[go: up one dir, main page]

FR2808164B1 - Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant - Google Patents

Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant

Info

Publication number
FR2808164B1
FR2808164B1 FR0005210A FR0005210A FR2808164B1 FR 2808164 B1 FR2808164 B1 FR 2808164B1 FR 0005210 A FR0005210 A FR 0005210A FR 0005210 A FR0005210 A FR 0005210A FR 2808164 B1 FR2808164 B1 FR 2808164B1
Authority
FR
France
Prior art keywords
radiocommunication module
shielding
module
radiocommunication
corresponding radiocommunication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0005210A
Other languages
English (en)
Other versions
FR2808164A1 (fr
Inventor
Jacky Jouan
Bachir Kordjani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sierra Wireless SA
Original Assignee
Wavecom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0005210A priority Critical patent/FR2808164B1/fr
Application filed by Wavecom SA filed Critical Wavecom SA
Priority to CN01809579A priority patent/CN1429470A/zh
Priority to JP2001578170A priority patent/JP2003531556A/ja
Priority to EP01928014A priority patent/EP1275281A1/fr
Priority to US10/257,895 priority patent/US20040053034A1/en
Priority to PCT/FR2001/001215 priority patent/WO2001082671A1/fr
Priority to AU2001254889A priority patent/AU2001254889A1/en
Publication of FR2808164A1 publication Critical patent/FR2808164A1/fr
Application granted granted Critical
Publication of FR2808164B1 publication Critical patent/FR2808164B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249962—Void-containing component has a continuous matrix of fibers only [e.g., porous paper, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Transceivers (AREA)
FR0005210A 2000-04-21 2000-04-21 Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant Expired - Fee Related FR2808164B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR0005210A FR2808164B1 (fr) 2000-04-21 2000-04-21 Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant
JP2001578170A JP2003531556A (ja) 2000-04-21 2001-04-19 無線通信モジュールの少なくとも上面を遮蔽する方法及び対応する無線通信モジュール
EP01928014A EP1275281A1 (fr) 2000-04-21 2001-04-19 Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant
US10/257,895 US20040053034A1 (en) 2000-04-21 2001-04-19 Method for shielding at least the upper part of a radiocommunication module, and corresponding radiocommunication module
CN01809579A CN1429470A (zh) 2000-04-21 2001-04-19 至少对无线通信组件的上部进行屏蔽的方法,及相应的无线通信组件
PCT/FR2001/001215 WO2001082671A1 (fr) 2000-04-21 2001-04-19 Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant
AU2001254889A AU2001254889A1 (en) 2000-04-21 2001-04-19 Method for shielding at least the upper part of a radiocommunication module, andcorresponding radiocommunication module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0005210A FR2808164B1 (fr) 2000-04-21 2000-04-21 Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant

Publications (2)

Publication Number Publication Date
FR2808164A1 FR2808164A1 (fr) 2001-10-26
FR2808164B1 true FR2808164B1 (fr) 2002-06-07

Family

ID=8849533

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0005210A Expired - Fee Related FR2808164B1 (fr) 2000-04-21 2000-04-21 Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant

Country Status (7)

Country Link
US (1) US20040053034A1 (fr)
EP (1) EP1275281A1 (fr)
JP (1) JP2003531556A (fr)
CN (1) CN1429470A (fr)
AU (1) AU2001254889A1 (fr)
FR (1) FR2808164B1 (fr)
WO (1) WO2001082671A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2852190B1 (fr) * 2003-03-03 2005-09-23 Procede de fabrication d'un composant ou d'un module electronique et composant ou module correspondant
JP4070689B2 (ja) * 2003-08-20 2008-04-02 シャープ株式会社 無線通信ユニット
FR2870429B1 (fr) * 2004-05-11 2006-07-28 Sagem Dispositif de blindage pour module electronique radioelectrique
CN1780178B (zh) * 2004-11-23 2011-05-04 简呈豪 无线通信屏蔽鉴别方法及系统
JP6013041B2 (ja) * 2012-06-27 2016-10-25 ローム株式会社 無線モジュール

