ES2902424T3 - Access to records of fluid ejection devices - Google Patents

Abstract

An integrated circuit (100a, 100b) for controlling a plurality of fluid actuation devices, the integrated circuit (100a, 100b) comprising: a configuration register (104); a plurality of interfaces comprising a mode interface (112) and a data interface (110); and control logic (102a, 102b) to enable writing to the configuration register (104) in response to a signal on the mode interface (112) going logic high with a logic high signal on the data interface (112). 110), wherein the configuration register (104) is for receiving serial data from the data interface (110) with the configuration register (104) enabled for writing.

Description

DESCRIPTION

Access to records of fluid ejection devices

Background

An inkjet printing system, as an example of a fluid ejection system, may include a printhead, an ink supply that provides liquid ink to the printhead, and an electronic controller that controls the printhead. The print head, as an example of a fluid ejection device, ejects ink droplets through a plurality of nozzles or holes and onto a print medium, such as a sheet of paper, to print onto the print medium. . In some examples, the holes are arranged in at least one column or array so that ejecting ink from the holes in the correct sequence causes characters or other images to be printed on the print media as the printhead moves. and the print medium move relative to each other. US2002/118235 discloses an ink jet recording apparatus, which is provided with a CPU which is arranged to be provided with control means for prohibiting an NMI interrupt until the operation is complete. EP1029675 discloses a printing system having a printhead assembly with an integrated distributive processor to provide localized control of the internal operations of the printhead processor.

Brief Description of the Drawings

Figure 1A is a block diagram illustrating an example of an integrated circuit for controlling a plurality of fluid actuation devices.

Figure 1B is a block diagram illustrating another example of an integrated circuit for controlling a plurality of fluid actuation devices.

Figure 2 is a timing diagram illustrating an example for accessing a configuration register of an integrated circuit.

Figure 3A is a block diagram illustrating another example of an integrated circuit for controlling a plurality of fluid actuation devices.

Figure 3B is a block diagram illustrating another example of an integrated circuit for controlling a plurality of fluid actuation devices.

Figure 4 is a timing diagram illustrating an example for accessing a status register of an integrated circuit.

Figure 5 is a block diagram illustrating another example of an integrated circuit for controlling a plurality of fluid actuation devices.

Figures 6A and 6B illustrate an example of a fluid expulsion matrix.

Figures 7A-7D are flow charts illustrating an example of a method of accessing a fluid ejection matrix.

Figures 8A-8E are flow diagrams illustrating another example of a method of accessing a fluid ejection matrix.

Figure 9 is a block diagram illustrating an example of a fluid ejection system.

Detailed description

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which are shown, by way of illustration, specific examples in which the disclosure may be put into practice. It should be understood that other examples may be used and structural or logical changes may be made without departing from the scope of the present disclosure. The following detailed description, therefore, should not be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims. It is to be understood that features of the various examples described herein may be combined, in whole or in part, with one another, unless specifically indicated otherwise.

In certain instances, it may be desirable to reduce the width of a semiconductor device or die that includes fluid actuation devices (eg, a fluid ejection die) to reduce cost and improve manufacturability. As the width of a fluid ejection die is reduced, there is less die area available for circuitry. Consequently, in the present description a device is described to allow the expulsion of fluid that can include a configuration register (for example, a write-only configuration register) and/or a status register (for example, a write-only register). read-only state). The configuration register may be write-enabled in response to a signal on a contact pad so that it goes logic high with a logic high signal on a data contact pad. With the configuration register enabled, data can be written to the configuration register via the data contact pad. The status register can be enabled for reading in response to a signal on a contact pad so that it goes logic high with a logic high signal on a data contact pad and goes from a signal on a data contact pad. trip to high logic with the signal in the floating data contact pad. With the status register read enabled, data can be read from the status register via the data contact pad.

As used herein, a "logic high" signal is a logic "1" or "on" signal or a signal that has a voltage approximately equal to the logic power supplied to an integrated circuit (for example, between about 1.8 V and 15 V, such as 5.6 V). As used herein, a "logic low" signal is a logic "0" or "off" signal or a signal that has a voltage approximately equal to a logic power return to ground for logic power. supplied to the integrated circuit (for example, approximately 0 V).

