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FI20135487L - Parannettu paineanturi - Google Patents

Parannettu paineanturi Download PDF

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Publication number
FI20135487L
FI20135487L FI20135487A FI20135487A FI20135487L FI 20135487 L FI20135487 L FI 20135487L FI 20135487 A FI20135487 A FI 20135487A FI 20135487 A FI20135487 A FI 20135487A FI 20135487 L FI20135487 L FI 20135487L
Authority
FI
Finland
Prior art keywords
pressure sensor
improved pressure
improved
sensor
pressure
Prior art date
Application number
FI20135487A
Other languages
English (en)
Swedish (sv)
Other versions
FI125958B (fi
Inventor
Heikki Kuisma
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Priority to FI20135487A priority Critical patent/FI125958B/fi
Priority to US14/270,813 priority patent/US9442032B2/en
Priority to TW103116053A priority patent/TWI620921B/zh
Priority to CN201480026198.9A priority patent/CN105229438B/zh
Priority to EP14727070.6A priority patent/EP2994733B1/en
Priority to PCT/IB2014/061282 priority patent/WO2014181274A1/en
Priority to KR1020157032082A priority patent/KR101830618B1/ko
Priority to JP2016512463A priority patent/JP6128278B2/ja
Publication of FI20135487L publication Critical patent/FI20135487L/fi
Application granted granted Critical
Publication of FI125958B publication Critical patent/FI125958B/fi

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/007—For controlling stiffness, e.g. ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
    • G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
    • G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
    • G01L7/082—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type construction or mounting of diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0048—Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
FI20135487A 2013-05-10 2013-05-10 Parannettu paineanturi FI125958B (fi)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FI20135487A FI125958B (fi) 2013-05-10 2013-05-10 Parannettu paineanturi
US14/270,813 US9442032B2 (en) 2013-05-10 2014-05-06 Microelectromechanical pressure sensor with robust diaphragm
TW103116053A TWI620921B (zh) 2013-05-10 2014-05-06 經改良的壓力感測器
CN201480026198.9A CN105229438B (zh) 2013-05-10 2014-05-08 改进的压力传感器
EP14727070.6A EP2994733B1 (en) 2013-05-10 2014-05-08 An improved pressure sensor
PCT/IB2014/061282 WO2014181274A1 (en) 2013-05-10 2014-05-08 An improved pressure sensor
KR1020157032082A KR101830618B1 (ko) 2013-05-10 2014-05-08 개선된 압력 센서
JP2016512463A JP6128278B2 (ja) 2013-05-10 2014-05-08 改良された圧力センサー

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20135487A FI125958B (fi) 2013-05-10 2013-05-10 Parannettu paineanturi

Publications (2)

Publication Number Publication Date
FI20135487L true FI20135487L (fi) 2014-11-11
FI125958B FI125958B (fi) 2016-04-29

Family

ID=50841916

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20135487A FI125958B (fi) 2013-05-10 2013-05-10 Parannettu paineanturi

Country Status (8)

Country Link
US (1) US9442032B2 (fi)
EP (1) EP2994733B1 (fi)
JP (1) JP6128278B2 (fi)
KR (1) KR101830618B1 (fi)
CN (1) CN105229438B (fi)
FI (1) FI125958B (fi)
TW (1) TWI620921B (fi)
WO (1) WO2014181274A1 (fi)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI125447B (fi) * 2013-06-04 2015-10-15 Murata Manufacturing Co Parannettu paineanturi
US20200315539A1 (en) 2017-11-08 2020-10-08 Murata Manufacturing Co., Ltd. Rapid exchange catheter system for fractional flow reserve measurement
FR3074096B1 (fr) * 2017-11-27 2019-12-20 Safran Electronics & Defense Dispositif autonome de mesure de pression embarque procede de mesure de pression
CN112189130A (zh) * 2018-05-22 2021-01-05 株式会社村田制作所 压力检测元件及压力检测装置
WO2020121464A1 (ja) * 2018-12-13 2020-06-18 三菱電機株式会社 引張検出装置、及びこれを備えた移動体システム
DE102018222738A1 (de) 2018-12-21 2020-06-25 Robert Bosch Gmbh Mikromechanische Drucksensorvorrichtung und ein entsprechendes Herstellungsverfahren
DE102018222758A1 (de) * 2018-12-21 2020-06-25 Robert Bosch Gmbh MEMS-Sensor mit einer Membran sowie Verfahren zur Herstellung eines MEMS-Sensors
DE102018222770A1 (de) 2018-12-21 2020-06-25 Robert Bosch Gmbh Mikromechanische Sensoreinrichtung und Verfahren zum Herstellen einer mikromechanischen Sensoreinrichtung
CN110243532A (zh) * 2019-04-22 2019-09-17 西安石油大学 一种管道油气压力监测的光纤光栅压力传感器
US11656480B2 (en) * 2019-07-12 2023-05-23 Magic Leap, Inc. Methods and systems for augmented reality display with dynamic field of view

