FR2380639A2 - N-CHANNEL MEMORIZATION FIELD EFFECT TRANSISTOR - Google Patents
N-CHANNEL MEMORIZATION FIELD EFFECT TRANSISTORInfo
- Publication number
- FR2380639A2 FR2380639A2 FR7802924A FR7802924A FR2380639A2 FR 2380639 A2 FR2380639 A2 FR 2380639A2 FR 7802924 A FR7802924 A FR 7802924A FR 7802924 A FR7802924 A FR 7802924A FR 2380639 A2 FR2380639 A2 FR 2380639A2
- Authority
- FR
- France
- Prior art keywords
- field effect
- effect transistor
- channel
- layer
- memorization field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005669 field effect Effects 0.000 title abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 230000015654 memory Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/65—Lateral DMOS [LDMOS] FETs
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0416—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and no select transistor, e.g. UV EPROM
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
- H10D30/684—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection
- H10D30/685—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection from the channel
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Volatile Memory (AREA)
Abstract
L'invention concerne un transistor à effet de champ de mémorisation à canal n. Ce transistor est constitué sous la forme d'un transistor D-MOS à effet de champ comportant une source (N+) et une couche diffusée (P) dans un substrat semi-conducteur (N-) ainsi qu'une porte de mémorisation (G1) et une porte de commande (G2) isolées par une couche de SiO2 et la distance r entre le canal et le raccord de drain (N+) est approximativement égale ou supérieure à l'épaisseur de la couche (P). Application notamment aux mémoires utilisées dans des installations de téléphonie.An n-channel storage field effect transistor is disclosed. This transistor is formed in the form of a D-MOS field effect transistor comprising a source (N +) and a diffused layer (P) in a semiconductor substrate (N-) as well as a storage gate (G1 ) and a control gate (G2) isolated by a layer of SiO2 and the distance r between the channel and the drain connection (N +) is approximately equal to or greater than the thickness of the layer (P). Application in particular to memories used in telephony installations.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2643932A DE2643932C2 (en) | 1974-09-20 | 1976-09-29 | n-channel memory FET |
| DE2643987A DE2643987C2 (en) | 1974-09-20 | 1976-09-29 | n-channel memory FET |
| DE19772706205 DE2706205A1 (en) | 1977-02-14 | 1977-02-14 | N-CHANNEL MEMORY FET |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2380639A2 true FR2380639A2 (en) | 1978-09-08 |
| FR2380639B2 FR2380639B2 (en) | 1983-01-21 |
Family
ID=32096460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7802924A Granted FR2380639A2 (en) | 1976-09-29 | 1978-02-02 | N-CHANNEL MEMORIZATION FIELD EFFECT TRANSISTOR |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2380639A2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2464536A1 (en) * | 1979-09-04 | 1981-03-06 | Texas Instruments Inc | FLOATING GRID SEMICONDUCTOR MEMORY, ELECTRICALLY PROGRAMMABLE, AND METHOD OF MANUFACTURING THE SAME |
| EP0205637A1 (en) * | 1985-06-25 | 1986-12-30 | Eaton Corporation | Trapped charge bidirectional power fet |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2033346A1 (en) * | 1969-02-17 | 1970-12-04 | Hughes Aircraft Co | |
| FR2236247A1 (en) * | 1973-07-05 | 1975-01-31 | Tokyo Shibaura Electric Co |
-
1978
- 1978-02-02 FR FR7802924A patent/FR2380639A2/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2033346A1 (en) * | 1969-02-17 | 1970-12-04 | Hughes Aircraft Co | |
| FR2236247A1 (en) * | 1973-07-05 | 1975-01-31 | Tokyo Shibaura Electric Co |
Non-Patent Citations (2)
| Title |
|---|
| EXBK/74 * |
| EXBK/77 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2464536A1 (en) * | 1979-09-04 | 1981-03-06 | Texas Instruments Inc | FLOATING GRID SEMICONDUCTOR MEMORY, ELECTRICALLY PROGRAMMABLE, AND METHOD OF MANUFACTURING THE SAME |
| EP0205637A1 (en) * | 1985-06-25 | 1986-12-30 | Eaton Corporation | Trapped charge bidirectional power fet |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2380639B2 (en) | 1983-01-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| FR2381389A1 (en) | FIELD-EFFECT TRANSISTOR SET FOR HIGH SOURCE-DRAIN VOLTAGES | |
| FR2373881A1 (en) | PROCESS FOR MANUFACTURING POWER FIELD EFFECT TRANSISTORS AND RESULTING TRANSISTOR STRUCTURES | |
| KR920010957A (en) | Thin film semiconductor devices | |
| FR2410364A1 (en) | PROCESS FOR MANUFACTURING NOTICE OF INSULATION BETWEEN SEMICONDUCTOR DEVICES AND DEVICES THUS OBTAINED | |
| GB1529023A (en) | Self-aligned cmos process for bulk silicon device | |
| FR2396412A1 (en) | ||
| KR910003816A (en) | Cell structure of semiconductor memory device | |
| FR2423030A1 (en) | SEMICONDUCTOR MEMORY CELL CONTAINING CONTROL CONDUCTORS WITH HIGH CONDUCTIVITY | |
| SE7507147L (en) | FIELD POWER TRANSISTOR. | |
| FR2396414A1 (en) | EXTREMELY SHORT LENGTH CHANNEL FIELD-EFFECT TRANSISTOR | |
| FR2380639A2 (en) | N-CHANNEL MEMORIZATION FIELD EFFECT TRANSISTOR | |
| ES8800789A1 (en) | IMPROVEMENTS IN A MOS TRANSISTOR DEVICE | |
| FR2366668A2 (en) | N-CHANNEL MEMORIZATION FIELD EFFECT TRANSISTOR | |
| GB1380466A (en) | Gate protective device for insulated gate fieldeffect transistors | |
| TW371355B (en) | High voltage metal insulator semiconductor field effect transistor and semiconductor integrated circuit device | |
| JPS57113262A (en) | Voltage dividing system for semiconductor integrated circuit | |
| JPS57107067A (en) | Manufacture of semiconductor device | |
| FR2397069A1 (en) | Integrated semiconductor memory cell prodn. - uses IGFET and capacitor and doping material for IGFET drain or source zone providing opposite conductivity | |
| JPS61100967A (en) | Manufacturing method of thin film transistor | |
| FR2396416A1 (en) | SHORT LENGTH CHANNEL FIELD EFFECT TRANSISTOR | |
| TW198130B (en) | Structure and method of manufacturing thin film transistors | |
| GB1363190A (en) | Semiconductor memory device | |
| KR960015806A (en) | Manufacturing method of semiconductor device | |
| KR900017179A (en) | Semiconductor devices | |
| JPS5489587A (en) | Mos field effect type transistor |