FR2623134A1 - Technical method for cutting out and perforating metal plates with a view to their reproduction and incrustation - Google Patents
Technical method for cutting out and perforating metal plates with a view to their reproduction and incrustation Download PDFInfo
- Publication number
- FR2623134A1 FR2623134A1 FR8715738A FR8715738A FR2623134A1 FR 2623134 A1 FR2623134 A1 FR 2623134A1 FR 8715738 A FR8715738 A FR 8715738A FR 8715738 A FR8715738 A FR 8715738A FR 2623134 A1 FR2623134 A1 FR 2623134A1
- Authority
- FR
- France
- Prior art keywords
- pattern
- cutting
- reproduced
- reproduction
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000002184 metal Substances 0.000 title claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 16
- 238000005520 cutting process Methods 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000002253 acid Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 3
- 238000007796 conventional method Methods 0.000 claims 1
- 150000001879 copper Chemical class 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 230000033458 reproduction Effects 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- GPUADMRJQVPIAS-QCVDVZFFSA-M cerivastatin sodium Chemical compound [Na+].COCC1=C(C(C)C)N=C(C(C)C)C(\C=C\[C@@H](O)C[C@@H](O)CC([O-])=O)=C1C1=CC=C(F)C=C1 GPUADMRJQVPIAS-QCVDVZFFSA-M 0.000 description 1
- 238000012822 chemical development Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229940035339 tri-chlor Drugs 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/26—Inlaying with ornamental structures, e.g. niello work, tarsia work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/24—Pressing or stamping ornamental designs on surfaces
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
Description
DEMANDE DE BREVET D INVE?!TION
La présente invention est relative G une évolution de la technique pour le découpage et l'ajourage de plaques polymorphes de métaux (épaisseur 2 mm maximum pour permettre une meilleure définition). Elle permet de prolonger et de parfaire la technique d'incrustation des métaux dans certains matériaux.APPLICATION PATENT APPLICATION!
The present invention relates to an evolution of the technique for cutting and cutting openwork of polymorphic metal plates (thickness 2 mm maximum to allow better definition). It makes it possible to extend and perfect the technique of inlaying metals in certain materials.
PRINCIPAUX DOMAINES D'APPLICATION - La fabrication en série de reproductions de haute précision à des
échelles différentes, - Dans une seule et même opération sera faite la découpe, la gravure sur
plusieurs niveaux, de manière extrêmement précise sur les deux faces
d' une plaque. En ce sens, on pourrait lui trouver des applications dans
le domaine industriel : accessoire-s de machines de haute précision,
décoration, bijouterie, quincaillerie, calligraphie, images, dessins ...MAIN AREAS OF APPLICATION - Mass production of high-precision reproductions at
different scales, - In one and the same operation will be made cutting, engraving on
several levels, extremely precisely on both sides
of a plate. In this sense, we could find applications in
the industrial field: accessories of high precision machines,
decoration, jewelry, hardware, calligraphy, images, drawings ...
- Réalisation de pochoirs en série pour permettre l'agrandissement de
précision, - Le procédé améliore la technique d'incrustation des métaux dans certa nE
matériaux.- Production of stencils in series to allow the enlargement of
precision, - The process improves the technique of inlaying metals in certa nE
materials.
Dans la première partie de cette descritpion, seront rappelés brièvement les procédés antérieurs utilisés. In the first part of this description, the previous processes used will be briefly recalled.
Dans une deuxième partie, nous décrirons les phases successives de notre savoir-faire.In a second part, we will describe the successive phases of our know-how.
Les méthodes traditionnelles sont 1. LA GRAVURE 2. LA PHOTOGRAVURE 3. L'ESTAMPAGE 4. LE SCIAGE 5. LA SERIGRAPHIE.The traditional methods are 1. ENGRAVING 2. PHOTOGRAVING 3. STAMPING 4. SAWING 5. SERIGRAPHY.
1. GRAVURE
Protéger la surface d'un support avec un vernis à l'acide utilisé,
puis grattage avec une pointe sèche , ce qui permet l'attaque de
l'acide à l'endroit gratté. I1 s'agit làde gravure traditionnelle.1. ENGRAVING
Protect the surface of a support with an acid varnish used,
then scraping with a dry point, which allows the attack of
the acid in the scraped area. This is traditional engraving.
PRINCIPAUX INCONVENIENTS : Ne permet pas la reproduction de l'image oeuvrée, ni
son découpage. MAIN DISADVANTAGES: Does not allow the reproduction of the worked image, nor
its cutting.
2. PHOTOGRAVURE
Procédé de laminage d'un support et utilisation d'un film représentant
l'image à reproduire.2. PHOTOGRAVURE
Method of laminating a support and use of a film representing
the image to be reproduced.
PRINCIPAUX INCONVENIENTS : Ce deuxième procédé permet une reproduction en série
mais ne permet pas la gravure sur les deux faces du support, ni son découpage. MAIN DISADVANTAGES: This second process allows serial reproduction
but does not allow engraving on both sides of the support, nor its cutting.
