[go: up one dir, main page]

FR2793264B1 - Procede de nettoyage d'une surface de substrat de silicium et application a la fabrication de composants electroniques integres - Google Patents

Procede de nettoyage d'une surface de substrat de silicium et application a la fabrication de composants electroniques integres

Info

Publication number
FR2793264B1
FR2793264B1 FR9905835A FR9905835A FR2793264B1 FR 2793264 B1 FR2793264 B1 FR 2793264B1 FR 9905835 A FR9905835 A FR 9905835A FR 9905835 A FR9905835 A FR 9905835A FR 2793264 B1 FR2793264 B1 FR 2793264B1
Authority
FR
France
Prior art keywords
cleaning
manufacture
application
silicon substrate
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9905835A
Other languages
English (en)
Other versions
FR2793264A1 (fr
Inventor
Pawlowski Michael Korwin
Jean Pierre Lazzari
Claude Sebenne
Gilles Borsoni
Michel Froment
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
X Ion SA
Original Assignee
X Ion SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by X Ion SA filed Critical X Ion SA
Priority to FR9905835A priority Critical patent/FR2793264B1/fr
Priority to JP2000617487A priority patent/JP2002544667A/ja
Priority to AU44119/00A priority patent/AU4411900A/en
Priority to PCT/FR2000/001182 priority patent/WO2000068984A1/fr
Priority to EP00925372A priority patent/EP1183720A1/fr
Publication of FR2793264A1 publication Critical patent/FR2793264A1/fr
Application granted granted Critical
Publication of FR2793264B1 publication Critical patent/FR2793264B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • H01L21/28017Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28158Making the insulator
    • H01L21/28167Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
    • H01L21/28194Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation by deposition, e.g. evaporation, ALD, CVD, sputtering, laser deposition
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/691Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/681Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
FR9905835A 1999-05-07 1999-05-07 Procede de nettoyage d'une surface de substrat de silicium et application a la fabrication de composants electroniques integres Expired - Fee Related FR2793264B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR9905835A FR2793264B1 (fr) 1999-05-07 1999-05-07 Procede de nettoyage d'une surface de substrat de silicium et application a la fabrication de composants electroniques integres
JP2000617487A JP2002544667A (ja) 1999-05-07 2000-05-03 シリコン基板表面の清浄化方法及び集積電子部品を製造するための使用
AU44119/00A AU4411900A (en) 1999-05-07 2000-05-03 Method for cleaning a silicon substrate surface and use for making integrated electronic components
PCT/FR2000/001182 WO2000068984A1 (fr) 1999-05-07 2000-05-03 Procede de nettoyage d'une surface de substrat de silicium et application a la fabrication de composants electroniques integres
EP00925372A EP1183720A1 (fr) 1999-05-07 2000-05-03 Procede de nettoyage d'une surface de substrat de silicium et application a la fabrication de composants electroniques integres

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9905835A FR2793264B1 (fr) 1999-05-07 1999-05-07 Procede de nettoyage d'une surface de substrat de silicium et application a la fabrication de composants electroniques integres

Publications (2)

Publication Number Publication Date
FR2793264A1 FR2793264A1 (fr) 2000-11-10
FR2793264B1 true FR2793264B1 (fr) 2001-06-15

Family

ID=9545339

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9905835A Expired - Fee Related FR2793264B1 (fr) 1999-05-07 1999-05-07 Procede de nettoyage d'une surface de substrat de silicium et application a la fabrication de composants electroniques integres

Country Status (5)

Country Link
EP (1) EP1183720A1 (fr)
JP (1) JP2002544667A (fr)
AU (1) AU4411900A (fr)
FR (1) FR2793264B1 (fr)
WO (1) WO2000068984A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6554950B2 (en) * 2001-01-16 2003-04-29 Applied Materials, Inc. Method and apparatus for removal of surface contaminants from substrates in vacuum applications
FR2949237B1 (fr) * 2009-08-24 2011-09-30 Ecole Polytech Procede de nettoyage de la surface d'un substrat de silicium

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2662321B2 (ja) * 1991-05-31 1997-10-08 科学技術振興事業団 超低速クラスターイオンビームによる表面処理方法
JPH09199457A (ja) * 1996-01-22 1997-07-31 Hitachi Ltd クリーニング方法及びクリーニング装置
FR2757881B1 (fr) * 1996-12-31 1999-04-09 Univ Paris Curie Procede de traitement d'une surface d'un semi-conducteur, dispositif correspondant et semi-conducteur associe
FR2764110B1 (fr) * 1997-05-28 1999-08-20 Univ Paris Curie Dispositif et procede de gravure par ions

Also Published As

Publication number Publication date
WO2000068984A1 (fr) 2000-11-16
AU4411900A (en) 2000-11-21
EP1183720A1 (fr) 2002-03-06
FR2793264A1 (fr) 2000-11-10
JP2002544667A (ja) 2002-12-24

Similar Documents

Publication Publication Date Title
DE69825517D1 (de) Herstellungsverfahren eines Halbleiter-Substrats
EP0690482A3 (fr) Procédé pour réduire la contamination métallique de substrates silicium dans la fabrication de semi-conducteurs
DE69529858D1 (de) Oberflächenbehandlung für Halbleitersubstrat
FR2812764B1 (fr) Procede de fabrication d'un substrat de type substrat-sur- isolant ou substrat-sur-vide et dispositif obtenu
DE69834856D1 (de) Reinigen von Halbleiterscheiben und Mikroelektronik-Substraten
FR2782572B1 (fr) Substrat "silicium-sur-isolant" (soi) et methode de fabrication dudit substrat
FR2809867B1 (fr) Substrat fragilise et procede de fabrication d'un tel substrat
EP1513198A4 (fr) Procedes de fabrication d'un substrat et d'un dispositif a semi-conducteurs, substrat et dispositif a semi-conducteurs produits a l'aide de ces procedes
FR2827708B1 (fr) Dispositif a semi-conducteur sur substrat soi et procede de fabrication
AU2002211485A1 (en) Wafer cleaning module and method for cleaning the surface of a substrate
SG92671A1 (en) Chip scale surface mount packages for semiconductor device and process of fabricating the same
DE69605956D1 (de) Oberflächenbehandlungsverfahren für Siliziumsubstraten
FR2822167B1 (fr) Procede de metallisation d'une piece substrat
KR960015801A (ko) 집적화된 표면 상호접속부 및 소자들을 갖는 반도체 칩 및 전자적 모듈과 이를 제조하는 방법
ATE266082T1 (de) Behandlung von substratoberfläche
EP0706070A3 (fr) Procédé de gravure sèche d'un substrat semi-conducteur
SG68095A1 (en) Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device
EP1372364A4 (fr) Procede de fabrication d'un substrat en forme de circuit
NO20022268L (no) Beleggingsmiddel og fremgangsmåte for belegging av overflaten av et substrat
EP1484792A4 (fr) Procede de meulage de la surface arriere d'une plaquette semi-conductrice
EP1235258A4 (fr) Procede de nettoyage de substrat et procede de fabrication de dispositif semi-conducteur
FR2797999B1 (fr) Procede de fabrication d'une capacite integree sur un substrat de silicium
SG71206A1 (en) Method of manufacturing semi-conductor silicon single crystal wafer
FR2812445B1 (fr) Structure integree d'inductances a valeurs partagees sur un substrat semiconducteur
DE69917826D1 (de) Keramisches Substrat und dessen Polierverfahren

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20060131