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FI20061165A7 - Cold working - Google Patents

Cold working Download PDF

Info

Publication number
FI20061165A7
FI20061165A7 FI20061165A FI20061165A FI20061165A7 FI 20061165 A7 FI20061165 A7 FI 20061165A7 FI 20061165 A FI20061165 A FI 20061165A FI 20061165 A FI20061165 A FI 20061165A FI 20061165 A7 FI20061165 A7 FI 20061165A7
Authority
FI
Finland
Prior art keywords
ablation
laser radiation
cold working
arrangement
path
Prior art date
Application number
FI20061165A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI20061165L (en
Inventor
Vesa Myllymäki
Jari Ruuttu
Reijo Lappalainen
Lasse Pulli
Juha Mäkitalo
Original Assignee
Picodeon Ltd Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FI20060182A external-priority patent/FI20060182L/en
Application filed by Picodeon Ltd Oy filed Critical Picodeon Ltd Oy
Priority to FI20061165A priority Critical patent/FI20061165L/en
Priority to PCT/FI2007/000047 priority patent/WO2007096462A1/en
Priority to FI20070158A priority patent/FI20070158A7/en
Publication of FI20061165A7 publication Critical patent/FI20061165A7/en
Publication of FI20061165L publication Critical patent/FI20061165L/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

Keksintö liittyy ablaatioon perustuvaan kylmätyöstömenetelmään, jossa menetelmässä ablatoidaan abiaatiokohtion pinnan ennalta määrättyä ablaatiopolkua pitkin ennalta määrättyyn ablaatiosyvyyteen saakka käyttäen lasersäteilyä, jolla on ainakin yksi ominaisaallonpituus ja ainakin yksi pulssiominaisuus kullekin mainitun abiaatiokohtion materiaalin ablatointiin käytettävän säteilyn aallonpituudelle, jolloin lähteestä tuleva säteily on ohjattavissa optisen siirtotien kautta mainitun abiaatiokohtion työstöpisteeseen turbiiniskannerin kautta. Keksintö liittyy myös ablaatioon perustuvaan kylmätyöstöjärjestelyyn, johon järjestelyyn kuuluu lasersäteilylähde, josta saadaan ablaatiossa käytettävä lasersäteily, ja ainakin yksi turbiiniskanneri, joka on järjestetty sijaitsemaan optisella siirtotiellä, joka on järjestetty ohjaamaan lasersäteily mainitusta lasersäteilylähteestä abiaatiokohtion osumapisteeseen ablaatiopolulla. Sellaista järjestelyä voidaan hyödyntää automatisoiduissa järjestelmissä valmistustekniikassa, mutta myös aseteknologiassa.&sr;kUVA 4The invention relates to an ablation-based cold working method, in which the method ablates the surface of an ablation target along a predetermined ablation path to a predetermined ablation depth using laser radiation having at least one characteristic wavelength and at least one pulse characteristic for each wavelength of the radiation used to ablate the material of said ablation target, whereby the radiation from the source can be directed via an optical transmission path to the machining point of said ablation target via a turbine scanner. The invention also relates to an ablation-based cold working arrangement, the arrangement comprising a laser radiation source from which laser radiation used in ablation is obtained, and at least one turbine scanner arranged to be located on an optical transmission path, which is arranged to direct the laser radiation from said laser radiation source to the impact point of the ablation target along the ablation path. Such an arrangement can be utilized in automated systems in manufacturing technology, but also in weapons technology.&sr;FIGURE 4

FI20061165A 2006-02-23 2006-12-29 Cold working FI20061165L (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20061165A FI20061165L (en) 2006-02-23 2006-12-29 Cold working
PCT/FI2007/000047 WO2007096462A1 (en) 2006-02-23 2007-02-23 A cold-work method
FI20070158A FI20070158A7 (en) 2006-02-23 2007-02-23 Arrangement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20060182A FI20060182L (en) 2005-07-13 2006-02-23 Surface treatment technology and surface treatment equipment related to ablation technology
FI20061165A FI20061165L (en) 2006-02-23 2006-12-29 Cold working

Publications (2)

Publication Number Publication Date
FI20061165A7 true FI20061165A7 (en) 2007-08-24
FI20061165L FI20061165L (en) 2007-08-24

Family

ID=38169520

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20061165A FI20061165L (en) 2006-02-23 2006-12-29 Cold working

Country Status (2)

Country Link
FI (1) FI20061165L (en)
WO (1) WO2007096462A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102658076B (en) * 2012-05-11 2015-06-03 中山大学 Micro-nanometer material as well as preparation method, device and application thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4099830A (en) * 1976-12-15 1978-07-11 A. J. Bingley Limited Optical systems including polygonal mirrors rotatable about two axes
IT1179293B (en) * 1984-03-22 1987-09-16 Gd Spa DEVICE FOR DRILLING PERFORATIONS IN BAR-SHAPED ITEMS
US5736709A (en) * 1996-08-12 1998-04-07 Armco Inc. Descaling metal with a laser having a very short pulse width and high average power
KR20000026066A (en) * 1998-10-17 2000-05-06 윤종용 Rotation reflective mirror and printing device using thereof
KR100565051B1 (en) * 2002-09-16 2006-03-30 삼성전자주식회사 Optical scanning unit and electrophotographic image forming apparatus employing the same
US6852946B2 (en) * 2002-12-20 2005-02-08 Caterpillar Inc Laser-induced plasma micromachining

Also Published As

Publication number Publication date
WO2007096462A1 (en) 2007-08-30
FI20061165L (en) 2007-08-24

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MM Patent lapsed