Family Cites Families (27)

* Cited by examiner, † Cited by third party
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JPS5241794A (en) * 1975-09-29 1977-03-31 Toshiba Corp Underwater exploring device
WO1993012410A1 (en) 1991-12-13 1993-06-24 Honeywell Inc. Piezoresistive silicon pressure sensor design
FR2687783B1 (fr) * 1992-02-20 1994-05-20 Sextant Avionique Micro-capteur de pression.
US5528452A (en) * 1994-11-22 1996-06-18 Case Western Reserve University Capacitive absolute pressure sensor
US6388279B1 (en) 1997-06-11 2002-05-14 Denso Corporation Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof
JP2001050841A (ja) 1999-08-04 2001-02-23 Fujikura Ltd 半導体圧力センサおよびその製造方法
JP2002181648A (ja) * 2000-12-19 2002-06-26 Fujikura Ltd 圧力センサ
JP2002195903A (ja) * 2000-12-26 2002-07-10 Fujikura Ltd 圧力センサ
FI114825B (fi) 2002-02-13 2004-12-31 Vti Technologies Oy Menetelmä kapasitiivisen anturin lämpötilariippuvuuden pienentämiseksi sekä kapasitiivinen anturirakenne
US7499604B1 (en) * 2004-12-12 2009-03-03 Burns David W Optically coupled resonant pressure sensor and process
JP4585426B2 (ja) * 2005-10-31 2010-11-24 アルプス電気株式会社 静電容量型圧力センサ
JP2007225344A (ja) * 2006-02-21 2007-09-06 Epson Toyocom Corp 圧力センサ
JP4916006B2 (ja) * 2007-02-28 2012-04-11 株式会社山武 圧力センサ
US9341529B2 (en) * 2009-11-04 2016-05-17 Rohm Co., Ltd Pressure sensor and method for manufacturing pressure sensor
JP2011220927A (ja) 2010-04-13 2011-11-04 Yamatake Corp 圧力センサ
US8569851B2 (en) 2010-06-18 2013-10-29 General Electric Company Sensor and method for fabricating the same
FR2963099B1 (fr) 2010-07-22 2013-10-04 Commissariat Energie Atomique Capteur de pression dynamique mems, en particulier pour des applications a la realisation de microphones
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TWI442035B (zh) * 2011-07-22 2014-06-21 Univ Nat Taiwan 壓力感測器及感測陣列
JP5737148B2 (ja) * 2011-11-14 2015-06-17 オムロン株式会社 静電容量型圧力センサとその製造方法及び入力装置
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FI125959B (fi) * 2013-05-10 2016-04-29 Murata Manufacturing Co Mikroelektromekaaninen laite ja mikroelektromekaanisen laitteen valmistusmenetelmä
FI125960B (fi) * 2013-05-28 2016-04-29 Murata Manufacturing Co Parannettu paineanturi
FI125447B (fi) * 2013-06-04 2015-10-15 Murata Manufacturing Co Parannettu paineanturi
FI126999B (fi) * 2014-01-17 2017-09-15 Murata Manufacturing Co Parannettu paineanturi

Also Published As

Publication number Publication date
EP2994733B1 (en) 2018-01-31
KR101830618B1 (ko) 2018-02-21
JP2016526157A (ja) 2016-09-01
TWI620921B (zh) 2018-04-11
US20150226624A1 (en) 2015-08-13
WO2014181274A1 (en) 2014-11-13
KR20150140794A (ko) 2015-12-16
TW201502483A (zh) 2015-01-16
US9442032B2 (en) 2016-09-13
EP2994733A1 (en) 2016-03-16
JP6128278B2 (ja) 2017-05-17
CN105229438A (zh) 2016-01-06
FI125958B (fi) 2016-04-29
CN105229438B (zh) 2017-11-10

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