Figure 1A is a block diagram illustrating an example of an integrated circuit 100a for controlling a plurality of fluid actuation devices. In one example, integrated circuit 100a is part of a fluid ejection matrix, which will be described below with reference to Figures 6A and 6B. Integrated circuit 100a includes control logic 102a, configuration register 104, and a plurality of interfaces including data interface 110 and mode interface 112. Data interface 110 and mode interface 112 are electrically coupled to control logic 102. Control logic 102a is electrically coupled to configuration register 104. Control logic 102a allows writing to configuration register 104 in response to a signal on mode interface 112 going logic high with a logic high signal on data interface 110. In one example, control logic 102a disables writing to configuration register 104 in response to a logic low signal on mode interface 112. Configuration register 104 may receive serial data from data interface 110 with configuration register 104 write-enabled.

Control logic 102a may include a microprocessor, application specific integrated circuit (ASIC), or other logic circuit suitable for controlling the operation of integrated circuit 100a. Configuration register 104 may be a memory device (eg, nonvolatile memory, shift register, etc.) and may include any suitable number of bits (eg, 4 bits to 24 bits, such as 12 bits). Configuration register 104 may store configuration data for testing IC 100a, detecting cracks within a substrate of IC 100a, enabling IC 100a controls, setting IC 100a analog delays, enabling memory access of integrated circuit 100a, to validate operations of integrated circuit 100a, or to configure other functions of integrated circuit 100a. Each of the plurality of interfaces including data interface 110 and mode interface 112 may be a contact pad, pin, bump, wire, or other electrical interface suitable for transmitting signals to control logic 102a and /o to receive signals from the control logic 102a. Each of the plurality of interfaces may be electrically coupled to a fluid ejection system (eg, a printer).

Figure 1B is a block diagram illustrating another example of an integrated circuit 100b for controlling a plurality of fluid actuation devices. In one example, integrated circuit 100b is part of a fluid ejection matrix, which will be described below with reference to Figures 6A and 6B. Integrated circuit 100b is similar to integrated circuit 100a previously described and illustrated with reference to Figure 1A and includes control logic 102b, a configuration register 104, and a plurality of interfaces including a data interface 110, a mode interface 112, a trigger interface 114, and a clock interface 116. Data interface 110, mode interface 112, trigger interface 114, and clock interface 116 are electrically coupled to control logic 102b. Control logic 102b is electrically coupled to configuration register 104.

The control logic 102b allows writing to the configuration register 104 in response to the signal on the mode interface 110 going logic high with a logic high signal on the data interface 110 and a logic low signal on the trigger interface. 114. In one example, control logic 102b disables writing to configuration register 104 in response to a logic low signal on mode interface 112. Configuration register 104 receives serial data from data interface 110 with configuration register 104 write-enabled. In one example, configuration register 104 receives serial data from data interface 110 aligned with a clock signal from clock interface 116.

Control logic 102b may include a microprocessor, ASIC, or other suitable logic circuit to control the operation of integrated circuit 100b. Configuration register 104 may store configuration data for testing integrated circuit 100b, detecting cracks within a substrate of integrated circuit 100b, enabling controls of integrated circuit 100b, setting analog delays of integrated circuit 100b, enabling memory access of integrated circuit 100b, to validate operations of integrated circuit 100b, or to configure other functions of integrated circuit 100b. Each of the plurality of interfaces including data interface 110, mode interface 112, trigger interface 114, and clock interface 116 may be a contact pad, pin, bump, cable, or other interface. suitable for transmitting signals to the control logic 102b and/or for receiving signals from the control logic 102b. Each of the plurality of interfaces may be electrically coupled to a fluid ejection system (eg, a printer).

