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FI20096363A7 - Järjestely nestejäähdyttimessä - Google Patents

Järjestely nestejäähdyttimessä

Info

Publication number
FI20096363A7
FI20096363A7 FI20096363A FI20096363A FI20096363A7 FI 20096363 A7 FI20096363 A7 FI 20096363A7 FI 20096363 A FI20096363 A FI 20096363A FI 20096363 A FI20096363 A FI 20096363A FI 20096363 A7 FI20096363 A7 FI 20096363A7
Authority
FI
Finland
Prior art keywords
arrangement
liquid cooler
cooler
liquid
Prior art date
Application number
FI20096363A
Other languages
English (en)
Swedish (sv)
Other versions
FI20096363A0 (fi
FI124731B (fi
Inventor
Petri Kamula
Original Assignee
Vacon Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vacon Oyj filed Critical Vacon Oyj
Priority to FI20096363A priority Critical patent/FI124731B/fi
Publication of FI20096363A0 publication Critical patent/FI20096363A0/fi
Priority to DK10190297.1T priority patent/DK2337436T3/da
Priority to EP10190297A priority patent/EP2337436B1/en
Priority to US12/949,386 priority patent/US9022101B2/en
Priority to CN201010601124.7A priority patent/CN102123577B/zh
Publication of FI20096363A7 publication Critical patent/FI20096363A7/fi
Application granted granted Critical
Publication of FI124731B publication Critical patent/FI124731B/fi

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927Liquid coolant without phase change
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FI20096363A 2009-12-18 2009-12-18 Järjestely nestejäähdyttimessä FI124731B (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI20096363A FI124731B (fi) 2009-12-18 2009-12-18 Järjestely nestejäähdyttimessä
DK10190297.1T DK2337436T3 (da) 2009-12-18 2010-11-08 Arrangement i en væskekøler
EP10190297A EP2337436B1 (en) 2009-12-18 2010-11-08 Arrangement in a liquid cooler
US12/949,386 US9022101B2 (en) 2009-12-18 2010-11-18 Arrangement in a liquid cooler
CN201010601124.7A CN102123577B (zh) 2009-12-18 2010-12-17 一种液体冷却器中的装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20096363 2009-12-18
FI20096363A FI124731B (fi) 2009-12-18 2009-12-18 Järjestely nestejäähdyttimessä

Publications (3)

Publication Number Publication Date
FI20096363A0 FI20096363A0 (fi) 2009-12-18
FI20096363A7 true FI20096363A7 (fi) 2011-06-19
FI124731B FI124731B (fi) 2014-12-31

Family

ID=41462821

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20096363A FI124731B (fi) 2009-12-18 2009-12-18 Järjestely nestejäähdyttimessä

Country Status (5)

Country Link
US (1) US9022101B2 (fi)
EP (1) EP2337436B1 (fi)
CN (1) CN102123577B (fi)
DK (1) DK2337436T3 (fi)
FI (1) FI124731B (fi)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2574157A1 (de) * 2011-09-23 2013-03-27 AEG Power Solutions B.V. Leistungselektronikbaugruppe und Anordnung umfassend wenigstens eine solche Leistungselektronikbaugruppe
FI20126218L (fi) 2012-11-20 2014-05-21 Vacon Oyj Tehoelektroniikkalaite
CN108029221B (zh) * 2015-09-14 2019-11-29 三菱电机株式会社 冷却器、电力转换装置及冷却系统
CN105234016A (zh) * 2015-09-28 2016-01-13 洛阳帝博石化装备有限公司 一种适用于二流体喷嘴的冷却部件
CN211909480U (zh) * 2016-11-28 2020-11-10 西门子股份公司 变流器、高压直流传输设施和无功功率补偿设施
FR3084810B1 (fr) * 2018-07-31 2022-01-14 Valeo Systemes Thermiques Element de regulation thermique d'un composant electrique, d'un vehicule automobile, susceptible de degager de la chaleur lors de son fonctionnement

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3063682A (en) * 1960-08-15 1962-11-13 American Air Filter Co Heat exchange unit
US4303124A (en) * 1979-06-04 1981-12-01 The A.P.V. Company Limited Plate heat exchanger
DE3683034D1 (de) * 1986-01-16 1992-01-30 Siemens Ag Vorrichtung fuer eine fluessigkeitskuehlung eines elektrischen bauelementes, insbesondere halbleiter-bauelementes.
US5178209A (en) * 1988-07-12 1993-01-12 Sanden Corporation Condenser for automotive air conditioning systems
FR2729044B1 (fr) 1994-12-30 1997-01-24 Atherm Element refroisisseur et connecteur pour un composant electronique de puissance refroidi par un fluide electriquement isole du composant
CA2203213A1 (en) 1996-05-31 1997-11-30 R-Theta Inc. Heat sink with coolant accelerator
US6005772A (en) * 1997-05-20 1999-12-21 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US6032726A (en) 1997-06-30 2000-03-07 Solid State Cooling Systems Low-cost liquid heat transfer plate and method of manufacturing therefor
US6031751A (en) 1998-01-20 2000-02-29 Reliance Electric Industrial Company Small volume heat sink/electronic assembly
US7017656B2 (en) * 2001-05-24 2006-03-28 Honeywell International, Inc. Heat exchanger with manifold tubes for stiffening and load bearing
FI117838B (fi) 2003-06-04 2007-03-15 Vacon Oyj Nestejäähdytyselementti ja nestejäähdytyselementin liittämisjärjestely
EP1600208A1 (en) * 2004-05-24 2005-11-30 Methanol Casale S.A. Plate-type heat-exchanger
JP2008528935A (ja) * 2005-02-02 2008-07-31 キャリア コーポレイション ヒートポンプヘッダ用管状挿入物及び双方向流装置
WO2007065666A2 (de) * 2005-12-08 2007-06-14 Sew-Eurodrive Gmbh & Co. Kg Gerät, baureihe von geräten, vorrichtung mit gehäuseteilen, verfahren, verwendung eines luftkühlers und verwendung eines flüssigkeitskühlers
DE102006057796B4 (de) * 2005-12-08 2011-03-03 Sew-Eurodrive Gmbh & Co. Kg Kühlanordnung für Wärme erzeugende elektrische Komponenten und elektrisches Gerät damit
CN101005747B (zh) * 2006-01-21 2010-05-26 富准精密工业(深圳)有限公司 液冷散热装置及用于该液冷散热装置的热交换器
ATE481611T1 (de) * 2007-08-27 2010-10-15 Abb Research Ltd Wärmetauscher für komponenten der leistungselektronik
US20090173482A1 (en) * 2008-01-09 2009-07-09 Beamer Henry E Distributor tube subassembly
JP4785878B2 (ja) * 2008-02-06 2011-10-05 本田技研工業株式会社 冷却装置及び該冷却装置を備える電気車両

Also Published As

Publication number Publication date
DK2337436T3 (da) 2013-03-11
FI20096363A0 (fi) 2009-12-18
EP2337436A2 (en) 2011-06-22
CN102123577A (zh) 2011-07-13
US20110146962A1 (en) 2011-06-23
FI124731B (fi) 2014-12-31
US9022101B2 (en) 2015-05-05
EP2337436A3 (en) 2011-08-03
CN102123577B (zh) 2014-02-19
EP2337436B1 (en) 2012-11-21

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