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FI20095860A0 - Elektroniikkalaite - Google Patents

Elektroniikkalaite

Info

Publication number
FI20095860A0
FI20095860A0 FI20095860A FI20095860A FI20095860A0 FI 20095860 A0 FI20095860 A0 FI 20095860A0 FI 20095860 A FI20095860 A FI 20095860A FI 20095860 A FI20095860 A FI 20095860A FI 20095860 A0 FI20095860 A0 FI 20095860A0
Authority
FI
Finland
Prior art keywords
electronic device
electronic
Prior art date
Application number
FI20095860A
Other languages
English (en)
Swedish (sv)
Other versions
FI122621B (fi
FI20095860L (fi
Inventor
Tero Peltola
Mikko Silvennoinen
Original Assignee
Perlos Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perlos Oyj filed Critical Perlos Oyj
Priority to FI20095860A priority Critical patent/FI122621B/fi
Publication of FI20095860A0 publication Critical patent/FI20095860A0/fi
Priority to CN201080036722.2A priority patent/CN102484662B/zh
Priority to EP10765466A priority patent/EP2467996A2/en
Priority to PCT/FI2010/050633 priority patent/WO2011020946A2/en
Publication of FI20095860L publication Critical patent/FI20095860L/fi
Application granted granted Critical
Publication of FI122621B publication Critical patent/FI122621B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14688—Coating articles provided with a decoration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/105—Mechanically attached to another device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Casings For Electric Apparatus (AREA)
  • Telephone Set Structure (AREA)
FI20095860A 2009-08-20 2009-08-20 Elektroniikkalaite ja sen kuoriosa FI122621B (fi)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20095860A FI122621B (fi) 2009-08-20 2009-08-20 Elektroniikkalaite ja sen kuoriosa
CN201080036722.2A CN102484662B (zh) 2009-08-20 2010-08-16 电子设备的包括挠性连接元件的覆盖部件
EP10765466A EP2467996A2 (en) 2009-08-20 2010-08-16 Cover comprising a flexible connecting element for an electronic device
PCT/FI2010/050633 WO2011020946A2 (en) 2009-08-20 2010-08-16 Electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20095860 2009-08-20
FI20095860A FI122621B (fi) 2009-08-20 2009-08-20 Elektroniikkalaite ja sen kuoriosa

Publications (3)

Publication Number Publication Date
FI20095860A0 true FI20095860A0 (fi) 2009-08-20
FI20095860L FI20095860L (fi) 2011-02-21
FI122621B FI122621B (fi) 2012-04-30

Family

ID=41050686

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20095860A FI122621B (fi) 2009-08-20 2009-08-20 Elektroniikkalaite ja sen kuoriosa

Country Status (4)

Country Link
EP (1) EP2467996A2 (fi)
CN (1) CN102484662B (fi)
FI (1) FI122621B (fi)
WO (1) WO2011020946A2 (fi)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102104640A (zh) * 2009-12-18 2011-06-22 索尼爱立信移动通讯股份有限公司 用于移动通信设备的照明壳盖
JP5314773B2 (ja) * 2012-02-10 2013-10-16 ホシデン株式会社 部品モジュール
US9297675B2 (en) 2013-10-04 2016-03-29 Tactotek Oy Illuminated indicator structures for electronic devices
DE102014106585A1 (de) 2014-05-09 2015-11-12 Leonhard Kurz Stiftung & Co. Kg Mehrschichtkörper und Verfahren zu dessen Herstellung
EP3124197B1 (en) 2015-07-31 2017-12-20 C.R.F. Società Consortile per Azioni Method for manufacturing a component for a motor-vehicle interior
DE102015222190B4 (de) * 2015-11-11 2019-03-28 Itt Manufacturing Enterprises Llc Steckverbinder und Motor- oder Ventilabdeckungselement umfassend einen Steckverbinder
WO2017219260A1 (zh) * 2016-06-22 2017-12-28 广东欧珀移动通信有限公司 摄像头组件及移动终端
CN108048794B (zh) * 2017-12-26 2019-12-03 昆山英利悦电子有限公司 一种用于遮蔽手机type-c充电接口引脚的pvd治具
DE102019126232B4 (de) * 2019-09-30 2024-11-14 Lisa Dräxlmaier GmbH Verfahren zum herstellen eines stromführenden fahrzeugbauteils und fahrzeugbauteil
CN114979319B (zh) * 2021-02-24 2023-04-14 Oppo广东移动通信有限公司 电子设备及其壳体组件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475399A (ja) * 1990-07-17 1992-03-10 Matsushita Electric Ind Co Ltd 多層回路部材およびその製造方法
US6466522B1 (en) * 1996-03-08 2002-10-15 Citizen Watch Co., Ltd. Indicating plate for watches
US5979043A (en) * 1997-07-14 1999-11-09 Ford Motor Company Method of manufacturing a circuit assembly from two or more layers of flexible film
EP1601172B1 (en) * 1997-12-29 2007-10-03 Samsung Electronics Co., Ltd. Mobile communication terminal with touch pad
US7112885B2 (en) * 2003-07-07 2006-09-26 Board Of Regents, The University Of Texas System System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
US20080094025A1 (en) * 2006-10-20 2008-04-24 Rosenblatt Michael N Solar cells on portable devices
WO2008123191A1 (ja) * 2007-03-30 2008-10-16 Nissha Printing Co., Ltd. 樹脂成形体及びその製造方法
TWI348636B (en) * 2007-08-03 2011-09-11 High Tech Comp Corp Handheld electronic apparatus and touch panel thereof
KR101379073B1 (ko) * 2007-08-28 2014-03-28 삼성전자주식회사 솔라 셀을 이용한 배터리 충전 장치 및 방법
JP4756020B2 (ja) * 2007-09-25 2011-08-24 株式会社東芝 筐体及びその製造方法、並びに電子機器
CN201274473Y (zh) * 2008-07-30 2009-07-15 深圳易盛泰科技有限公司 手机内置天线结构

Also Published As

Publication number Publication date
CN102484662A (zh) 2012-05-30
WO2011020946A3 (en) 2011-06-23
FI122621B (fi) 2012-04-30
WO2011020946A2 (en) 2011-02-24
CN102484662B (zh) 2015-05-13
EP2467996A2 (en) 2012-06-27
FI20095860L (fi) 2011-02-21

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