Figure 2 is a timing diagram 200 illustrating an example for accessing a configuration register of an integrated circuit, such as configuration register 104 of integrated circuit 100b of Figure 1B. The timing diagram 200 includes a mode signal on a mode interface (for example, mode interface 112), a trigger signal on a trigger interface (for example, trigger interface 114), a clock signal on a mode interface (eg clock interface 116), and a data signal on a data interface (eg data interface 110). With a logic low trigger signal as indicated at 202 and a logic high data signal as indicated at 204, the configuration register is write-enabled in response to the signal so that it goes from a logic low to a logic high as indicated in 206.

With the configuration register write-enabled, a data stream provided by the data signal can be written to the configuration register. In this example, a data stream of four bits (ie bits B3, B2, B1, and B0) is written to the configuration register. In other examples, any suitable number of bits can be written to the configuration register. Each bit of the data stream can be written to the configuration register in response to the clock signal. For example, the rising edge of the clock signal as indicated at 208 may write (eg latch) bit B3 to the configuration register. Also, rising clock edges indicated at 210, 212, and 214 may write (eg, latch) bits B2, B1, and B0, respectively, to the configuration register. In other examples, each bit of the data stream may be written to the configuration register in response to each corresponding falling edge of the clock signal or in response to rising and falling edges of the clock signal. In an example where the setup register is a shift register, the data stream can be written to the setup register by shifting the data stream into the setup register such that the previous and/or extra bits are shifted out. of the configuration register. Writing to the configuration register is disabled by driving the mode signal back to a logic low level as indicated by 216.

Figure 3A is a block diagram illustrating another example of an integrated circuit 300a for controlling a plurality of fluid actuation devices. In one example, integrated circuit 300a is part of a fluid ejection matrix, which will be described below with reference to Figures 6A and 6B. Integrated circuit 300a includes control logic 302a, a status register 304, and a plurality of interfaces including a data interface 310, a mode interface 312, and a trigger interface 314. The data interface 310, the mode 312 and trigger interface 314 are electrically coupled to control logic 302a. Control logic 302a is electrically coupled to status register 304.

Control logic 302a allows reading of status register 304 in response to both a signal on mode interface 312 going logic high with a logic high signal on data interface 310 and a signal going from mode interface 312. trigger 314 to logic high with the signal on data interface 310 floating. In one example, control logic 302a disables reading status register 304 in response to a logic low signal on mode interface 312. In another example, control logic 302a disables reading status register 304 in response to a logic low signal on trigger interface 314. Status register 304 may send serial data to data interface 310 with status register 304 enabled for reading.

Control logic 302a may include a microprocessor, ASIC, or other suitable logic circuit to control the operation of integrated circuit 300a. Status register 304 may be a memory device (eg, nonvolatile memory, shift register, etc.) and may include any suitable number of bits (eg, 1 bit to 12 bits, such as 5 bits). Status register 304 may store status data such as a check status for integrated circuit 300a, a watchdog status for integrated circuit 300a, or other suitable status data for integrated circuit 300a. Each of the plurality of interfaces including data interface 310, mode interface 312, and trigger interface 314 may be a contact pad, pin, bump, wire, or other electrical interface suitable for transmitting signals to control logic 302a and/or to receive signals from control logic 302a. Each of the plurality of interfaces may be electrically coupled to a fluid ejection system (eg, a printer).

Figure 3B is a block diagram illustrating another example of an integrated circuit 300b for controlling a plurality of fluid actuation devices. In one example, integrated circuit 300b is part of a fluid ejection matrix, which will be described below with reference to Figures 6A and 6B. Integrated circuit 300b is similar to integrated circuit 300a described and illustrated above with reference to Figure 3A and includes control logic 302b, a status register 304, and a plurality of interfaces including a data interface 310, a mode interface 312 , a trigger interface 314, and a clock interface 316. Data interface 310, mode interface 312, trigger interface 314, and clock interface 316 are electrically coupled to control logic 302b. Control logic 302b is electrically coupled to status register 304.

Control logic 302b allows reading of status register 304 in response to both a signal on mode interface 312 going logic high with a logic high signal on data interface 310 and a signal going from mode interface 312. trigger 314 to logic high with the signal on data interface 310 floating. In one example, control logic 302b disables reading status register 304 in response to a logic low signal on mode interface 312. In another example, control logic 302b disables reading status register 304 in response to a logic low signal on trigger interface 314. Status register 304 may send serial data to data interface 310 with status register 304 enabled for reading. In one example, the record of state 304 sends serial data to data interface 310 aligned with a clock signal on clock interface 316.