3. L'ESTAMPAGE
C'est la méthode actuellement praticuée pour découper des formes
différentes de métaux en série de la manière la plus précise qui soit
elle se fait à l'aide de matrices de formes les plus proches poss-ible
de la pièce finie.3. STAMPING
This is the method currently used to cut shapes
different metals in series in the most precise way possible
it is done using the closest possible form matrices
of the finished part.
PRINCIPAUX INCONVEINIENTS : Elle limite la taille du support et exige des machines
de grandes dimensions.MAIN DISADVANTAGES: It limits the size of the support and requires machines
large dimensions.
4. LE SCIAGE
Découpage par la scie.4. SAWING
Cutting by saw.
PRINCIPAUX INCONVENIENTS : Ne permet pas la reproduction exacte en série. MAIN DISADVANTAGES: Does not allow exact serial reproduction.
5. LA SERIGRAPHIE
Procédé d'impression à l'aide d'une trame de soie dont on laisse libre
les mailles correspondant à l'image à imprimer. 5. THE SERIGRAPHY
Printing process using a silk weft which is left free
the meshes corresponding to the image to be printed.
C'est la méthode qui permet le plus de précision. This is the method that allows the most precision.
PRINCIPAUX INCONVENIENTS : limite la précision de 1 'image sur les 2 faces du support. MAIN DISADVANTAGES: limits the precision of the image on both sides of the support.
e but de la présente invention : supprimer les inconvénients, tout en ardant les avantages des méthodes citées.e aim of the present invention: to eliminate the drawbacks, while promoting the advantages of the methods mentioned.
'objectif recherché, c'est la reproduction d'une image gravée recto-verso 'un support, aussi précise que possible, en permettant l'ajourage le plus et. 'objective sought, it is the reproduction of a double-sided engraved image' a support, as precise as possible, allowing the most openwork and.
ucune des méthodes traditionnelles ne permet d'arriver à ces résultats-là. none of the traditional methods can achieve these results.
DESCRIPTION DU PROCèDE 1. Dégraissage ou ponçage du support. DESCRIPTION OF THE PROCESS 1. Degreasing or sanding of the support.
ex: Si vous utilisez une plaque de cuivre elle doit être nettoyée
au trichlor ou chlorotène N.V. pour être dégraissée.ex: If you use a copper plate it must be cleaned
with trichlor or chlorotene NV to be degreased.
2. Chauffer le support jusqu'a une température de 500 pour une meilleure
application du film.2. Heat the support to a temperature of 500 for better
application of the film.
3. Couvrir les 2 surfaces du support avec une couche photosensible en
utilisant un laminateur.3. Cover the 2 surfaces of the support with a photosensitive layer
using a laminator.
4. Refroidir le support. 4. Cool the support.
5. Préparer deux reproductions de votre image (dessin ou texte) sur du
film contact (négatif). 5. Prepare two reproductions of your image (drawing or text) on
contact film (negative).
6. Juxtaposer les-deux films en ajustant exactement l'image et les fixer
par leur extrêmité,de manier à glisser le support entre les deux
films.6. Juxtapose the two films by adjusting the image exactly and fix them
by their extremity, to slide the support between the two
movies.
7. Insoler les 2 surfaces du support en même temps par rayonnement ultra
violet.7. Insulate the 2 surfaces of the support at the same time by ultra radiation
purple.
8. Cette insolation permet 12 polymérisation des couches photosensibles
aux endroits non protégés.8. This exposure allows 12 polymerization of the photosensitive layers
in unprotected places.
Utiliser un système qui permet l'insolation des 2 surfaces en même
temps, afin d'éviter toute manipulation.Use a system that allows the exposure of the 2 surfaces at the same time
time, to avoid manipulation.
9. Séparer les films du support. 9. Separate the films from the support.
10. Eliminer, par un procédé de révélation chimique, les couches photo
sensibles du support là où elles n'ont pas été polymérisées.10. Eliminate the photo layers using a chemical development process
sensitive to the support where they have not been polymerized.
La polymérisation a durci les deux couches photosensibles aux endroit
insolés par la lumière, de sorte que les endroits qui n'ont pas été
touchés par les rayons ultraviolets s'enlèvent facilement par trempage
dans un bain de produits correspondants.The polymerization has hardened the two photosensitive layers in the place
exposed to light, so that places that have not been
affected by UV rays are easily removed by soaking
in a bath of corresponding products.
11. Attaque chimique du support des deux faces par projection chimique
(1 bar de pression).11. Chemical attack on the support of both sides by chemical projection
(1 bar pressure).
12. Morsure
gravure
aj ourage.
Stopper l'action de l'acide à l'étape voulue, par rinçage.12. Bite
engraving
adjourage.
Stop the action of the acid at the desired stage, by rinsing.
13. Lavage du support avec les produits adéquats. 13. Wash the support with the appropriate products.
DIFFERENTES POSSIBILITES OFFERTES PAR CE PROCEDE 1. Cette technique permet le découpage en série de pièces très finies. DIFFERENT POSSIBILITIES OFFERED BY THIS PROCESS 1. This technique allows cutting very finished parts into series.
