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FI20075428L - Nanopertikkelisysteemeihin liittyvä menetelmä ja laite - Google Patents

Nanopertikkelisysteemeihin liittyvä menetelmä ja laite Download PDF

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Publication number
FI20075428L
FI20075428L FI20075428A FI20075428A FI20075428L FI 20075428 L FI20075428 L FI 20075428L FI 20075428 A FI20075428 A FI 20075428A FI 20075428 A FI20075428 A FI 20075428A FI 20075428 L FI20075428 L FI 20075428L
Authority
FI
Finland
Prior art keywords
device related
nanoparticle systems
nanoparticle
systems
Prior art date
Application number
FI20075428A
Other languages
English (en)
Swedish (sv)
Other versions
FI122014B (fi
FI20075428A0 (fi
Inventor
Mark Allen
Tomi Mattila
Ari Alastalo
Heikki Seppae
Original Assignee
Valtion Teknillinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valtion Teknillinen filed Critical Valtion Teknillinen
Priority to FI20075428A priority Critical patent/FI122014B/fi
Publication of FI20075428A0 publication Critical patent/FI20075428A0/fi
Priority to EP08157720A priority patent/EP2001272B1/en
Priority to CN200810109970XA priority patent/CN101325151B/zh
Priority to US12/155,674 priority patent/US8916089B2/en
Priority to AT08157720T priority patent/ATE531243T1/de
Publication of FI20075428L publication Critical patent/FI20075428L/fi
Application granted granted Critical
Publication of FI122014B publication Critical patent/FI122014B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76888—By rendering at least a portion of the conductor non conductive, e.g. oxidation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0121—Patterning, e.g. plating or etching by moving electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Immobilizing And Processing Of Enzymes And Microorganisms (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
FI20075428A 2007-06-08 2007-06-08 Menetelmä ja laite nanopartikkelijärjestelmien toiminnallistamiseksi FI122014B (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI20075428A FI122014B (fi) 2007-06-08 2007-06-08 Menetelmä ja laite nanopartikkelijärjestelmien toiminnallistamiseksi
EP08157720A EP2001272B1 (en) 2007-06-08 2008-06-06 Method related to nanoparticle systems
CN200810109970XA CN101325151B (zh) 2007-06-08 2008-06-06 关于纳米粒子系统的方法和装置
US12/155,674 US8916089B2 (en) 2007-06-08 2008-06-06 Method and apparatus related to nanoparticle systems
AT08157720T ATE531243T1 (de) 2007-06-08 2008-06-06 Verfahren im zusammenhang mit nanoteilchensystemen

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20075428 2007-06-08
FI20075428A FI122014B (fi) 2007-06-08 2007-06-08 Menetelmä ja laite nanopartikkelijärjestelmien toiminnallistamiseksi

Publications (3)

Publication Number Publication Date
FI20075428A0 FI20075428A0 (fi) 2007-06-08
FI20075428L true FI20075428L (fi) 2008-12-09
FI122014B FI122014B (fi) 2011-07-15

Family

ID=38212399

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20075428A FI122014B (fi) 2007-06-08 2007-06-08 Menetelmä ja laite nanopartikkelijärjestelmien toiminnallistamiseksi

Country Status (5)