Control logic 302b may include a microprocessor, ASIC, or other logic circuit suitable for controlling the operation of integrated circuit 300b. Status register 304 may store status data such as a check status for integrated circuit 300b, a watchdog status for integrated circuit 300b, or other suitable status data for integrated circuit 300b. Each of the plurality of interfaces including data interface 310, mode interface 312, trigger interface 314, and clock interface 316 may be a contact pad, pin, bump, cable, or other interface. suitable for transmitting signals to the control logic 302b and/or for receiving signals from the control logic 302b. Each of the plurality of interfaces may be electrically coupled to a fluid ejection system (eg, a printer).

Figure 4 is a timing diagram 400 illustrating an example for accessing an integrated circuit status register, such as the status register 304 of integrated circuit 300b of Figure 3B. Timing diagram 400 includes a mode signal on a mode interface (for example, mode interface 312), a trigger signal on a trigger interface (for example, trigger interface 314), a clock signal on a clock interface (eg clock interface 316), and a data signal on a data interface (eg data interface 310). With a logic high data signal as indicated at 402, the mode signal goes from logic low to logic high as indicated at 404. The data signal then floats as indicated at 406. floating data, the trigger signal goes from a logic low to a logic high as indicated at 408 to allow the status register to be read.

With the status register read-enabled, the status register can emit a data stream via the data signal. In this example, the data stream (ie bits MSB, MSB-1, MSB-2, MSB-3, etc.) is read from the status register. Any suitable number of bits may be read from the status register. Each bit of the data stream can be read from the status register in response to the clock signal. For example, the MSB bit may be read from the status register in response to enabling status register read. The rising edge of the clock signal as indicated at 410 may output the MSB-1 bit through the data signal. Likewise, rising edges of the clock signal as indicated at 412, 414, etc. they can output bits MSB-2, MSB-3, etc., respectively, via the data signal. In other examples, each bit of the data stream may be output from the status register in response to each corresponding falling edge of the clock signal or in response to rising and falling edges of the clock signal. The status register readout can be disabled by driving the trigger signal back to a logic low level as indicated at 416 and/or by driving the mode signal back to a logic low level as indicated at 418.

Figure 5 is a block diagram illustrating another example of an integrated circuit 500 for controlling a plurality of fluid actuation devices. In one example, integrated circuit 500 is part of a fluid ejection matrix, which will be described below with reference to Figures 6A and 6B. Integrated circuit 500 may include the features of integrated circuit 100a (FIG. 1A) or 100b (FIG. 1B) and the features of integrated circuit 300a (FIG. 3A) or 300b (FIG. 3B). Integrated circuit 500 includes control logic 502, a configuration register 104, a status register 304, and a plurality of interfaces including a data interface 510, a mode interface 512, a trigger interface 514, and a clock interface. 516. Data interface 510, mode interface 512, trigger interface 514, and clock interface 516 are electrically coupled to control logic 502. Control logic 502 is electrically coupled to configuration register 104 and to status register 304.

The control logic 502 allows writing to the configuration register 104 in response to the signal on the mode interface 510 going logic high with a logic high signal on the data interface 510 and a logic low signal on the trigger interface. 514. In one example, control logic 502 disables writing to configuration register 104 in response to a logic low signal on mode interface 512. Configuration register 104 receives serial data from data interface 510 with configuration register 104 write-enabled. In one example, configuration register 104 may receive serial data from data interface 510 aligned with a clock signal from clock interface 516.

In addition, control logic 502 enables reading of status register 304 in response to both a signal on mode interface 512 going logic high with a logic high signal on data interface 510 and a signal going logic high on data interface 510. the trigger interface 514 to logic high with the signal on the data interface 510 floating. In one example, control logic 502 disables reading status register 304 in response to a logic low signal on mode interface 512. In another example, control logic 502 disables reading status register 304 in response to a logic low signal on trigger interface 514. Status register 304 can send serial data to data interface 510 with status register 304 enabled for reading. In one example, status register 304 sends serial data to data interface 510 aligned with a clock signal on clock interface 516.

