FR2953641B1 - Circuit de transistors homogenes sur seoi avec grille de controle arriere enterree sous la couche isolante - Google Patents
Circuit de transistors homogenes sur seoi avec grille de controle arriere enterree sous la couche isolanteInfo
- Publication number
- FR2953641B1 FR2953641B1 FR0958747A FR0958747A FR2953641B1 FR 2953641 B1 FR2953641 B1 FR 2953641B1 FR 0958747 A FR0958747 A FR 0958747A FR 0958747 A FR0958747 A FR 0958747A FR 2953641 B1 FR2953641 B1 FR 2953641B1
- Authority
- FR
- France
- Prior art keywords
- transistor
- region
- insulating layer
- bured
- seoi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/90—Masterslice integrated circuits
- H10D84/903—Masterslice integrated circuits comprising field effect technology
- H10D84/907—CMOS gate arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
- Element Separation (AREA)
- Logic Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0958747A FR2953641B1 (fr) | 2009-12-08 | 2009-12-08 | Circuit de transistors homogenes sur seoi avec grille de controle arriere enterree sous la couche isolante |
| SG2010087047A SG172545A1 (en) | 2009-12-08 | 2010-11-25 | Circuit of uniform transistors on seoi with buried back control gate beneath the insulating film |
| TW099140776A TW201131739A (en) | 2009-12-08 | 2010-11-25 | Circuit of uniform transistors on SeOI with buried back control gate beneath the insulating film |
| JP2010263678A JP2011166116A (ja) | 2009-12-08 | 2010-11-26 | 絶縁膜下の埋め込みバック・コントロール・ゲートを有するSeOI上の同型のトランジスタからなる回路 |
| KR1020100118916A KR20110065343A (ko) | 2009-12-08 | 2010-11-26 | 절연막 아래 후방 컨트롤 게이트가 매설된 절연기판상 반도체(SeOI) 상의 균일한 트랜지스터 회로 |
| CN2010105670660A CN102088027A (zh) | 2009-12-08 | 2010-11-26 | 具有绝缘膜下埋入背控制栅极的SeOI上一致晶体管电路 |
| EP10192766A EP2333833A1 (fr) | 2009-12-08 | 2010-11-26 | Circuit de transistors uniformes sur SOI avec grille de contrôle arrière enterrée au dessous du film d'isolation |
| US12/961,293 US8384425B2 (en) | 2009-12-08 | 2010-12-06 | Arrays of transistors with back control gates buried beneath the insulating film of a semiconductor-on-insulator substrate |
| US13/013,580 US8508289B2 (en) | 2009-12-08 | 2011-01-25 | Data-path cell on an SeOI substrate with a back control gate beneath the insulating layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0958747A FR2953641B1 (fr) | 2009-12-08 | 2009-12-08 | Circuit de transistors homogenes sur seoi avec grille de controle arriere enterree sous la couche isolante |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2953641A1 FR2953641A1 (fr) | 2011-06-10 |
| FR2953641B1 true FR2953641B1 (fr) | 2012-02-10 |
Family
ID=42102200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0958747A Active FR2953641B1 (fr) | 2009-12-08 | 2009-12-08 | Circuit de transistors homogenes sur seoi avec grille de controle arriere enterree sous la couche isolante |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8384425B2 (fr) |
| EP (1) | EP2333833A1 (fr) |
| JP (1) | JP2011166116A (fr) |
| KR (1) | KR20110065343A (fr) |
| CN (1) | CN102088027A (fr) |
| FR (1) | FR2953641B1 (fr) |
| SG (1) | SG172545A1 (fr) |
| TW (1) | TW201131739A (fr) |
Families Citing this family (23)
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| US8196086B2 (en) * | 2010-07-21 | 2012-06-05 | Lsi Corporation | Granular channel width for power optimization |
| FR2987709B1 (fr) | 2012-03-05 | 2017-04-28 | Soitec Silicon On Insulator | Table de correspondance |
| FR2987710B1 (fr) * | 2012-03-05 | 2017-04-28 | Soitec Silicon On Insulator | Architecture de table de correspondance |
| FR2988513B1 (fr) | 2012-03-23 | 2014-11-21 | Soitec Silicon On Insulator | Cellule eprom |
| CN103985712B (zh) * | 2013-02-08 | 2017-02-08 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
| US8748245B1 (en) | 2013-03-27 | 2014-06-10 | Io Semiconductor, Inc. | Semiconductor-on-insulator integrated circuit with interconnect below the insulator |
| US9466536B2 (en) | 2013-03-27 | 2016-10-11 | Qualcomm Incorporated | Semiconductor-on-insulator integrated circuit with back side gate |