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61206294A (ja) * 1985-03-08 1986-09-12 松下電器産業株式会社 ハイブリツドｉｃ
JPS6214800U (fr) * 1985-07-10 1987-01-29
JP2752377B2 (ja) * 1988-06-29 1998-05-18 株式会社リコー シート状電極
JP2778107B2 (ja) * 1989-02-14 1998-07-23 三菱電機株式会社 集積回路のシールド構造
US5130600A (en) * 1989-06-02 1992-07-14 Mitsubishi Petrochemical Co., Ltd. Acceleration sensor
US5047283A (en) * 1989-09-20 1991-09-10 Ppg Industries, Inc. Electrically conductive article
JPH06125191A (ja) * 1992-10-12 1994-05-06 Nippon Chemicon Corp シールド部品
US5736070A (en) * 1992-10-13 1998-04-07 Tatsuta Electric Wire And Cable Co., Ltd. Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
JPH06275927A (ja) * 1993-03-19 1994-09-30 Cmk Corp 磁界・電磁波シールド層を有するプリント配線板とそ の製造方法
JPH0763115B2 (ja) * 1993-03-25 1995-07-05 日本電気株式会社 高周波モジュール装置及びその製造方法
FI117224B (fi) * 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
US5827999A (en) * 1994-05-26 1998-10-27 Amkor Electronics, Inc. Homogeneous chip carrier package
JPH0961456A (ja) * 1995-08-29 1997-03-07 Murata Mfg Co Ltd 半導体装置
JP2871591B2 (ja) * 1996-05-14 1999-03-17 日本電気株式会社 高周波用電子部品および高周波用電子部品の製造方法
US6665192B2 (en) * 1997-02-18 2003-12-16 Koninklijke Philips Electronics N.V. Synthetic resin capping layer on a printed circuit
JPH11121488A (ja) * 1997-10-15 1999-04-30 Toshiba Corp 半導体装置の製造方法及び樹脂封止装置
US6566596B1 (en) * 1997-12-29 2003-05-20 Intel Corporation Magnetic and electric shielding of on-board devices
JP3013831B2 (ja) * 1998-01-26 2000-02-28 日本電気株式会社 Ｍｍｉｃパッケージ
JPH11330766A (ja) * 1998-05-11 1999-11-30 Alps Electric Co Ltd 電子機器
DE19835805A1 (de) * 1998-08-07 2000-02-17 Roehm Gmbh Kunststofformkörper aus Gießharzen und anorganischen Füllstoffen mit verbesserten mechanischen und thermischen Eigenschaften und verbesserter Flammfestigkeit

Also Published As

Publication number Publication date
CN1429470A (zh) 2003-07-09
WO2001082671A1 (fr) 2001-11-01
US20040053034A1 (en) 2004-03-18
AU2001254889A1 (en) 2001-11-07
FR2808164A1 (fr) 2001-10-26
JP2003531556A (ja) 2003-10-21
EP1275281A1 (fr) 2003-01-15

Similar Documents

Publication Publication Date Title
EP1407641A4 (fr) Structure et procede de fabrication d'un porte-puces sans conducteur
FR2798220B1 (fr) Inductance et procede de fabrication
EP1423877A4 (fr) Structure et procede de fabrication d'un porte-puce sans conducteur a bobine d'induction integree
EP1253607A4 (fr) Piece d'inductance et son procede de fabrication
FR2833838B1 (fr) Procede de fabrication d'un comprime incluant un analgesique de type morphinique et comprime obtenu
FI954717L (fi) Menetelmä taso- tai keskihakuisseulan valmistamiseksi
EP1319735A4 (fr) Procede de fabrication d'un electrolyseur, procede et dispositif permettant de souder un electrolyseur a une nervure d'electrolyseur
EP1367611A4 (fr) Partie d'inductance et procede de production associe
DE69810259D1 (de) Mehrgliederiges Armband
ITTO990992A0 (it) Metodo per produrre valvole a sfera.
EP1442793A4 (fr) Element photocatalyseur, procede et dispositif pour l'elaboration de cet element
FR2754556B1 (fr) Procede de renforcement d'un ouvrage de construction, et ouvrage ainsi renforce
FR2787155B1 (fr) Agencement d'etancheite pour un joint homocinetique, et procede de fabrication correspondant
FR2813145B1 (fr) Procede de fabrication d'un condensateur au sein d'un circuit integre, et circuit integre correspondant
FR2808164B1 (fr) Procede de blindage d'au moins la partie superieure d'un module de radiocommunication, et module de radiocommunication correspondant
FR2757972B1 (fr) Procede de securisation d'un module de securite, et module de securite associe
MXPA03008365A (es) Tejidos de alto contenido de superabsorbente y un metodo para hacerlos.
EP1442815A4 (fr) Procede d'usinage par etincelage a fil et machine d'etincelage a fil
FR2704783B1 (fr) Procede de filage de metal et presse a filer perfectionnee.
GB2344083B (en) Hollow profile and a method for the production thereof
EP1170784A4 (fr) Dispositif a semi-conducteur et procede de production associe
EP1573027A4 (fr) Procede de reduction de l'angiogenese
FR2831259B1 (fr) Dispositif et procede de deplacement d'une piece
HUP0102211A3 (en) Novel antiestrogens, a method for the production thereof, and their pharmaceutical application
FR2833389B1 (fr) Systeme et procede visant a empecher le detournement d'avions.

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20091231