Control logic 502 may include a microprocessor, ASIC, or other logic circuitry suitable for controlling the operation of integrated circuit 500. Configuration register 104 and status register 304 are described above with reference to Figures 1A-1B and 3A-3B, respectively. Each of the plurality of interfaces including data interface 510, mode interface 512, trigger interface 514, and clock interface 516 may be a contact pad, pin, bump, cable, or other interface. suitable for transmitting signals to control logic 502 and/or for receiving signals from control logic 502. Each of the plurality of interfaces may be electrically coupled to a fluid ejection system (eg, a printer).

Figure 6A illustrates an example of a fluid ejection matrix 600 and Figure 6B illustrates an enlarged view of the ends of the fluid ejection matrix 600. The matrix 600 includes a first column 602 of contact pads, a second column 604 of contact pads and a column 606 of fluid actuation devices 608. The second column 604 of contact pads is aligned with the first column 602 of contact pads and at a distance (i.e., along the Y-axis) of the first column 602 of contact pads. Column 606 of fluid actuation devices 608 is disposed longitudinally relative to first column of contact pads 602 and second column of contact pads 604. Column 606 of fluid actuation devices 608 is also disposed between the first column 602 of contact pads and the second column 604 of contact pads. In one example, fluid actuation devices 608 are fluid nozzles or pumps for expelling fluid droplets.

In one example, the first column 602 of contact pads includes six contact pads. The first column 602 of contact pads may include the following contact pads in order: a data contact pad 610, a clock contact pad 612, a ground return logic power contact pad 614, a multipurpose input/output contact pad 616, a first high voltage power supply contact pad 618, and a first ground return high voltage power contact pad 620. Therefore, the first column 602 of contact pads includes the data contact pad 610 at the top of the first column 602, the first ground return high voltage power contact pad 620 at the bottom of the first column 602, and the first high voltage power supply contact pad 618 directly above the first ground return high voltage power contact pad 620. While the contact pads 610, 612, 614, 616, 618 and 620 are illustrated in a particular order, in other examples the contact pads may be arranged in a different order.

In one example, the second column 604 of contact pads includes six contact pads. The second column of contact pads 604 may include the following contact pads in order: a second ground return high voltage power contact pad 622, a second high voltage power supply contact pad 624, a logic reset contact pad 626, a logic power supply contact pad 628, a mode contact pad 630, and a trigger contact pad 632. Thus, the second column 604 of contact pads includes the second ground return high voltage power contact pad 622 at the top of the second column 604, the second high voltage power supply contact pad 624 directly below the second ground return power contact pad high voltage ground return 622, and trip contact pad 632 at the bottom of the second column 604. contact pads 622, 624, 626, 628, 630 and 632 are illustrated in a particular order, in other examples the contact pads may be arranged in a different order.

In one example, data contact pad 610 may provide data interface 110 of Figures 1A or 1B, data interface 310 of Figures 3A or 3B, or data interface 510 of Figure 5. mode contact 630 can provide mode interface 112 of Figures 1A or 1B, mode interface 312 of Figures 3A or 3B, or mode interface 512 of Figure 5. Trigger contact pad 632 can provide trigger interface 114 of Figure 1B, trigger interface 314 of Figures 3A or 3B, or trigger interface 514 of Figure 5. Clock pad 612 may provide clock interface 116 of Figure 1B, the clock interface 316 of Figure 3B, or the clock interface 516 of Figure 5.

Data pad 610 can be used to input serial data to array 600 to select fluid actuation devices, memory bits, thermal sensors, configuration modes (for example, via a configuration register 104), etc. Data pad 610 can also be used to send serial data from array 600 to read memory bits, configuration modes, status information (eg via status register 304), etc. Clock pad 612 can be used to input a clock signal to array 600 to shift serial data from data pad 610 into the array or to shift serial data out of the array onto the pad. ground return logic power contact pad 610. Ground return logic power contact pad 614 provides a ground return path for logic power (eg, approximately 0 V) that is supplied to array 600. In In one example, ground return logic power contact pad 614 is electrically coupled to semiconductor (eg, silicon) substrate 640 of array 600. Multipurpose input/output contact pad 616 can be used for analog sensing and/or digital testing of the 600 matrix.

