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FR2703365B1 - Appareil et procédé d'électro-placage. - Google Patents

Appareil et procédé d'électro-placage.

Info

Publication number
FR2703365B1
FR2703365B1 FR9401647A FR9401647A FR2703365B1 FR 2703365 B1 FR2703365 B1 FR 2703365B1 FR 9401647 A FR9401647 A FR 9401647A FR 9401647 A FR9401647 A FR 9401647A FR 2703365 B1 FR2703365 B1 FR 2703365B1
Authority
FR
France
Prior art keywords
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9401647A
Other languages
English (en)
Other versions
FR2703365A1 (fr
Inventor
Kosaki Katsuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2703365A1 publication Critical patent/FR2703365A1/fr
Application granted granted Critical
Publication of FR2703365B1 publication Critical patent/FR2703365B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
FR9401647A 1993-03-30 1994-02-14 Appareil et procédé d'électro-placage. Expired - Lifetime FR2703365B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07137993A JP3308333B2 (ja) 1993-03-30 1993-03-30 電解メッキ装置，及び電解メッキ処理方法

Publications (2)

Publication Number Publication Date
FR2703365A1 FR2703365A1 (fr) 1994-10-07
FR2703365B1 true FR2703365B1 (fr) 1995-11-10

Family

ID=13458816

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9401647A Expired - Lifetime FR2703365B1 (fr) 1993-03-30 1994-02-14 Appareil et procédé d'électro-placage.

Country Status (4)

Country Link
US (1) US5441629A (fr)
JP (1) JP3308333B2 (fr)
FR (1) FR2703365B1 (fr)
GB (1) GB2276885B (fr)

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DE19861248B4 (de) * 1997-04-28 2005-03-17 Mitsubishi Denki K.K. Verfahren zum Beschichten einer Oberfläche eines Wafers
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US6033548A (en) * 1997-07-28 2000-03-07 Micron Technology, Inc. Rotating system and method for electrodepositing materials on semiconductor wafers
US5893966A (en) * 1997-07-28 1999-04-13 Micron Technology, Inc. Method and apparatus for continuous processing of semiconductor wafers
US6017437A (en) * 1997-08-22 2000-01-25 Cutek Research, Inc. Process chamber and method for depositing and/or removing material on a substrate
US6159354A (en) * 1997-11-13 2000-12-12 Novellus Systems, Inc. Electric potential shaping method for electroplating
US6126798A (en) * 1997-11-13 2000-10-03 Novellus Systems, Inc. Electroplating anode including membrane partition system and method of preventing passivation of same
US6179983B1 (en) 1997-11-13 2001-01-30 Novellus Systems, Inc. Method and apparatus for treating surface including virtual anode
US6156167A (en) 1997-11-13 2000-12-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating semiconductor wafers
US6027631A (en) * 1997-11-13 2000-02-22 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6416647B1 (en) * 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
US6022465A (en) * 1998-06-01 2000-02-08 Cutek Research, Inc. Apparatus and method utilizing an electrode adapter for customized contact placement on a wafer
US6228232B1 (en) 1998-07-09 2001-05-08 Semitool, Inc. Reactor vessel having improved cup anode and conductor assembly
US6303010B1 (en) 1999-07-12 2001-10-16 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
US6773560B2 (en) 1998-07-10 2004-08-10 Semitool, Inc. Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces
JP2003520898A (ja) 1998-07-10 2003-07-08 セミトゥール・インコーポレイテッド 化学メッキ及び電気メッキを使って銅メッキを行うための方法及び装置
US7048841B2 (en) 1998-12-07 2006-05-23 Semitool, Inc. Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6080291A (en) * 1998-07-10 2000-06-27 Semitool, Inc. Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
US6183611B1 (en) * 1998-07-17 2001-02-06 Cutek Research, Inc. Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate
US6017820A (en) * 1998-07-17 2000-01-25 Cutek Research, Inc. Integrated vacuum and plating cluster system
US6187152B1 (en) 1998-07-17 2001-02-13 Cutek Research, Inc. Multiple station processing chamber and method for depositing and/or removing material on a substrate
JP4611341B2 (ja) * 1998-11-09 2011-01-12 株式会社荏原製作所 めっき方法及び装置
US6645356B1 (en) 1998-12-07 2003-11-11 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
US6309520B1 (en) 1998-12-07 2001-10-30 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
TW483950B (en) 1998-12-31 2002-04-21 Semitool Inc Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
US6303500B1 (en) * 1999-02-24 2001-10-16 Micron Technology, Inc. Method and apparatus for electroless plating a contact pad
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
KR100707121B1 (ko) 1999-04-13 2007-04-16 세미툴 인코포레이티드 마이크로전자 피가공물을 전기화학적으로 처리하기 위한 장치 및 마이크로전자 피가공물 상에 재료를 전기도금하기 위한 방법
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6241825B1 (en) 1999-04-16 2001-06-05 Cutek Research Inc. Compliant wafer chuck
US6454864B2 (en) * 1999-06-14 2002-09-24 Cutek Research, Inc. Two-piece chuck
US8298395B2 (en) * 1999-06-30 2012-10-30 Chema Technology, Inc. Electroplating apparatus
US6258223B1 (en) * 1999-07-09 2001-07-10 Applied Materials, Inc. In-situ electroless copper seed layer enhancement in an electroplating system
US7645366B2 (en) * 1999-07-12 2010-01-12 Semitool, Inc. Microelectronic workpiece holders and contact assemblies for use therewith
US6673216B2 (en) * 1999-08-31 2004-01-06 Semitool, Inc. Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
WO2002004704A2 (fr) * 2000-07-11 2002-01-17 Applied Materials, Inc. Procede et appareil destines a diviser des couches deposees de maniere electrochimique au moyen de materiaux de depot autocatalytiques
JP2002097598A (ja) 2000-09-25 2002-04-02 Mitsubishi Electric Corp 電解メッキ装置
JP2002220692A (ja) * 2001-01-24 2002-08-09 Ebara Corp めっき装置及び方法
JP4014827B2 (ja) * 2001-07-25 2007-11-28 シャープ株式会社 メッキ処理装置
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
JP3695703B2 (ja) * 2001-10-25 2005-09-14 株式会社日立製作所 電気めっき方法、電気めっき装置及び半導体装置の製造方法及び製造装置
US7118658B2 (en) * 2002-05-21 2006-10-10 Semitool, Inc. Electroplating reactor
US7153400B2 (en) * 2002-09-30 2006-12-26 Lam Research Corporation Apparatus and method for depositing and planarizing thin films of semiconductor wafers
US20040146461A1 (en) * 2003-01-29 2004-07-29 Vincenzo Giuliano Oral contrast media composition for computerized axial tomographic examinations and method
US7829152B2 (en) * 2006-10-05 2010-11-09 Lam Research Corporation Electroless plating method and apparatus
JP5168081B2 (ja) * 2008-10-24 2013-03-21 スズキ株式会社 多気筒シリンダブロックのめっき前処理装置及び方法
CN104040417B (zh) 2011-11-15 2017-07-18 阿什温-乌沙斯公司 互补聚合物电致变色装置
US9207515B2 (en) 2013-03-15 2015-12-08 Ashwin-Ushas Corporation, Inc. Variable-emittance electrochromic devices and methods of preparing the same
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
US9632059B2 (en) 2015-09-03 2017-04-25 Ashwin-Ushas Corporation, Inc. Potentiostat/galvanostat with digital interface
US9482880B1 (en) 2015-09-15 2016-11-01 Ashwin-Ushas Corporation, Inc. Electrochromic eyewear
US9945045B2 (en) 2015-12-02 2018-04-17 Ashwin-Ushas Corporation, Inc. Electrochemical deposition apparatus and methods of using the same
CN106637322B (zh) * 2017-02-28 2018-05-18 扬州大学 一种半导体硅片微点电镀槽
CN108560033B (zh) * 2018-04-11 2021-02-19 佛山市戴盟科技有限公司 一种工件阳极氧化处理工艺
CN111560638B (zh) * 2020-07-06 2021-06-29 苏州清飙科技有限公司 晶圆电镀设备

