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FI20050739L - Mikromekaaninen sensori, sensoriryhmä ja menetelmä - Google Patents

Mikromekaaninen sensori, sensoriryhmä ja menetelmä Download PDF

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Publication number
FI20050739L
FI20050739L FI20050739A FI20050739A FI20050739L FI 20050739 L FI20050739 L FI 20050739L FI 20050739 A FI20050739 A FI 20050739A FI 20050739 A FI20050739 A FI 20050739A FI 20050739 L FI20050739 L FI 20050739L
Authority
FI
Finland
Prior art keywords
sensor
micromechanical
array
sensor array
micromechanical sensor
Prior art date
Application number
FI20050739A
Other languages
English (en)
Swedish (sv)
Other versions
FI20050739A0 (fi
FI118829B (fi
Inventor
Heikki Seppae
Kirsi Tappura
Jussi Tuppurainen
Tomi Mattila
Ari Alastalo
Hannu Helle
Aarne Oja
Original Assignee
Valtion Teknillinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valtion Teknillinen filed Critical Valtion Teknillinen
Priority to FI20050739A priority Critical patent/FI118829B/fi
Publication of FI20050739A0 publication Critical patent/FI20050739A0/fi
Priority to PCT/FI2006/000240 priority patent/WO2007006843A1/en
Priority to US11/988,417 priority patent/US8136403B2/en
Priority to CN2006800248689A priority patent/CN101218503B/zh
Priority to GB0801930A priority patent/GB2442415B/en
Priority to HK08110342.6A priority patent/HK1118906B/xx
Publication of FI20050739L publication Critical patent/FI20050739L/fi
Application granted granted Critical
Publication of FI118829B publication Critical patent/FI118829B/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/04—Networks or arrays of similar microstructural devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02—Analysing fluids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02—Analysing fluids
    • G01N29/022—Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02—Analysing fluids
    • G01N29/036—Analysing fluids by measuring frequency or resonance of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2462—Probes with waveguides, e.g. SAW devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/30—Arrangements for calibrating or comparing, e.g. with standard objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/025—Change of phase or condition
    • G01N2291/0255—(Bio)chemical reactions, e.g. on biosensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/025—Change of phase or condition
    • G01N2291/0256—Adsorption, desorption, surface mass change, e.g. on biosensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/10—Number of transducers
    • G01N2291/106—Number of transducers one or more transducer arrays

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
FI20050739A 2005-07-08 2005-07-08 Mikromekaaninen sensori, sensoriryhmä ja menetelmä sekä pitkittäisten akustisten aaltojen uusi käyttö FI118829B (fi)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FI20050739A FI118829B (fi) 2005-07-08 2005-07-08 Mikromekaaninen sensori, sensoriryhmä ja menetelmä sekä pitkittäisten akustisten aaltojen uusi käyttö
PCT/FI2006/000240 WO2007006843A1 (en) 2005-07-08 2006-07-04 Micromechanical sensor, sensor array and method
US11/988,417 US8136403B2 (en) 2005-07-08 2006-07-04 Micromechanical sensor, sensor array and method
CN2006800248689A CN101218503B (zh) 2005-07-08 2006-07-04 微机械传感器、传感器阵列和方法
GB0801930A GB2442415B (en) 2005-07-08 2006-07-04 Micromechanical sensor, sensor array and method
HK08110342.6A HK1118906B (en) 2005-07-08 2006-07-04 Micromechanical sensor, sensor array and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20050739 2005-07-08
FI20050739A FI118829B (fi) 2005-07-08 2005-07-08 Mikromekaaninen sensori, sensoriryhmä ja menetelmä sekä pitkittäisten akustisten aaltojen uusi käyttö

Publications (3)

Publication Number Publication Date
FI20050739A0 FI20050739A0 (fi) 2005-07-08
FI20050739L true FI20050739L (fi) 2007-01-09
FI118829B FI118829B (fi) 2008-03-31

Family

ID=34803203

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20050739A FI118829B (fi) 2005-07-08 2005-07-08 Mikromekaaninen sensori, sensoriryhmä ja menetelmä sekä pitkittäisten akustisten aaltojen uusi käyttö

Country Status (5)