The first high voltage power supply contact pad 618 and the second high voltage power supply contact pad 624 can be used to supply high voltage (eg, approximately 32 V) to the array 600. The first high voltage power supply contact pad 624 The ground return high voltage power contact 620 and the second ground return high voltage power contact pad 622 may be used to provide a power return to ground (for example, approximately 0 V) for the power supply. high voltage power. The ground return high voltage power contact pads 620 and 622 are not electrically connected directly to the semiconductor substrate 640 of the array 600. The specific order of the contact pad with the ground return power supply contact pads 618 and 624 high voltage power return contact pads and 620 and 622 high voltage power ground return contact pads as the innermost contact pads can improve the power supply to the 600 array. ground return 620 and 622 at the bottom of the first column 602 and at the top of the second column 604, respectively, can improve reliability for manufacturing and can improve ink-cut protection.

Logic reset contact pad 626 may be used as a logic reset input to control the operating state of array 600. Logic power supply contact pad 628 may be used to supply logic power (for example, between approximately 1.8 V and 15 V, such as 5.6 V) to array 600. Mode contact pad 630 can be used as a logic input to control access to enable/disable configuration modes (i.e. , functional modes) of array 600. Trigger pad 632 may be used as a logic input to couple data loaded from data pad 610 and to enable fluid actuation devices or memory elements of the array. 600.

Array 600 includes an elongated substrate 640 having a length 642 (along the Y axis), a thickness 644 (along the Z axis), and a width 646 (along the X axis). In one example, length 642 is at least twenty times width 646. Width 646 can be 1mm or less and thickness 644 can be less than 500 microns. Fluid actuation devices 608 (eg, fluid actuation logic) and contact pads 610-632 are provided on the elongated substrate 640 and are disposed along the length 642 of the elongated substrate. Fluid actuation devices 608 have a length of spinneret 652 less than the length 642 of elongated substrate 640. In one example, the length of spinneret 652 is at least 1.2 cm. Contact pads 610-632 can be electrically coupled to fluid drive logic. The first column 602 of contact pads may be disposed near a first longitudinal end 648 of the elongated substrate 640. The second column 604 of contact pads may be disposed near a second longitudinal end 650 of the elongated substrate 640 opposite the first longitudinal end 648.

Figures 7A-7D are flow charts illustrating an example of a method 700 for accessing a fluid ejection matrix. As illustrated in Figure 7A, at 702 the method 700 includes setting a signal on a fluid injection array data pad to logic high. At 704, the method 700 includes going from a signal on a fluid injection array mode pad to logic high. At 706, the method 700 includes enabling writing to a fluid ejection array configuration register in response to going from the mode pad signal to logic high with the data pad signal logic high.

As illustrated in Figure 7B, at 708 the method 700 may also include switching the signal on the mode contact pad to logic low. At 710, the method 700 may include disabling writing to the configuration register in response to the logic low signal on the mode pad. As illustrated in Figure 7C, at 712 the method 700 may also include with the configuration register write enabled, applying a serial data signal to the data pad to write the serial data to the configuration register . As illustrated in Figure 7D, at 714 the method 700 includes with the setup register write-enabled, applying the serial data signal to the data pad aligned with a clock signal on a clock pad of the fluid ejection matrix.

Figures 8A-8E are flow charts illustrating another example of a method 800 of accessing a fluid ejection matrix. As illustrated in FIG. 8A, at 802 the method 800 includes setting a signal on a fluid injection array data pad to logic high. At 804, the method 800 includes going from a signal on a fluid ejection matrix mode pad to logic high. At 806, the method 800 includes floating the signal on the data pad with the signal on the mode pad logic high. At 808, the method 800 includes going from a signal on a fluid ejection array trigger pad to logic high with the signal on the data pad floating. At 810, the method 800 includes enabling the reading of a fluid ejection die status register in response to going from the trigger pad signal to logic high with the data pad signal floating .

