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FI965301A7 - Method and arrangement for heating a component - Google Patents

Method and arrangement for heating a component Download PDF

Info

Publication number
FI965301A7
FI965301A7 FI965301A FI965301A FI965301A7 FI 965301 A7 FI965301 A7 FI 965301A7 FI 965301 A FI965301 A FI 965301A FI 965301 A FI965301 A FI 965301A FI 965301 A7 FI965301 A7 FI 965301A7
Authority
FI
Finland
Prior art keywords
heating
arrangement
component
Prior art date
Application number
FI965301A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI965301A0 (en
FI965301L (en
Inventor
Ari Isteri
Original Assignee
Nokia Networks Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Networks Oy filed Critical Nokia Networks Oy
Priority to FI965301A priority Critical patent/FI965301A7/en
Publication of FI965301A0 publication Critical patent/FI965301A0/en
Priority to AU53239/98A priority patent/AU728378B2/en
Priority to PCT/FI1997/000834 priority patent/WO1998030075A2/en
Priority to EP97950212A priority patent/EP0983714A2/en
Priority to JP52965898A priority patent/JP2001508942A/en
Publication of FI965301L publication Critical patent/FI965301L/en
Publication of FI965301A7 publication Critical patent/FI965301A7/en
Priority to NO993236A priority patent/NO993236L/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • General Induction Heating (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Resistance Heating (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI965301A 1996-12-31 1996-12-31 Method and arrangement for heating a component FI965301A7 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FI965301A FI965301A7 (en) 1996-12-31 1996-12-31 Method and arrangement for heating a component
AU53239/98A AU728378B2 (en) 1996-12-31 1997-12-30 Method and arrangement for heating a component
PCT/FI1997/000834 WO1998030075A2 (en) 1996-12-31 1997-12-30 Method and arrangement for heating a component
EP97950212A EP0983714A2 (en) 1996-12-31 1997-12-30 Method and arrangement for heating a component
JP52965898A JP2001508942A (en) 1996-12-31 1997-12-30 Method and component for heating parts
NO993236A NO993236L (en) 1996-12-31 1999-06-29 Method and apparatus for heating a component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI965301A FI965301A7 (en) 1996-12-31 1996-12-31 Method and arrangement for heating a component

Publications (3)

Publication Number Publication Date
FI965301A0 FI965301A0 (en) 1996-12-31
FI965301L FI965301L (en) 1998-07-01
FI965301A7 true FI965301A7 (en) 1998-07-01

Family

ID=8547390

Family Applications (1)

Application Number Title Priority Date Filing Date
FI965301A FI965301A7 (en) 1996-12-31 1996-12-31 Method and arrangement for heating a component

Country Status (6)

Country Link
EP (1) EP0983714A2 (en)
JP (1) JP2001508942A (en)
AU (1) AU728378B2 (en)
FI (1) FI965301A7 (en)
NO (1) NO993236L (en)
WO (1) WO1998030075A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI981032A7 (en) 1998-05-08 1999-11-09 Nokia Corp Heating method and circuit board
DE19851172A1 (en) * 1998-11-06 2000-05-11 Alcatel Sa Arrangement for heating an assembled printed circuit
GB2345453B (en) * 1999-09-14 2000-12-27 Lee John Robinson Laminated reflow soldering
DE202005001163U1 (en) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Circuit board for circuitry subject to temperature fluctuations, has heating wire arranged on or in circuit board and connected to power supply
US11350490B2 (en) * 2017-03-08 2022-05-31 Raytheon Company Integrated temperature control for multi-layer ceramics and method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440407A (en) * 1966-12-29 1969-04-22 Rca Corp Temperature controlled circuit boards
US4769525A (en) * 1986-09-02 1988-09-06 Hughes Aircraft Company Circuit package attachment apparatus and method
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
FR2668876B1 (en) * 1990-11-07 1992-12-24 Alcatel Espace ELECTRONIC TEMPERATURE CONTROL CIRCUIT.
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
GB9508631D0 (en) * 1995-04-28 1995-06-14 Smiths Industries Ltd Electrical circuits

Also Published As

Publication number Publication date
WO1998030075A2 (en) 1998-07-09
NO993236D0 (en) 1999-06-29
WO1998030075A3 (en) 1998-08-27
FI965301A0 (en) 1996-12-31
FI965301L (en) 1998-07-01
JP2001508942A (en) 2001-07-03
AU728378B2 (en) 2001-01-11
AU5323998A (en) 1998-07-31
EP0983714A2 (en) 2000-03-08
NO993236L (en) 1999-06-29

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