Country Link
US (1) US8916089B2 (fi)
EP (1) EP2001272B1 (fi)
CN (1) CN101325151B (fi)
AT (1) ATE531243T1 (fi)
FI (1) FI122014B (fi)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI122009B (fi) * 2007-06-08 2011-07-15 Teknologian Tutkimuskeskus Vtt Nanopartikkeleihin perustuvat rakenteet ja menetelmä niiden valmistamiseksi
FI20086222L (fi) 2008-12-22 2010-06-23 Valtion Teknillinen Radiotaajuustransponderi puutuotteiden merkitsemiseksi ja menetelmä sen valmistamiseksi
FI124372B (fi) 2009-11-13 2014-07-31 Teknologian Tutkimuskeskus Vtt Kerrostettuihin partikkeleihin liittyvä menetelmä ja tuotteet
US8461698B1 (en) * 2010-09-28 2013-06-11 Rockwell Collins, Inc. PCB external ground plane via conductive coating
GB201211786D0 (en) * 2012-07-03 2012-08-15 Cambridge Display Tech Ltd Organic electronic device manufacturing techniques
GB201316815D0 (en) 2013-09-23 2013-11-06 Renishaw Plc Additive manufacturing apparatus and method
WO2015061661A1 (en) * 2013-10-25 2015-04-30 The Board Of Trustees Of The Leland Stanford Junior University Methods and systems for orienting nanomaterials
CN104749270B (zh) * 2013-12-27 2017-09-12 内蒙古出入境检验检疫局检验检疫技术中心 动物源食品中两对糖皮质激素同分异构体的同时检测方法
DE102016200324A1 (de) * 2016-01-14 2017-07-20 MTU Aero Engines AG Verfahren zum Ermitteln einer Konzentration wenigstens eines Werkstoffs in einem Pulver für ein additives Herstellverfahren
US20190091768A1 (en) * 2017-09-27 2019-03-28 U.S. Army Research Laboratory Attn: Rdrl-Loc-I Rapid additive sintering of materials using electric fields
CN108226095B (zh) * 2017-12-27 2020-09-08 南京大学 单个纳米粒子的电化学阻抗谱测定装置及方法
US11740399B2 (en) * 2018-02-06 2023-08-29 Raytheon Company Low cost dispersive optical elements
CN109467046B (zh) * 2018-09-28 2019-11-26 西安交通大学 基于微纳米尺度的粒子三维微纳结构化排布的复合材料制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5416569A (en) * 1991-01-04 1995-05-16 Goldberg; Michael Electrographically making devices having electrically conductive paths corresponding to those graphically represented on a mask
JP3129879B2 (ja) 1993-06-03 2001-01-31 ノーリツ鋼機株式会社 感光材料処理装置
US5906042A (en) 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
CN1177361C (zh) * 2002-02-05 2004-11-24 复旦大学 采用电诱导生长技术制作有机导线的方法
US6807079B2 (en) 2002-11-01 2004-10-19 Hewlett-Packard Development Company, L.P. Device having a state dependent upon the state of particles dispersed in a carrier
US7615776B2 (en) * 2002-12-18 2009-11-10 International Business Machines Corporation Method of self-assembling electronic circuitry and circuits formed thereby
US20040251581A1 (en) * 2003-06-16 2004-12-16 Jang Bor Z. Micro- and nano-fabrication using focused plasma assisted vapor deposition
CN100477287C (zh) 2003-12-18 2009-04-08 戴索有限公司 用于纳米颗粒层的电解工程的方法
DE102004020497B8 (de) 2004-04-26 2006-06-14 Infineon Technologies Ag Verfahren zur Herstellung von Durchkontaktierungen und Halbleiterbauteil mit derartigen Durchkontaktierungen
CN101238528B (zh) 2005-07-01 2011-12-07 新加坡国立大学 导电复合材料及制备方法、包括导电复合材料的存储器件
WO2007038950A1 (en) 2005-09-28 2007-04-12 Stichting Dutch Polymer Institute Method for generation of metal surface structures and apparatus therefor
FI121562B (fi) 2006-07-21 2010-12-31 Valtion Teknillinen Menetelmä johteiden ja puolijohteiden valmistamiseksi
JP5636188B2 (ja) * 2006-07-21 2014-12-03 ヴァルティオン テクニリネン ツッツキムスケスクス 導体および半導体の製造方法

Also Published As

Publication number Publication date
ATE531243T1 (de) 2011-11-15
CN101325151B (zh) 2012-10-17
FI122014B (fi) 2011-07-15
US8916089B2 (en) 2014-12-23
EP2001272A2 (en) 2008-12-10
US20090016924A1 (en) 2009-01-15
EP2001272A3 (en) 2010-02-24
EP2001272B1 (en) 2011-10-26
CN101325151A (zh) 2008-12-17
FI20075428A0 (fi) 2007-06-08

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