As illustrated in Figure 8B, at 812 the method 800 may also include switching the signal on the mode contact pad to logic low. At 814, the method 800 may include disabling reading of the status register in response to the logic low signal on the mode pad. As illustrated in Figure 8C, at 816 the Method 800 may also include going from the signal on the trigger pad to logic low. At 818, the method 800 may include disabling reading of the status register in response to the logic low signal on the trigger pad. As illustrated in Figure 8D, at 820 the method 800 may also include with the status register read-enabled, serial data output from the status register to the data pad. As illustrated in Figure 8E, at 822 the method 800 may also include with the status register read-enabled, serial data output from the status register to the data pad aligned with a clock signal in a fluid ejection matrix clock pad.

Figure 9 is a block diagram illustrating an example of a fluid ejection system 900. Fluid ejection system 900 includes a fluid ejection assembly, such as printhead assembly 902, and a fluid ejection assembly. fluid supply assembly, such as ink supply assembly 910. In the illustrated example, fluid ejection system 900 also includes a service station assembly 904, a carriage assembly 916, a media transport assembly 918 and an electronic controller 920. While the following description provides examples of systems and assemblies for handling fluids with respect to ink, the disclosed systems and assemblies are also applicable to handling fluids other than ink.

Printhead assembly 902 includes at least one fluid ejection printhead or die 600 previously described and illustrated with reference to Figures 6A and 6B, which ejects droplets of ink or fluid through a plurality of orifices. or nozzles 608. In one example, droplets are directed toward a medium, such as print medium 924, to print onto print medium 924. In one example, print medium 924 includes any suitable type of sheet material. , such as paper, cardstock, transparencies, Mylar, cloth, and the like. In another example, print media 924 includes media for three-dimensional (3D) printing, such as a powder bed, or media for bioprinting and/or drug discovery testing, such as a reservoir or container. In one example, nozzles 608 are arranged in at least one column or array such that the properly sequenced ejection of ink from nozzles 608 causes characters, symbols, and/or other graphics or images to be printed on print media 924 a as the printhead assembly 902 and print media 924 move relative to each other.

Ink supply assembly 910 supplies ink to printhead assembly 902 and includes a reservoir 912 for storing the ink. As such, in one example, ink flows from reservoir 912 to printhead assembly 902. In one example, printhead assembly 902 and ink supply assembly 910 are housed together in a one-size-fits-all print cartridge. inkjet or fluid jet or ballpoint pen. In another example, ink supply assembly 910 is separate from printhead assembly 902 and supplies ink to printhead assembly 902 through an interface connection 913, such as a supply tube and/or valve. .

Carriage assembly 916 positions printhead assembly 902 relative to print media transport assembly 918, and print media transport assembly 918 positions print media 924 relative to printhead assembly 902. Thus, a print zone 926 is defined adjacent nozzles 608 in an area between printhead assembly 902 and print media 924. In one example, printhead assembly 902 is a printhead assembly 902 . scan-type printhead such that carriage assembly 916 moves printhead assembly 902 relative to print media transport assembly 918. In another example, printhead assembly 902 is a printhead assembly non-scan type print media such that carriage assembly 916 fixes printhead assembly 902 in a prescribed position relative to the media transport assembly. 918 print.

The service station assembly 904 provides spitting, cleaning, plugging, and/or filling of the printhead assembly 902 to maintain the functionality of the printhead assembly 902 and, more specifically, the nozzles 608. For example, the printhead assembly Service station 904 may include a rubber blade or wiper that is periodically passed over printhead assembly 902 to clean and wash nozzles 608 of excess ink. Additionally, service station assembly 904 may include a cap that covers printhead assembly 902 to protect nozzles 608 from drying out during periods of inactivity. In addition, the service station assembly 904 may include a spittoon into which the printhead assembly 902 expels ink during spits to ensure that the reservoir 912 maintains an appropriate level of pressure and fluidity, and to ensure that the nozzles 608 do not clog or leak. The functions of the service station assembly 904 may include relative movement between the service station assembly 904 and the printhead assembly 902.

