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FR2356509A1 - Support pour cablage imprime - Google Patents

Support pour cablage imprime

Info

Publication number
FR2356509A1
FR2356509A1 FR7719803A FR7719803A FR2356509A1 FR 2356509 A1 FR2356509 A1 FR 2356509A1 FR 7719803 A FR7719803 A FR 7719803A FR 7719803 A FR7719803 A FR 7719803A FR 2356509 A1 FR2356509 A1 FR 2356509A1
Authority
FR
France
Prior art keywords
metal foil
carrier plate
printed circuits
anode
closed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7719803A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2356509A1 publication Critical patent/FR2356509A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036Multilayers with layers of different types
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0116Porous, e.g. foam
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0284Paper, e.g. as reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0293Non-woven fibrous reinforcement

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

Le matériau du support présente une structure dite en sandwich et un noyau de matière synthétique mousse. Des deux côtés du noyau est prévue une couche terminale reliée au noyau et contenant du matériau fibreux. Du matériau approprié pour la couche terminale est une feuille de papier dur ou une pellicule ou un tissu en fibres de verre munies de mousse de matière synthétique. L'épaisseur du support est d'environ 1 à 3 mm, l'épaisseur de la couche terminale étant de 0,2 à 0,4 mm. Application : support pour câblage imprimé.
FR7719803A 1976-06-28 1977-06-28 Support pour cablage imprime Withdrawn FR2356509A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7607048A NL7607048A (nl) 1976-06-28 1976-06-28 Dragerplaat voor gedrukte bedradingen.

Publications (1)

Publication Number Publication Date
FR2356509A1 true FR2356509A1 (fr) 1978-01-27

Family

ID=19826463

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7719803A Withdrawn FR2356509A1 (fr) 1976-06-28 1977-06-28 Support pour cablage imprime

Country Status (4)

Country Link
JP (1) JPS531863A (fr)
DE (1) DE2726912A1 (fr)
FR (1) FR2356509A1 (fr)
NL (1) NL7607048A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525849A1 (fr) * 1982-04-26 1983-10-28 Hutchinson Substrat de circuit imprime
EP0211979A1 (fr) * 1985-08-14 1987-03-04 Toray Industries, Inc. Plaquette à circuit imprimé multicouche contenant des particules de remplissage distribuées régulièrement et méthode pour fabriquer celle-ci
EP0251292A1 (fr) * 1986-07-02 1988-01-07 Alcatel Transmission Par Faisceaux Hertziens A.T.F.H. Support composite avec gravure metallique
WO2005075189A3 (fr) * 2004-02-02 2005-12-01 L & L Products Inc Perfectionnements relatifs a des matieres composites

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3316362C2 (de) * 1983-05-05 1985-03-07 Dynamit Nobel Ag, 5210 Troisdorf Schichtpreßstoff auf Epoxydharzbasis für gedruckte Schaltungen

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2525849A1 (fr) * 1982-04-26 1983-10-28 Hutchinson Substrat de circuit imprime
EP0211979A1 (fr) * 1985-08-14 1987-03-04 Toray Industries, Inc. Plaquette à circuit imprimé multicouche contenant des particules de remplissage distribuées régulièrement et méthode pour fabriquer celle-ci
EP0251292A1 (fr) * 1986-07-02 1988-01-07 Alcatel Transmission Par Faisceaux Hertziens A.T.F.H. Support composite avec gravure metallique
FR2600941A1 (fr) * 1986-07-02 1988-01-08 Alcatel Thomson Faisceaux Support composite avec gravure metallique
WO2005075189A3 (fr) * 2004-02-02 2005-12-01 L & L Products Inc Perfectionnements relatifs a des matieres composites
US20080241576A1 (en) * 2004-02-02 2008-10-02 Eric Le Gall Composite Materials
US8334055B2 (en) 2004-02-02 2012-12-18 Zephyros, Inc Composite materials
US9186864B2 (en) 2004-02-02 2015-11-17 Zephyros, Inc. Composite materials
US10035326B2 (en) 2004-02-02 2018-07-31 Zephyros, Inc. Composite materials
US10688752B2 (en) 2004-02-02 2020-06-23 Zephyros, Inc. Composite materials
US11046042B2 (en) 2004-02-02 2021-06-29 Zephyros, Inc. Composite materials
US11618239B2 (en) 2004-02-02 2023-04-04 Zephyros, Inc. Composite materials

Also Published As

Publication number Publication date
DE2726912A1 (de) 1977-12-29
NL7607048A (nl) 1977-12-30
JPS531863A (en) 1978-01-10

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Legal Events

Date Code Title Description
ST Notification of lapse