2. Elle permet la reproduction en série sur des plaques de cuivre (ou
autre métal en utilisant les produits correspondants) de toute mage
(dessin - écriture - petites pièces ou accessoires - joints - rondelles).2. It allows serial reproduction on copper plates (or
other metal using the corresponding products) from any mage
(drawing - writing - small parts or accessories - seals - washers).
3. Elle permet d'affiner l'incrustation dans un matériau quelconque de la
plaque découpée.3. It makes it possible to refine the inlay in any material of the
cut plate.
MéTHODE D'-INCRUSTATION
Suivant le procédé décrit, réaliser une plaque de cuivre découpée.INCLUSIVE METHOD
According to the process described, make a cut copper plate.
Utiliser la plaque en pochoir pour produire la même image sur le
matériau à incruster.Use the stencil plate to produce the same image on the
material to be embedded.
Poser ce pochoir sur la surface à incruster. Place this stencil on the surface to be encrusted.
Appliquer dans les parties évidées un vernis inerte à l'acide employé. Apply in the hollowed out areas an inert varnish with the acid used.
Enlever le pochoir. Remove the stencil.
Creuser à l'acide les parties non isolées à la profondeur désirée
afin d'y incruster un exemplaire.Dig out the uninsulated parts with acid to the desired depth
in order to embed a copy.
Fixer par une colle. Fix with glue.
Poncer, lustrer. Sand, polish.
4. Le procédé qui vient d'être décrit permet de remplacer avantageusement
les méthodes traditionnelles de découpage des métaux. 4. The process which has just been described makes it possible to advantageously replace
traditional methods of cutting metals.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8715738A FR2623134B1 (en) | 1987-11-13 | 1987-11-13 | TECHNICAL PROCESS FOR CUTTING AND ADJUSTING METAL PLATES FOR THEIR REPRODUCTION AND INCRUSTATION |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8715738A FR2623134B1 (en) | 1987-11-13 | 1987-11-13 | TECHNICAL PROCESS FOR CUTTING AND ADJUSTING METAL PLATES FOR THEIR REPRODUCTION AND INCRUSTATION |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2623134A1 true FR2623134A1 (en) | 1989-05-19 |
| FR2623134B1 FR2623134B1 (en) | 1991-08-02 |
Family
ID=9356775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8715738A Expired - Lifetime FR2623134B1 (en) | 1987-11-13 | 1987-11-13 | TECHNICAL PROCESS FOR CUTTING AND ADJUSTING METAL PLATES FOR THEIR REPRODUCTION AND INCRUSTATION |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2623134B1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2136492A1 (en) * | 1996-04-12 | 1999-11-16 | Larrea Bellod Ivan Alejandro | Production process for manufacturing materials with encrustations, especially suitable for stone |
| US6290865B1 (en) * | 1998-11-30 | 2001-09-18 | Applied Materials, Inc. | Spin-rinse-drying process for electroplated semiconductor wafers |
| US6516815B1 (en) | 1999-07-09 | 2003-02-11 | Applied Materials, Inc. | Edge bead removal/spin rinse dry (EBR/SRD) module |
| US6770565B2 (en) | 2002-01-08 | 2004-08-03 | Applied Materials Inc. | System for planarizing metal conductive layers |
| US6824612B2 (en) | 2001-12-26 | 2004-11-30 | Applied Materials, Inc. | Electroless plating system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2017010A (en) * | 1978-03-27 | 1979-10-03 | Toppan Printing Co Ltd | Coloured decorative metal panel |
| FR2511949A1 (en) * | 1981-08-31 | 1983-03-04 | Fabre Gerald | Method of making lacquered inlaid pattern - involves engraving plate before coating with lacquer and polishing |
-
1987
- 1987-11-13 FR FR8715738A patent/FR2623134B1/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2017010A (en) * | 1978-03-27 | 1979-10-03 | Toppan Printing Co Ltd | Coloured decorative metal panel |
| FR2511949A1 (en) * | 1981-08-31 | 1983-03-04 | Fabre Gerald | Method of making lacquered inlaid pattern - involves engraving plate before coating with lacquer and polishing |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2136492A1 (en) * | 1996-04-12 | 1999-11-16 | Larrea Bellod Ivan Alejandro | Production process for manufacturing materials with encrustations, especially suitable for stone |
| US6290865B1 (en) * | 1998-11-30 | 2001-09-18 | Applied Materials, Inc. | Spin-rinse-drying process for electroplated semiconductor wafers |
| US6516815B1 (en) | 1999-07-09 | 2003-02-11 | Applied Materials, Inc. | Edge bead removal/spin rinse dry (EBR/SRD) module |
| US6824612B2 (en) | 2001-12-26 | 2004-11-30 | Applied Materials, Inc. | Electroless plating system |
| US6770565B2 (en) | 2002-01-08 | 2004-08-03 | Applied Materials Inc. | System for planarizing metal conductive layers |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2623134B1 (en) | 1991-08-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse | ||
| DA | Annulment of decision of lapse | ||
| ST | Notification of lapse | ||
| AR | Application made for restoration | ||
| BR | Restoration of rights | ||
| ST | Notification of lapse |