent
encapsulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1150046A
Other languages
French (fr)
Other versions
FR2970116A1 (en
Inventor
Fabrice Jacquet
David Henry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR1150046A priority Critical patent/FR2970116B1/en
Priority to EP12700322.6A priority patent/EP2661413B1/en
Priority to US13/977,897 priority patent/US8906750B2/en
Priority to PCT/EP2012/050023 priority patent/WO2012093105A1/en
Publication of FR2970116A1 publication Critical patent/FR2970116A1/en
Application granted granted Critical
Publication of FR2970116B1 publication Critical patent/FR2970116B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
FR1150046A 2011-01-04 2011-01-04 METHOD FOR ENCAPSULATING A MICROCOMPONENT Expired - Fee Related FR2970116B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1150046A FR2970116B1 (en) 2011-01-04 2011-01-04 METHOD FOR ENCAPSULATING A MICROCOMPONENT
EP12700322.6A EP2661413B1 (en) 2011-01-04 2012-01-02 Method for encapsulating a micro-component
US13/977,897 US8906750B2 (en) 2011-01-04 2012-01-02 Method of encapsulation of a microcomponent
PCT/EP2012/050023 WO2012093105A1 (en) 2011-01-04 2012-01-02 Method for encapsulating a micro-component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1150046A FR2970116B1 (en) 2011-01-04 2011-01-04 METHOD FOR ENCAPSULATING A MICROCOMPONENT

Publications (2)

Publication Number Publication Date
FR2970116A1 FR2970116A1 (en) 2012-07-06
FR2970116B1 true FR2970116B1 (en) 2013-08-16

Family

ID=44515193

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1150046A Expired - Fee Related FR2970116B1 (en) 2011-01-04 2011-01-04 METHOD FOR ENCAPSULATING A MICROCOMPONENT

Country Status (1)

Country Link
FR (1) FR2970116B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3035267B1 (en) * 2015-04-20 2018-05-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives ELECTRONIC CHIP COMPRISING A PROTECTED BACK PANEL
FR3042909B1 (en) * 2015-10-21 2017-12-15 Commissariat Energie Atomique METHOD FOR ENCAPSULATING A MICROELECTRONIC COMPONENT

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080283943A1 (en) * 2005-11-17 2008-11-20 Koninklijke Philips Electronics, N.V. Electronic Device Comprising a Mems Element
US20070298532A1 (en) * 2006-06-27 2007-12-27 Andrew Machauf Micro-Electro-mechanical (MEMS) encapsulation using buried porous silicon
US20080290494A1 (en) * 2007-05-21 2008-11-27 Markus Lutz Backside release and/or encapsulation of microelectromechanical structures and method of manufacturing same
US7993950B2 (en) * 2008-04-30 2011-08-09 Cavendish Kinetics, Ltd. System and method of encapsulation
EP2256084B1 (en) * 2009-05-27 2012-07-11 Nxp B.V. Method of manufacturing a MEMS element

Also Published As

Publication number Publication date
FR2970116A1 (en) 2012-07-06

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Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 6

ST Notification of lapse

Effective date: 20170929