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FR2698485B1 - Device for mounting optoelectronic components and mounting method. - Google Patents

Device for mounting optoelectronic components and mounting method.

Info

Publication number
FR2698485B1
FR2698485B1 FR9214085A FR9214085A FR2698485B1 FR 2698485 B1 FR2698485 B1 FR 2698485B1 FR 9214085 A FR9214085 A FR 9214085A FR 9214085 A FR9214085 A FR 9214085A FR 2698485 B1 FR2698485 B1 FR 2698485B1
Authority
FR
France
Prior art keywords
mounting
optoelectronic components
mounting method
components
mounting optoelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9214085A
Other languages
French (fr)
Other versions
FR2698485A1 (en
Inventor
Yves Combemale
Philippe Richin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR9214085A priority Critical patent/FR2698485B1/en
Publication of FR2698485A1 publication Critical patent/FR2698485A1/en
Application granted granted Critical
Publication of FR2698485B1 publication Critical patent/FR2698485B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
FR9214085A 1992-11-24 1992-11-24 Device for mounting optoelectronic components and mounting method. Expired - Fee Related FR2698485B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9214085A FR2698485B1 (en) 1992-11-24 1992-11-24 Device for mounting optoelectronic components and mounting method.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9214085A FR2698485B1 (en) 1992-11-24 1992-11-24 Device for mounting optoelectronic components and mounting method.

Publications (2)

Publication Number Publication Date
FR2698485A1 FR2698485A1 (en) 1994-05-27
FR2698485B1 true FR2698485B1 (en) 1995-01-20

Family

ID=9435829

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9214085A Expired - Fee Related FR2698485B1 (en) 1992-11-24 1992-11-24 Device for mounting optoelectronic components and mounting method.

Country Status (1)

Country Link
FR (1) FR2698485B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10112274B4 (en) 2001-03-14 2006-05-24 Finisar Corp.(N.D.Ges.D.Staates Delaware), Sunnyvale Optoelectronic transmission module and method for its production

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2124402B (en) * 1982-07-27 1986-01-22 Standard Telephones Cables Ltd Injection laser packages
US4930857A (en) * 1989-05-19 1990-06-05 At&T Bell Laboratories Hybrid package arrangement
FR2661005B1 (en) * 1990-04-13 1993-04-23 Thomson Csf DEVICE FOR ALIGNING AND FIXING AN OPTICAL FIBER IN FRONT OF A SEMICONDUCTOR LASER.
US5109455A (en) * 1990-08-03 1992-04-28 Cts Corporation Optic interface hybrid
JP3065378B2 (en) * 1991-04-26 2000-07-17 富士写真光機株式会社 Circuit board for solid-state imaging device for electronic endoscope

Also Published As

Publication number Publication date
FR2698485A1 (en) 1994-05-27

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Legal Events

Date Code Title Description
CD Change of name or company name
ST Notification of lapse