The electronic controller 920 communicates with the printhead assembly 902 via a communication path 903, with the service station assembly 904 via a communication path 905, with the carriage assembly 916 via a communication path. communication path 917 and with the print media transport assembly 918 via a communication path 919. In one example, when the printhead assembly 902 is mounted on the carriage assembly 916, the electronic controller 920 and printhead assembly 902 can communicate through carriage assembly 916 via a communication path 901. The electronic controller 920 may also communicate with ink supply assembly 910 such that, in one implementation, a new (or used) ink supply may be detected.

Electronic controller 920 receives data 928 from a host system, such as a computer, and may include memory to temporarily store data 928. Data 928 may be sent to fluid ejection system 900 along an information transfer path. electronic, infrared, optical or otherwise. Data 928 represents, for example, a document and/or file to be printed. As such, data 928 forms a print job for fluid ejection system 900 and includes at least one print job command and/or command parameter.

In one example, electronic controller 920 provides control of printhead assembly 902, including timing control for ejection of ink droplets from nozzles 608. As such, electronic controller 920 defines a pattern of ink droplets. ejected ink that forms characters, symbols, and/or other graphics or images on print media 924. Control of timing and thus the pattern of ejected ink droplets is determined by print job commands and/or print job parameters. command. In one example, the logic and drive circuits that form a part of electronic controller 920 are located in printhead assembly 902. In another example, the logic and drive circuits that form a part of electronic controller 920 are located outside of the 902 printhead assembly.

Although specific examples have been illustrated and described herein, a variety of alternative and/or equivalent implementations may be substituted for the specific examples shown and described without departing from the scope of the present description. This application is intended to cover any adaptations or variations of the specific examples discussed in this description. Therefore, this description is intended to be limited only by the claims and their equivalents.

Claims (8)

i. An integrated circuit (100a, 100b) for controlling a plurality of fluid actuation devices, the integrated circuit (100a, 100b) comprising: a configuration register (104); a plurality of interfaces comprising a mode interface (112) and a data interface (110); and control logic (102a, 102b) to enable writing to the configuration register (104) in response to a signal on the mode interface (112) going logic high with a logic high signal on the data interface ( 110), wherein the configuration register (104) is for receiving serial data from the data interface (110) with the configuration register (104) enabled for writing. 2. The integrated circuit (100a, 100b) of claim 1, wherein the control logic (102a, 102b) is to disable writing to the configuration register (104) in response to a logic low signal on the interface. mode (112). 3. The integrated circuit (100a, 100b) of claim 1 or 2, wherein the plurality of interfaces comprises a trigger interface (114), and wherein the control logic (102a, 102b) is to enable writing to the configuration register (104) in response to the signal on the mode interface (112) going logic high with a logic high signal on the interface (110) and a logic low signal at the trigger interface (114). 4. The integrated circuit (100a, 100b) of claim 1, wherein the plurality of interfaces comprises a clock interface (116), and wherein the configuration register (104) must receive the serial data from the data interface (110) aligned with a clock signal from the clock interface (116). 5. The integrated circuit (100a, 100b) of any of claims 1-4, wherein the integrated circuit (100a, 100b) is a fluid ejection matrix (600). 6. A method of accessing a fluid expulsion matrix (600), the method comprising: setting a signal on a data pad (110) of the fluid ejection array (600) to logic high; driving a signal on a mode contact pad (112) of the fluid ejection array (600) to logic high; Y enable writing to a configuration register (104) of the fluid ejection array (600) in response to passing the signal on the mode pad (112) to logic high with the signal on the data pad (110) to logic high; Y applying a serial data signal to the data pad (110) to write serial data to the configuration register (104). 7. The method of claim 6, further comprising: passing the signal on the mode contact pad (112) to logic low; and disabling writing to the configuration register (104) in response to the logic low signal on the mode contact panel (112). 8. The method of claim 6 or 7, further comprising: with the configuration register (104) enabled for writing, apply the serial data signal to the data pad (110) aligned with a clock signal on a clock pad (116) of the stripping die of fluid (600).