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FR2772657B1 - Procedure de realisation de pate a braser et joint de soudure obtenu - Google Patents

Procedure de realisation de pate a braser et joint de soudure obtenu

Info

Publication number
FR2772657B1
FR2772657B1 FR9716349A FR9716349A FR2772657B1 FR 2772657 B1 FR2772657 B1 FR 2772657B1 FR 9716349 A FR9716349 A FR 9716349A FR 9716349 A FR9716349 A FR 9716349A FR 2772657 B1 FR2772657 B1 FR 2772657B1
Authority
FR
France
Prior art keywords
procedure
welding joint
joint obtained
brazing paste
producing brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9716349A
Other languages
English (en)
Other versions
FR2772657A1 (fr
Inventor
Jean Chazelas
Olivier Prevotat
Jean Francois Silvain
Sandrine Trombert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR9716349A priority Critical patent/FR2772657B1/fr
Priority to US09/581,224 priority patent/US6383305B1/en
Priority to EP98963615A priority patent/EP1042101A1/fr
Priority to PCT/FR1998/002855 priority patent/WO1999033604A1/fr
Publication of FR2772657A1 publication Critical patent/FR2772657A1/fr
Application granted granted Critical
Publication of FR2772657B1 publication Critical patent/FR2772657B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0308—Shape memory alloy [SMA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
FR9716349A 1997-12-23 1997-12-23 Procedure de realisation de pate a braser et joint de soudure obtenu Expired - Fee Related FR2772657B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR9716349A FR2772657B1 (fr) 1997-12-23 1997-12-23 Procedure de realisation de pate a braser et joint de soudure obtenu
US09/581,224 US6383305B1 (en) 1997-12-23 1998-12-23 Method for the making soldering flux and resulting weld joint
EP98963615A EP1042101A1 (fr) 1997-12-23 1998-12-23 Procede de realisation de pate a braser et joint de soudure obtenu
PCT/FR1998/002855 WO1999033604A1 (fr) 1997-12-23 1998-12-23 Procede de realisation de pate a braser et joint de soudure obtenu

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9716349A FR2772657B1 (fr) 1997-12-23 1997-12-23 Procedure de realisation de pate a braser et joint de soudure obtenu

Publications (2)

Publication Number Publication Date
FR2772657A1 FR2772657A1 (fr) 1999-06-25
FR2772657B1 true FR2772657B1 (fr) 2000-03-03

Family

ID=9514995

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9716349A Expired - Fee Related FR2772657B1 (fr) 1997-12-23 1997-12-23 Procedure de realisation de pate a braser et joint de soudure obtenu

Country Status (4)

Country Link
US (1) US6383305B1 (fr)
EP (1) EP1042101A1 (fr)
FR (1) FR2772657B1 (fr)
WO (1) WO1999033604A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7095121B2 (en) * 2002-05-17 2006-08-22 Texas Instrument Incorporated Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices
US20040134976A1 (en) * 2003-01-14 2004-07-15 Frank Keyser Method and system for solder connecting electrical devices
CN100389166C (zh) * 2004-04-29 2008-05-21 鸿富锦精密工业（深圳）有限公司 一种热界面材料及其制造方法
US20120248176A1 (en) * 2011-04-01 2012-10-04 Herron Derrick Matthew Solder pastes for providing impact resistant, mechanically stable solder joints

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1590695A (en) * 1977-08-08 1981-06-10 Fusion Inc Method of brazing
US4431465A (en) * 1981-06-04 1984-02-14 Gte Products Corporation Brazing alloy paste
JPS62179889A (ja) * 1986-01-31 1987-08-07 Senjiyu Kinzoku Kogyo Kk クリ−ムはんだ
AU4517589A (en) * 1988-10-24 1990-05-14 Handy & Harman Automotive Group Inc. Brazing paste for joining materials with dissimilar thermal expansion rates
FR2706139B1 (fr) * 1993-06-08 1995-07-21 Thomson Csf Matériau pour brasure.
US5971253A (en) * 1995-07-31 1999-10-26 Tessera, Inc. Microelectronic component mounting with deformable shell terminals
EP0856376B1 (fr) * 1996-12-03 2000-02-09 Lucent Technologies Inc. Article comprenant une soudure tendre à grains fins et à particules dispersées

Also Published As

Publication number Publication date
WO1999033604A1 (fr) 1999-07-08
US6383305B1 (en) 2002-05-07
FR2772657A1 (fr) 1999-06-25
EP1042101A1 (fr) 2000-10-11

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Legal Events

Date Code Title Description
CD Change of name or company name
ST Notification of lapse