Country Link
US (1) US8136403B2 (fi)
CN (1) CN101218503B (fi)
FI (1) FI118829B (fi)
GB (1) GB2442415B (fi)
WO (1) WO2007006843A1 (fi)

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US8616056B2 (en) 2010-11-05 2013-12-31 Analog Devices, Inc. BAW gyroscope with bottom electrode
US9091544B2 (en) 2010-11-05 2015-07-28 Analog Devices, Inc. XY-axis shell-type gyroscopes with reduced cross-talk sensitivity and/or mode matching
US8631700B2 (en) 2010-11-05 2014-01-21 Analog Devices, Inc. Resonating sensor with mechanical constraints
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CN102485641A (zh) * 2010-12-06 2012-06-06 中国科学院沈阳自动化研究所 面向ZnO压电传感器制造的介电泳装配方法
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US9039976B2 (en) * 2011-01-31 2015-05-26 Analog Devices, Inc. MEMS sensors with closed nodal anchors for operation in an in-plane contour mode
JP2012181093A (ja) * 2011-03-01 2012-09-20 Japan Radio Co Ltd 弾性表面波センサ
CA2846448C (en) 2011-08-26 2022-09-27 Aviana Molecular Technologies, Llc Biocoated piezoelectric biosensor platform for point-of-care diagnostic use
DE102012203293B4 (de) * 2012-03-02 2021-12-02 Robert Bosch Gmbh Halbleitermodul mit integriertem Wellenleiter für Radarsignale
US9709595B2 (en) 2013-11-14 2017-07-18 Analog Devices, Inc. Method and apparatus for detecting linear and rotational movement
US9599471B2 (en) 2013-11-14 2017-03-21 Analog Devices, Inc. Dual use of a ring structure as gyroscope and accelerometer
US9834434B2 (en) * 2013-11-19 2017-12-05 Canon Kabushiki Kaisha Capacitive transducer and method of manufacturing the same
US10746548B2 (en) 2014-11-04 2020-08-18 Analog Devices, Inc. Ring gyroscope structural features
JP6604602B2 (ja) * 2015-03-02 2019-11-13 日本無線株式会社 弾性表面波センサ
US9869552B2 (en) * 2015-03-20 2018-01-16 Analog Devices, Inc. Gyroscope that compensates for fluctuations in sensitivity
WO2017078992A1 (en) * 2015-11-06 2017-05-11 Qorvo Us, Inc. Acoustic resonator devices and fabrication methods providing hermeticity and surface functionalization
CN111373658B (zh) * 2017-07-07 2024-05-17 艾维亚纳分子技术有限公司 用于接合流体材料的感测器的方法和装置
JP6864966B2 (ja) * 2018-03-29 2021-04-28 三井化学株式会社 センサ、及び、センサ製造方法
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JP6867630B2 (ja) * 2018-03-29 2021-04-28 国立大学法人東北大学 センサ、検出方法、及び、センサ製造方法
WO2020010293A1 (en) * 2018-07-06 2020-01-09 Qorvo Us, Inc. Bulk acoustic wave resonator with increased dynamic range
US11099157B2 (en) * 2018-07-06 2021-08-24 Qorvo Biotechnologies, Llc Sensor with droplet retaining structure
CN109239465B (zh) * 2018-10-11 2021-02-05 西南大学 基于衬底集成波导和微流控技术的微波传感器
US11656077B2 (en) 2019-01-31 2023-05-23 Analog Devices, Inc. Pseudo-extensional mode MEMS ring gyroscope
RU2723956C1 (ru) * 2019-09-12 2020-06-18 Федеральное государственное бюджетное научное учреждение "Технологический институт сверхтвердых и новых углеродных материалов" (ФГБНУ ТИСНУМ) СВЧ акустический масс-сенсор
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Also Published As

Publication number Publication date
HK1118906A1 (zh) 2009-02-20
CN101218503A (zh) 2008-07-09
GB0801930D0 (en) 2008-03-12
FI20050739A0 (fi) 2005-07-08
WO2007006843A1 (en) 2007-01-18
GB2442415B (en) 2009-05-27
GB2442415A (en) 2008-04-02
US20090277271A1 (en) 2009-11-12
FI118829B (fi) 2008-03-31
CN101218503B (zh) 2012-01-04
US8136403B2 (en) 2012-03-20

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