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US2431949A (en) * 1943-11-24 1947-12-02 Gen Motors Corp Apparatus for electroplating the inside of bearing shells and the like
FR1406461A (fr) * 1962-01-26 1965-07-23 Siemens Ag Procédé de fabrication d'un dispositif semi-conducteur
US3841990A (en) * 1971-12-25 1974-10-15 Toyo Kogyo Co Apparatus for simultaneously electroplating inside surfaces of annular bodies
NL7316245A (nl) * 1973-10-04 1975-04-08 Galentan Ag Werkwijze voor het selectief aanbrengen van een llaag op de door een isolerend lichaam ge- e metaaldelen van electrische bouwelementen.
US4192729A (en) * 1978-04-03 1980-03-11 Burroughs Corporation Apparatus for forming an aluminum interconnect structure on an integrated circuit chip
JPS5819170Y2 (ja) * 1980-08-16 1983-04-19 征一郎 相合 半導体ウェハ−のめっき装置
IT1129345B (it) * 1980-10-29 1986-06-04 Fiat Ricerche Disp*sitivo per il trattamento elettrolitico della superficie di pezzi maccanici particolarmente di cilindri di motori a combustione interna
US4530635A (en) * 1983-06-15 1985-07-23 The Perkin-Elmer Corporation Wafer transferring chuck assembly
JPH0669019B2 (ja) * 1984-03-12 1994-08-31 株式会社ニコン 半導体製造装置
US4590094A (en) * 1984-10-29 1986-05-20 International Business Machines Corporation Inverted apply using bubble dispense
JPS6396292A (ja) * 1986-10-13 1988-04-27 Mitsubishi Electric Corp 電解メツキ装置
JPH0194620A (ja) * 1987-10-06 1989-04-13 Mitsubishi Electric Corp スピン塗布装置
JP2628886B2 (ja) * 1988-05-19 1997-07-09 三菱電機株式会社 電解メッキ装置
JPH0781197B2 (ja) * 1989-05-22 1995-08-30 日本電気株式会社 半導体基板鍍金装置
JPH0344023A (ja) * 1989-07-11 1991-02-25 Seiko Instr Inc レジスト塗布装置
US5087909A (en) * 1989-08-18 1992-02-11 Westinghouse Electric Corp. Method and apparatus for radio frequency signal detection
JP2641594B2 (ja) * 1990-04-16 1997-08-13 三菱電機株式会社 メッキ装置
JPH07107199B2 (ja) * 1990-05-25 1995-11-15 島田理化工業株式会社 ウエハ処理装置

Also Published As

Publication number Publication date
FR2703365A1 (fr) 1994-10-07
JPH06280098A (ja) 1994-10-04
GB9403686D0 (en) 1994-04-13
JP3308333B2 (ja) 2002-07-29
GB2276885B (en) 1996-10-23
US5441629A (en) 1995-08-15
GB2276885A (en) 1994-10-12

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