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FI20060673A0 - Painomenetelmä ja -laitteet ja painettu tuote - Google Patents

Painomenetelmä ja -laitteet ja painettu tuote

Info

Publication number
FI20060673A0
FI20060673A0 FI20060673A FI20060673A FI20060673A0 FI 20060673 A0 FI20060673 A0 FI 20060673A0 FI 20060673 A FI20060673 A FI 20060673A FI 20060673 A FI20060673 A FI 20060673A FI 20060673 A0 FI20060673 A0 FI 20060673A0
Authority
FI
Finland
Prior art keywords
printing
product
printing product
Prior art date
Application number
FI20060673A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Inventor
Juha Maijala
Juha Merta
Sanna Lehti
Original Assignee
Keskuslaboratorio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keskuslaboratorio filed Critical Keskuslaboratorio
Priority to FI20060673A priority Critical patent/FI20060673A0/fi
Publication of FI20060673A0 publication Critical patent/FI20060673A0/fi
Priority to PCT/FI2007/050419 priority patent/WO2008006941A1/fr
Priority to CN2007800329021A priority patent/CN101513139B/zh
Priority to JP2009518910A priority patent/JP5238696B2/ja
Priority to PL07788794T priority patent/PL2050320T3/pl
Priority to US12/373,229 priority patent/US8671563B2/en
Priority to ES07788794.1T priority patent/ES2648795T3/es
Priority to EP07788794.1A priority patent/EP2050320B1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/221—Machines other than electrographic copiers, e.g. electrophotographic cameras, electrostatic typewriters
    • G03G15/224—Machines for forming tactile or three dimensional images by electrographic means, e.g. braille, 3d printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
FI20060673A 2006-07-11 2006-07-11 Painomenetelmä ja -laitteet ja painettu tuote FI20060673A0 (fi)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FI20060673A FI20060673A0 (fi) 2006-07-11 2006-07-11 Painomenetelmä ja -laitteet ja painettu tuote
PCT/FI2007/050419 WO2008006941A1 (fr) 2006-07-11 2007-07-06 Procédé et appareils d'impression et produit imprimé
CN2007800329021A CN101513139B (zh) 2006-07-11 2007-07-06 印刷产品和印刷所用的方法和设备
JP2009518910A JP5238696B2 (ja) 2006-07-11 2007-07-06 プリント及びプリント製品用の方法及びその装置
PL07788794T PL2050320T3 (pl) 2006-07-11 2007-07-06 Sposób i przyrządy do drukowania i drukowany produkt
US12/373,229 US8671563B2 (en) 2006-07-11 2007-07-06 Method for printing a conductive pattern
ES07788794.1T ES2648795T3 (es) 2006-07-11 2007-07-06 Método y aparatos de impresión y producto impreso
EP07788794.1A EP2050320B1 (fr) 2006-07-11 2007-07-06 Procédé et appareils d'impression et produit imprimé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20060673A FI20060673A0 (fi) 2006-07-11 2006-07-11 Painomenetelmä ja -laitteet ja painettu tuote

Publications (1)

Publication Number Publication Date
FI20060673A0 true FI20060673A0 (fi) 2006-07-11

Family

ID=36758279

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20060673A FI20060673A0 (fi) 2006-07-11 2006-07-11 Painomenetelmä ja -laitteet ja painettu tuote

Country Status (8)

Country Link
US (1) US8671563B2 (fr)
EP (1) EP2050320B1 (fr)
JP (1) JP5238696B2 (fr)
CN (1) CN101513139B (fr)
ES (1) ES2648795T3 (fr)
FI (1) FI20060673A0 (fr)
PL (1) PL2050320T3 (fr)
WO (1) WO2008006941A1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8654502B2 (en) 2008-05-09 2014-02-18 Stora Enso Oyj Apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof
FI126084B (fi) * 2008-07-23 2016-06-30 Stora Enso Oyj Arkkipohjainen painotuote
JP2014529162A (ja) * 2011-07-08 2014-10-30 ヘレウス プレシャス メタルズ ゲーエムベーハー ウント コンパニー カーゲー 積層体の製造プロセスおよびそのプロセスで得られるマスキングのない積層体
FI126151B (en) 2012-01-30 2016-07-15 Stora Enso Oyj A method and arrangement for producing an electrically conductive pattern on a surface
JP6181608B2 (ja) * 2014-06-28 2017-08-16 コニカミノルタ株式会社 焼成方法
KR101943605B1 (ko) * 2015-01-06 2019-01-29 가부시키가이샤후지쿠라 도체층의 제조 방법 및 배선 기판
SE539800C2 (en) * 2015-05-26 2017-12-05 Stora Enso Oyj Method and arrangement for producing electrically conductive patterns on substrates
US10184189B2 (en) 2016-07-18 2019-01-22 ECSI Fibrotools, Inc. Apparatus and method of contact electroplating of isolated structures
SE541026C2 (en) 2017-10-13 2019-03-12 Stora Enso Oyj Method and arrangement for producing a label with integrated electrically conductive pattern
SE542007C2 (en) 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder
SE541653C2 (en) * 2017-11-03 2019-11-19 Stora Enso Oyj Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna
SE541540C2 (en) * 2017-12-21 2019-10-29 Stora Enso Oyj Method for manufacturing a collar piece comprising an RFID tag
EP3775072A4 (fr) * 2018-11-01 2021-04-07 Hewlett-Packard Development Company, L.P. Compositions d'encre électrophotographique
US11799183B2 (en) * 2019-07-17 2023-10-24 Xerox Corporation System, apparatus, and method for producing printed electrically conductive lines
CN111574885B (zh) * 2020-05-19 2023-07-14 成都怀慈福佑电子科技有限公司 一种面向印刷电子技术的生物可降解电子材料
SE544313C2 (en) 2020-07-02 2022-04-05 Digital Tags Finland Oy Liquid detection rfid tag arrangement
SE544901C2 (en) 2021-03-26 2022-12-27 Digital Tags Finland Oy Baggage tag

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US4303698A (en) 1980-02-25 1981-12-01 E. I. Du Pont De Nemours And Company Use of prolonged tack toners for the preparation of electric circuits
JPS5981063U (ja) 1982-11-22 1984-05-31 住友ゴム工業株式会社 プリント配線基板
GB8504481D0 (en) * 1985-02-21 1985-03-27 Soszek P Circuitry
CA1298740C (fr) 1987-06-30 1992-04-14 William John Parr Procede de metallisation conductrice de substrats sans l'emploi d'argent de developpement
US5011758A (en) * 1988-02-25 1991-04-30 Olin Hunt Specialty Products Inc. Use of a liquid electrophotographic toner with an overcoated permanent master in electrostatic transfer
US4859557A (en) * 1988-02-25 1989-08-22 Olin Hunt Specialty Products Inc. Dry powder electrophotographic toner with permanent master in electrostatic transfer
US5014420A (en) * 1989-07-11 1991-05-14 Xpc, Incorporated Fusing together metal particles using a high-frequency electromagnetic field
US5221038A (en) * 1992-10-05 1993-06-22 Motorola, Inc. Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature
DE69423777D1 (de) 1993-11-15 2000-05-04 Tr Systems Inc Vorrichtung zur erniedrigung einer spannung zur elektrostatischen anhaftung von einem material an eine gewoelbte flaeche
JP3129140B2 (ja) * 1995-03-16 2001-01-29 三菱マテリアル株式会社 導電膜の形成用組成物と形成方法
US5817374A (en) * 1996-05-31 1998-10-06 Electrox Corporation Process for patterning powders into thick layers
JP4134372B2 (ja) 1998-04-14 2008-08-20 株式会社村田製作所 回路形成用荷電性粉末及びそれを用いた回路パターン形成方法、並びにそれによって形成された多層配線基板
US6524758B2 (en) * 1999-12-20 2003-02-25 Electrox Corporation Method of manufacture of printed wiring boards and flexible circuitry
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JP2003209352A (ja) * 2002-01-17 2003-07-25 Idemitsu Kosan Co Ltd 被覆焼結助材及びそれを用いた電極パターン形成方法
JP4249975B2 (ja) 2002-11-19 2009-04-08 住友ゴム工業株式会社 回路の製造方法および該回路を備えた回路板
US6816125B2 (en) * 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder
ATE474441T1 (de) * 2003-03-05 2010-07-15 Intune Circuits Oy Verfahren zur herstellung einer elektrisch leitfähigen struktur
JP4414145B2 (ja) 2003-03-06 2010-02-10 ハリマ化成株式会社 導電性ナノ粒子ペースト
CN1898051B (zh) * 2003-10-20 2010-04-28 播磨化成株式会社 干粉形式的细金属粒子和细金属氧化物粒子及它们的应用
US7569250B2 (en) * 2004-05-17 2009-08-04 Hewlett-Packard Development Company, L.P. Method, system, and apparatus for protective coating a flexible circuit

Also Published As

Publication number Publication date
US8671563B2 (en) 2014-03-18
US20090277007A1 (en) 2009-11-12
JP5238696B2 (ja) 2013-07-17
CN101513139B (zh) 2013-05-08
ES2648795T3 (es) 2018-01-08
EP2050320A4 (fr) 2012-12-05
PL2050320T3 (pl) 2018-02-28
JP2009543365A (ja) 2009-12-03
WO2008006941A1 (fr) 2008-01-17
EP2050320A1 (fr) 2009-04-22
EP2050320B1 (fr) 2017-09-27
CN101513139A (zh) 2009-08-19

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