FI20055511L - Transmission line structure - Google Patents
Transmission line structure Download PDFInfo
- Publication number
- FI20055511L FI20055511L FI20055511A FI20055511A FI20055511L FI 20055511 L FI20055511 L FI 20055511L FI 20055511 A FI20055511 A FI 20055511A FI 20055511 A FI20055511 A FI 20055511A FI 20055511 L FI20055511 L FI 20055511L
- Authority
- FI
- Finland
- Prior art keywords
- transmission line
- conductor
- centre
- ground conductor
- transmission
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
- H01P3/084—Suspended microstriplines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
- H01P3/087—Suspended triplate lines
Landscapes
- Details Of Aerials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Waveguides (AREA)
Abstract
A transmission line structure suited as a transmission path for antenna feed in base stations. The circuit board technique is applied to the manufacture of a transmission line structure (400) for implementing an air-insulation between the centre and ground conductor of the transmission line. The circuit board is a multi- layer board, and a microstrip (440) functions as the line centre conductor. Material has been removed from adjacent layers (432, 433) at the centre conductor and its sides, and a cavity thus formed functions as an air-insulation between the centre conductor (440) and ground conductor (410) of the transmission line. The ground conductor is a part of the metal body of the device containing the transmission line. The structure can comprise several transmission lines, each of which has a cavity of its own in the same multi-layer board. The structure can also be two- sided so that there are similar cavities and a ground conductor on each side of the layer, which comprises the centre conductor(s). The losses of a transmission line are relatively low, and its production costs also are relatively low. Other functional parts, such as directional coupler and power divider, can be integrated to the structure without adding the stage number of the manufacture.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20055511A FI20055511L (en) | 2005-09-27 | 2005-09-27 | Transmission line structure |
| PCT/FI2006/050411 WO2007036607A1 (en) | 2005-09-27 | 2006-09-26 | Transmission line structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20055511A FI20055511L (en) | 2005-09-27 | 2005-09-27 | Transmission line structure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| FI20055511A0 FI20055511A0 (en) | 2005-09-27 |
| FI20055511A7 FI20055511A7 (en) | 2007-03-28 |
| FI20055511L true FI20055511L (en) | 2007-03-28 |
Family
ID=35151477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI20055511A FI20055511L (en) | 2005-09-27 | 2005-09-27 | Transmission line structure |
Country Status (2)
| Country | Link |
|---|---|
| FI (1) | FI20055511L (en) |
| WO (1) | WO2007036607A1 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003290533B2 (en) | 2002-10-22 | 2009-04-09 | Jason Sullivan | Systems and methods for providing a dynamically modular processing unit |
| EP1557074A4 (en) | 2002-10-22 | 2010-01-13 | Sullivan Jason | Robust customizable computer processing system |
| JP2006512691A (en) | 2002-10-22 | 2006-04-13 | アイシス テクノロジーズ | Non-peripheral processing control module with improved heat dissipation characteristics |
| US20210130285A1 (en) | 2008-03-19 | 2021-05-06 | Aurimmed Pharma, Inc. | Novel compounds advantageous in the treatment of central nervous system diseases and disorders |
| MX2010010233A (en) | 2008-03-19 | 2011-03-15 | Aurimmed Pharma Inc Star | Novel compounds advantageous in the treatment of central nervous system diseases and disorders. |
| SE532390C2 (en) * | 2008-03-19 | 2010-01-12 | Powerwave Technologies Sweden Ab | Transmission line and a method for manufacturing a transmission line |
| WO2012109393A1 (en) | 2011-02-08 | 2012-08-16 | Henry Cooper | High gain frequency step horn antenna |
| US9478868B2 (en) | 2011-02-09 | 2016-10-25 | Xi3 | Corrugated horn antenna with enhanced frequency range |
| US9450309B2 (en) | 2013-05-30 | 2016-09-20 | Xi3 | Lobe antenna |
| GB2523369A (en) * | 2014-02-24 | 2015-08-26 | Nokia Technologies Oy | A transmission line and a method of manufacturing a transmission line |
| WO2016007958A2 (en) * | 2014-07-11 | 2016-01-14 | Xi3, Inc. | Systems and methods for providing a high power pc board air dielectric splitter |
| CN104269647B (en) | 2014-09-09 | 2017-12-22 | 西安华为技术有限公司 | A kind of phase shifter |
| US10347961B2 (en) * | 2016-10-26 | 2019-07-09 | Raytheon Company | Radio frequency interconnect systems and methods |
| US11043727B2 (en) | 2019-01-15 | 2021-06-22 | Raytheon Company | Substrate integrated waveguide monopulse and antenna system |
| WO2020251062A1 (en) * | 2019-06-10 | 2020-12-17 | 엘지전자 주식회사 | Electronic device having transmission line |
| CN114069182B (en) * | 2021-12-13 | 2022-07-26 | 西安电子科技大学 | Multilayer Dielectric Integrated Slot Waveguide Transmission Line |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3218996B2 (en) * | 1996-11-28 | 2001-10-15 | 松下電器産業株式会社 | Millimeter wave waveguide |
| US5929728A (en) * | 1997-06-25 | 1999-07-27 | Hewlett-Packard Company | Imbedded waveguide structures for a microwave circuit package |
| US6535088B1 (en) * | 2000-04-13 | 2003-03-18 | Raytheon Company | Suspended transmission line and method |
| JP2006074014A (en) * | 2004-08-06 | 2006-03-16 | Toyota Industries Corp | Multilayer printed board, and method for controlling impedance of microstrip line |
-
2005
- 2005-09-27 FI FI20055511A patent/FI20055511L/en not_active Application Discontinuation
-
2006
- 2006-09-26 WO PCT/FI2006/050411 patent/WO2007036607A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| FI20055511A7 (en) | 2007-03-28 |
| FI20055511A0 (en) | 2005-09-27 |
| WO2007036607A1 (en) | 2007-04-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FD | Application lapsed |