| US9478507B2 (en) | 2013-03-27 | 2016-10-25 | Qualcomm Incorporated | Integrated circuit assembly with faraday cage |
| FR3009149A1 (fr) | 2013-07-24 | 2015-01-30 | St Microelectronics Sa | Element a retard variable |
| US9966467B2 (en) * | 2013-09-27 | 2018-05-08 | Phison Electronics Corp. | Integrated circuit and code generating method |
| CN114898790A (zh) * | 2016-01-29 | 2022-08-12 | 三星电子株式会社 | 用于选择性地执行隔离功能的半导体器件及其布局替代方法 |
| US10114919B2 (en) * | 2016-02-12 | 2018-10-30 | Globalfoundries Inc. | Placing and routing method for implementing back bias in FDSOI |
| EP3244449A1 (fr) * | 2016-05-13 | 2017-11-15 | NXP USA, Inc. | Circuit intégré à cellules de réserve |
| US20170338343A1 (en) * | 2016-05-23 | 2017-11-23 | Globalfoundries Inc. | High-voltage transistor device |
| US10254340B2 (en) | 2016-09-16 | 2019-04-09 | International Business Machines Corporation | Independently driving built-in self test circuitry over a range of operating conditions |
| US10469076B2 (en) * | 2016-11-22 | 2019-11-05 | The Curators Of The University Of Missouri | Power gating circuit utilizing double-gate fully depleted silicon-on-insulator transistor |
| US10374092B2 (en) * | 2017-04-17 | 2019-08-06 | Globalfoundries Inc. | Power amplifier ramping and power control with forward and reverse back-gate bias |
| DE102019200543A1 (de) | 2019-01-17 | 2020-07-23 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektrochemischen Zelle |
| CN109784483B (zh) * | 2019-01-24 | 2022-09-09 | 电子科技大学 | 基于fd-soi工艺的二值化卷积神经网络内存内计算加速器 |
| TWI702534B (zh) * | 2019-07-10 | 2020-08-21 | 尼克森微電子股份有限公司 | 功率金屬氧化物半導體電晶體的模擬方法 |
| KR20220037011A (ko) | 2020-09-16 | 2022-03-24 | 삼성전자주식회사 | 반도체 장치 |
| CN112687301B (zh) * | 2020-12-31 | 2024-03-19 | 广东省大湾区集成电路与系统应用研究院 | 存储单元及存储器 |
| CN113035864B (zh) * | 2021-03-05 | 2023-01-24 | 泉芯集成电路制造(济南)有限公司 | 电源配置结构、集成电路器件和电子设备 |
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| FR2925223B1 (fr) | 2007-12-18 | 2010-02-19 | Soitec Silicon On Insulator | Procede d'assemblage avec marques enterrees |
| US7593265B2 (en) | 2007-12-28 | 2009-09-22 | Sandisk Corporation | Low noise sense amplifier array and method for nonvolatile memory |
| US8148242B2 (en) | 2008-02-20 | 2012-04-03 | Soitec | Oxidation after oxide dissolution |
| JP6053250B2 (ja) | 2008-06-12 | 2016-12-27 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体装置 |
| US8384156B2 (en) | 2008-06-13 | 2013-02-26 | Yale University | Complementary metal oxide semiconductor devices |
| US8120110B2 (en) | 2008-08-08 | 2012-02-21 | International Business Machines Corporation | Semiconductor structure including a high performance FET and a high voltage FET on a SOI substrate |
| US8012814B2 (en) | 2008-08-08 | 2011-09-06 | International Business Machines Corporation | Method of forming a high performance fet and a high voltage fet on a SOI substrate |
| KR101623958B1 (ko) | 2008-10-01 | 2016-05-25 | 삼성전자주식회사 | 인버터 및 그의 동작방법과 인버터를 포함하는 논리회로 |
| KR101522400B1 (ko) | 2008-11-10 | 2015-05-21 | 삼성전자주식회사 | 인버터 및 그를 포함하는 논리소자 |
-
2009
- 2009-12-08 FR FR0958747A patent/FR2953641B1/fr active Active
-
2010
- 2010-11-25 TW TW099140776A patent/TW201131739A/zh unknown
- 2010-11-25 SG SG2010087047A patent/SG172545A1/en unknown
- 2010-11-26 CN CN2010105670660A patent/CN102088027A/zh active Pending
- 2010-11-26 EP EP10192766A patent/EP2333833A1/fr not_active Withdrawn
- 2010-11-26 KR KR1020100118916A patent/KR20110065343A/ko not_active Abandoned
- 2010-11-26 JP JP2010263678A patent/JP2011166116A/ja active Pending
- 2010-12-06 US US12/961,293 patent/US8384425B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2333833A1 (fr) | 2011-06-15 |
| SG172545A1 (en) | 2011-07-28 |
| JP2011166116A (ja) | 2011-08-25 |
| CN102088027A (zh) | 2011-06-08 |
| US20110133776A1 (en) | 2011-06-09 |
| FR2953641A1 (fr) | 2011-06-10 |
| TW201131739A (en) | 2011-09-16 |
| KR20110065343A (ko) | 2011-06-15 |
| US8384425B2 (en) | 2013-02-26 |
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