FR2425790A1 - Perfectionnements aux circuits imprimes et a leurs procedes de fabrication - Google Patents
Perfectionnements aux circuits imprimes et a leurs procedes de fabricationInfo
- Publication number
- FR2425790A1 FR2425790A1 FR7813527A FR7813527A FR2425790A1 FR 2425790 A1 FR2425790 A1 FR 2425790A1 FR 7813527 A FR7813527 A FR 7813527A FR 7813527 A FR7813527 A FR 7813527A FR 2425790 A1 FR2425790 A1 FR 2425790A1
- Authority
- FR
- France
- Prior art keywords
- varnish
- necessary
- mfr
- electrically conducting
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002966 varnish Substances 0.000 title abstract 6
- 239000010949 copper Substances 0.000 title abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 230000008021 deposition Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 2
- 230000001464 adherent effect Effects 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
PROCEDE DE FABRICATION DE CIRCUITS IMPRIMES SUR UN SUBSTRAT ISOLANT. ON DEPOSE SUR LE SUBSTRAT UNE COUCHE SUPPORT DE VERNIS ELECTRIQUEMENT CONDUCTEUR, ON CONSTITUE SUR LE VERNIS UN MASQUE ADHERENT PRESENTANT UNE DECOUPE D'ACCES AU VERNIS SUIVANT LE TRACE DU CIRCUIT IMPRIME A REALISER, ON DEPOSE ELECTROLYTIQUEMENT UNE COUCHE DE CUIVRE 15 SUR LES PARTIES ACCESSIBLES DU VERNIS 11, ET ON DETRUIT PAR SOLVANT LE VERNIS SUPPORT 11 DANS TOUTES LES ZONES OU IL N'EST PAS PROTEGE PAR LE DEPOT DE CUIVRE, EN MEME TEMPS QUE LE MASQUE 12 QU'IL PORTE. APPLICATIONS COURANTES.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7813527A FR2425790A1 (fr) | 1978-05-08 | 1978-05-08 | Perfectionnements aux circuits imprimes et a leurs procedes de fabrication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7813527A FR2425790A1 (fr) | 1978-05-08 | 1978-05-08 | Perfectionnements aux circuits imprimes et a leurs procedes de fabrication |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2425790A1 true FR2425790A1 (fr) | 1979-12-07 |
| FR2425790B1 FR2425790B1 (fr) | 1981-07-24 |
Family
ID=9207986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7813527A Granted FR2425790A1 (fr) | 1978-05-08 | 1978-05-08 | Perfectionnements aux circuits imprimes et a leurs procedes de fabrication |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2425790A1 (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1988005990A1 (fr) * | 1987-02-05 | 1988-08-11 | Hughes Aircraft Company | Revetement de substrats avec des motifs metalliques epais formant des circuits |
| EP0446835A1 (fr) * | 1990-03-16 | 1991-09-18 | Heraeus Noblelight GmbH | Procédé de galvanisation |
| WO1991009511A3 (fr) * | 1989-12-19 | 1991-10-03 | Technology Applic Company Limi | Conducteurs electriques en resine conductrice |
| WO1997036464A1 (fr) * | 1996-03-27 | 1997-10-02 | Coates Brothers Plc | Production de plaquettes a circuits electriques |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1194112A (en) * | 1967-05-29 | 1970-06-10 | Ibm | Improvements in Methods of Manufacturing Printed Circuits |
| FR2234980A1 (fr) * | 1973-06-30 | 1975-01-24 | Lucas Electrical Co Ltd |
-
1978
- 1978-05-08 FR FR7813527A patent/FR2425790A1/fr active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1194112A (en) * | 1967-05-29 | 1970-06-10 | Ibm | Improvements in Methods of Manufacturing Printed Circuits |
| FR2234980A1 (fr) * | 1973-06-30 | 1975-01-24 | Lucas Electrical Co Ltd |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1988005990A1 (fr) * | 1987-02-05 | 1988-08-11 | Hughes Aircraft Company | Revetement de substrats avec des motifs metalliques epais formant des circuits |
| WO1991009511A3 (fr) * | 1989-12-19 | 1991-10-03 | Technology Applic Company Limi | Conducteurs electriques en resine conductrice |
| EP0446835A1 (fr) * | 1990-03-16 | 1991-09-18 | Heraeus Noblelight GmbH | Procédé de galvanisation |
| WO1997036464A1 (fr) * | 1996-03-27 | 1997-10-02 | Coates Brothers Plc | Production de plaquettes a circuits electriques |
| GB2315164A (en) * | 1996-03-27 | 1998-01-21 | Coates Brothers Plc | Production of electrical circuit boards |
| GB2315164B (en) * | 1996-03-27 | 2000-09-20 | Coates Brothers Plc | Production of electrical circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2425790B1 (fr) | 1981-07-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| HK82884A (en) | Methods of preparing substrate surface for electroless plating and products produced thereby | |
| GB1266000A (fr) | ||
| KR970058406A (ko) | 회로 기판 및 그의 제조 방법 | |
| GB1527108A (en) | Methods of forming conductors on substrates involving electroplating | |
| GB2113477A (en) | Method of producing printed circuits | |
| GB1268317A (en) | Improvements in or relating to the manufacture of conductor plates | |
| FR2296347A1 (fr) | Procede pour fabriquer des panneaux de circuits imprimes a couches multiples | |
| EP0265629A3 (fr) | Procédé de fabrication d'une carte de circuit imprimé comportant un placage de nickel | |
| ATE346483T1 (de) | Verfahren zur herstellung einer gedruckten leiterplatte | |
| SE8101360L (sv) | Forfarande for framstellning av tryckta ledarplattor med perforeringar, vars veggar er metalliserade | |
| US4622106A (en) | Methods for producing printed circuits | |
| FR2425790A1 (fr) | Perfectionnements aux circuits imprimes et a leurs procedes de fabrication | |
| ATE162923T1 (de) | Verfahren zur herstellung einer leiterplatte. | |
| CA2022400A1 (fr) | Methode pour accroitre la resistance d'isolement dans les circuits imprimes | |
| ES8305179A1 (es) | "procedimiento para la fabricacion de placas de circuitos que contienen en estado integrado resistencias electricas y-o lugares de contactos de conmutacion". | |
| JPS58207696A (ja) | パタ−ンめつきによるプリント配線板の製法 | |
| GB1212362A (en) | Improvements in manufacture of printed circuit boards | |
| EP0322997A3 (fr) | Procédé de fabrication de plaques à circuits imprimés | |
| JPS5674911A (en) | Manufacture of multilayer thin film coil | |
| GB829263A (en) | Method of making printed circuits | |
| GB2017416A (en) | Circuit board manufacturing method | |
| SU815979A1 (ru) | Способ изготовлени печатных плат | |
| GB1357661A (en) | Printed circuit boards | |
| GB1287791A (en) | A microcircuit and manufacture of same | |
| ES2006071A6 (es) | Un metodo para formar un circuito sobre una superficie de un sustrato aislante. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |