ES2758524T3 - Vapor deposition system and method - Google Patents

Abstract

A deposition system (100), comprising: a system casing (122) having a casing frame, casing panels (123, 127, 128) supported by said casing frame and an interior of the housing (124); a holding tool transfer assembly (146) having a generally elongated holding tool transfer inclined rail (147) supported by the system frame and extending through the interior of the housing; a plurality of sequentially arranged deposition chambers (185) supported by the clamping tool transfer rail inside the housing; a controller (222) that is interconnected with the deposition chambers; a plurality of circular clamping tool carrier assemblies (156) carried by the clamping tool transfer rail and each adapted to contain a substrate; and where the clamping tool carrier assemblies roll along the clamping tool transfer rail under the influence of gravity.

Description

DESCRIPTION

Vapor deposition system and method

FIELD OF THE INVENTION

Exposure generally refers to coatings for optical lenses and other substrates. More particularly, exposure refers to a system or method of physical or chemical vapor deposition, by the corona or thermal evaporation method that facilitates the sequential application of coatings to an optical lens or other substrate by a gravity-driven transfer of the substrates between successive deposition chambers.

BACKGROUND OF THE INVENTION

The optical lenses of the glasses, such as sunglasses and sunglasses, may include one or more optical coatings that impart a desired appearance or optical characteristics to the lenses. An optical coating includes one or multiple layers of material that deposit on one or both sides of an optical lens and affects the way the lens reflects and transmits light. Anti-reflective coatings and highly reflective coatings are examples of optical coatings that can be applied to an optical lens.

A common method of applying an optical coating to an optical lens includes immersing the lens in a solution, which adheres to one or both surfaces of the lens upon removal of the lens from the solution, and then curing the solution to form the covering. Another method of applying an optical coating to an optical lens involves applying the coating to one or both surfaces of the lens using a physical vapor deposition (PVD) process.

In some applications it may be necessary or desirable to sequentially apply multiple layered coatings on one or both surfaces of an optical lens. For example, applying optical coatings to one or both surfaces of optical spectacle lenses may include applying metallic, dielectric, dichroic, hydrophobic, oleophobic, or superhydrophobic coatings to the lenses in a sequential manner. A challenge, which is inherent in the serial application of coatings on optical lenses, is the transfer of each lens between the multiple deposition chambers in a manner that is efficient and is not exposed to physical contact or contamination from the newly applied coatings. on the lens.

Therefore, there is a need for a physical vapor deposition (PVD) system that facilitates the sequential application of coatings to an optical lens or other substrate by gravity-driven transfer of the substrates between successive PVD chambers.

Document US 2001/015074 sets forth a consecutive deposition system.

US 2010/313809 discloses a substrate processing system having an improved substrate transport system.

DE 19836652 A1 discloses a deposition system with an inclined transfer rail.

SUMMARY OF THE INVENTION

The invention relates to a deposition system according to claim 1 and to a deposition method according to claim 12. An illustrative embodiment of the system includes a deposition system comprising a system casing with a casing shell, housing panels supported by said housing frame and an interior of the housing, a clamping tool transfer assembly having a generally elongated clamping tool transferring rail supported by the system frame and extending through the interior of the housing, a plurality of sequentially arranged deposition chambers carried in the holding tool transfer rail inside the housing, a controller that is interconnected with the deposition chambers, a plurality of assemblies Circular clamping tool carriers carried by the tool transfer rail of s each and adapted to contain a substrate, where the clamping tool carrier assemblies roll along the clamping tool transfer rail under the influence of gravity.

BRIEF DESCRIPTION OF THE DRAWINGS

The exhibition will now be carried out, by way of example, with reference to the attached drawings, in which:

Figure 1 is a front perspective view on the left side of an illustrative embodiment of the vapor deposition system, with the system housing in an open configuration;

Figure 2 is a right side front perspective view of an illustrative embodiment of the vapor deposition system, with the system housing in an open configuration;

Figure 3 is a perspective view of an illustrative embodiment of the vapor deposition system, with the system housing in a closed configuration;

Figure 4 is a perspective view of a film application system of an illustrative embodiment of the vapor deposition system;

Figure 5 is a block diagram illustrating the interconnection of the components of the various subsystems of the physical vapor deposition system; and

Figure 6 is a flow chart of an illustrative embodiment of a physical vapor deposition method.

DETAILED DESCRIPTION

The following detailed description is merely exemplary in nature and is not intended to limit the disclosed embodiments or the application and uses of the disclosed embodiments. As used herein, the word "exemplary" or "illustrative" means "serving as an example, case, or illustration." Any implementation described herein as "exemplary" or "illustrative" should not necessarily be construed as preferred or advantageous over other implementations. All of the implementations described below are exemplary implementations which are provided to enable those skilled in the art to practice the disclosure and are not intended to limit the scope of the appended claims. Furthermore, it is not intended to be limited by any expressed or implied theory presented in the technical field, background, brief summary above, or in the following detailed description.

Referring initially to Figures 1-4 of the drawings, an illustrative embodiment of the physical vapor deposition system, hereinafter in the present system, is generally indicated by reference number 100. As will be further described with Hereinafter, system 100 is adapted to sequentially apply one or more coatings (not shown) to one or both surfaces (not shown) of a substrate (not shown) using a physical vapor deposition process (PVD). In some applications, the substrate may be an optical lens of glasses, such as a pair of viewing glasses or sunglasses, for example, and without limitation. The coating (s) applied to the substrate may be hydrophobic, oleophobic or superhydrophobic coatings, for example, and without limitation, which may serve as anti-reflective coatings, highly reflective coatings or other known optical coatings in the technique. The PVD processes that are used to apply the coatings to the substrate can be carried out sequentially in a series of multiple processing chambers 185 (Figure 4). Each substrate can be transferred from one processing chamber 185 to the next processing chamber 185 in the deposition process by means of gravity, as will be further described herein below.

The system 100 may include a system housing 122. In some embodiments, the system housing 122 may include a pair of side housing panels 123, an upper housing panel 127, and a rear housing panel 128, defining an interior of housing 124. The interior of housing 124 can be divided into a lower subsystem compartment 125 and an upper chamber compartment 126. Subsystem compartment 125 may contain various system 100 subsystem components, which will be described later in Present. Chamber compartment 126 may contain a film application system 184 having multiple processing chambers 185. During operation of system 100, which will be described hereinafter, processing chambers 185 implement pickling and physical deposition functions of steam in the processing of substrates.

As illustrated in Figures 1-4, the system case 122 may include at least one front door of the subsystem compartment 130 provided in the system frame 101. In some embodiments, the system case 122 may have multiple front doors Adjacent to subsystem compartment 130. The front doors of subsystem compartment 130 can be selectively opened to expose subsystem compartment 125 to the front of the interior of housing 124, as illustrated in Figures 1 and 2, or selectively close to hide subsystem compartment 125 at the front inside housing 124, as illustrated in FIG. 3.

In some embodiments, the system housing 122 may further include at least one subsystem compartment rear door (not illustrated) provided in the system housing 122. The subsystem compartment rear door can be selectively opened to expose the subsystem compartment 125 at the rear of the interior of the housing 124, or selectively close to hide the subsystem compartment 125 at the rear of the interior of the housing 124.

The system housing 122 may include at least one front door of the camera compartment 132 to selectively expose and hide the camera compartment 126 at the front inside the housing 124. At least one of the front doors of the camera compartment Chambers 132 may have at least one window 133. In some embodiments, the front door of chamber compartment 132 may be attached, with pivoting allowed, to a side housing panel 123 of system housing 122 by means of hinges. of door 137 (figures 1 and 2). At least one door latch (not illustrated) may be provided on each front door of chamber compartment 132. The door latch or latches may be adapted to selectively lock the front door or doors of chamber compartment 132 in the closed position of Figure 3, or selectively unlock the front door or doors of the chamber compartment 132 to open, as illustrated in Figures 1 and 2. In some embodiments, at least one cylinder of door extension (not shown) to system housing 122. A door extension piston (not shown) can be extended from the door extension cylinder. The door extension piston can be attached to an interior surface of the front door of the chamber compartment 132. Accordingly, when the front door of the chamber compartment 132 is closed and the door latch (not shown) is closed , the door extension piston retracts into the door extension cylinder. When the front door of chamber compartment 132 is open, the door extension piston extends from the door extension cylinder and holds the front door of chamber compartment 132 in the open position.

In some embodiments, the system housing 122 may further include a rear camera compartment door (not illustrated) to selectively expose and hide the camera compartment 126 at the rear of the interior of the housing 124. The rear door The chamber compartment may have a design and fastening that is as described hereinabove with respect to the front door or doors of the chamber compartment 132.

As further illustrated in FIGS. 1-6, system 100 may include a holding tool transfer set 146. A holding tool transfer set 146 may include a generally elongated holding tool transfer rail 147 , which extends transversely through the chamber compartment 126 of the interior of the housing 124 in the system housing 122. The clamping tool transfer rail 147 may have a clamping tool loading end 148 and an end clamping tool unloading 149. A lower loading ramp segment 153 and an upper loading ramp segment 153a, and a lower unloading ramp segment 154 and an upper unloading ramp segment 154a, of the Holding tools 147 can protrude respectively past the respective loading and unloading ends of the system housing 122. The tool transfer rail The chuck 147 may be generally inclined downward from the chuck tool loading end 148 to the chuck tool discharge end 149.

The clamping tool transfer rail 147 of the clamping tool transfer assembly 146 can be mounted in the chamber compartment 126 inside the housing 124, according to any suitable procedure known to those skilled in the art. technique. In some embodiments, the clamping tool transfer assembly 146 may include a generally elongated camera support element (not illustrated) that extends through the chamber compartment 126, in a generally transverse relationship to the axis longitudinal of the system housing 122. The camera support element can be attached to any structural component of the system housing 122 using welding, bolts and / or other suitable fixing technique. The clamping tool transfer rail 147 may be inclined with respect to the horizontal at an angle of inclination of approximately 91.50 degrees.

As illustrated in Figures 1-3, the clamping tool transfer set 146 may further include at least one clamping tool carrier assembly 156. In some embodiments, the clamping tool transfer set 146 may include multiple clamping tool carrier assemblies 156, as illustrated. Each clamping tool carrier assembly 156 may include an assembly annular frame 157 having a frame opening 158. A clamping tool mounting plate (not illustrated), having a clamping tool opening, may be provided, at the frame opening 158. The clamping tool opening is sized and configured to receive and secure a single substrate (not shown) usually in the conventional manner.

As illustrated in Figures 1 and 2 of the drawings, a film application system 184 is provided having multiple processing chambers 185 (Figure 4) in chamber compartment 126 within housing 124. Processing 185 have physical vapor deposition capabilities in accordance with the knowledge of those skilled in the art. At least one of the processing chambers 185 may have pickling capabilities of the substrate. As illustrated in FIG. 5, in some embodiments, the processing chambers 185 may include a first processing chamber 185a, a second processing chamber 185b, and a third processing chamber 185c, which are sequentially arranged between the segments of upper and lower loading ramps 153, 153a on one side and the segments of upper and lower discharge ramps 154, 154a on the other side of the system housing 122. Therefore, the processing chambers 185 can assume the orientation inclined or angled clamping tool transfer rail 147.

Each processing chamber 185 is adapted to receive by gravity and contain a clamping tool carrier assembly 156 having a substrate (not shown) retained therein for substrate processing. As illustrated in Figure 4, a clamping tool inlet valve 188 can be arranged in fluid communication with each processing chamber 185, on one inlet side of the processing chamber 185. A clamping tool outlet valve 189 may be provided in fluid communication with the processing chamber 185, on one outlet side of the processing chamber 185. The clamping tool inlet valves 188 and the clamping tool outlet valves 189 can couple the first processing chamber 185a to the second processing chamber 185b and the second processing chamber 185b to the third chamber processing 185c, with a seal in chamber compartment 126 inside housing 124. During operation of system 100, which will be further described hereinafter, clamping tool inlet valve 188 and valve Tooling Outlet 189 can facilitate sequential transfer of each of the multiple tooling carrier assemblies d and clamping 156 inside and outside, respectively, of each processing chamber 185.

As illustrated in FIG. 4, the film application system 184 may include a low vacuum pump 190, which is arranged in fluid communication with each processing chamber 185 through a conduit of the low vacuum pump 191. Multiple water-cooled evaporation sources (not illustrated) can be provided in each processing chamber 185. A water cooler (not illustrated) can be connected to the water-cooled evaporation sources through a pair of patch cords. Water. An evaporative power supply (not illustrated) can be electrically connected to water-cooled evaporative sources via a pair of lead wires.

At least one liquid supply injection arm (not illustrated) may be provided in fluid communication with each processing chamber 185. In some embodiments, a pair of front and rear liquid supply injection arms may be provided in communication flowable with each processing chamber 185. An arm internalization mechanism (not illustrated) can be attached to each liquid supply injection arm for internalization of the liquid supply injection arms through the supply ports of liquid from the respective front and rear sides (not illustrated) in the processing chamber 185 during operation of the system 100. When in the internalized configuration, the liquid supply injection arms can be located on the front and rear opposites of the clamping tool carrier assembly 156. A deposition fluid supply system may be provided (not illustrated) in fluid communication with the liquid supply injector arms through the liquid supply lines.

A turbomolecular pump (not illustrated) may be arranged in fluid communication with each processing chamber 185. Each processing chamber 185 may include a clamping tool rotation mechanism (not illustrated) that facilitates rotation of the tool carrier assembly clamp 156 in processing chamber 185. The clamping tool rotation mechanism may include a motion sensor (not shown) that detects movement of clamping tool carrier assembly 156 in processing chamber 185. It can be arranging a vacuum valve (not shown) in fluid communication with the processing chamber 185 in communication with the turbomolecular pump.

It will be recognized and understood that the foregoing description of each processing chamber 185 is an overview, and it will be recognized and understood that processing chambers of various designs, which are known to those skilled in the art, may be suitable for the purpose of Pickling and depositing coatings on substrates using physical vapor deposition techniques during operation of system 100. Some processing chambers 185 that are suitable for the implementation of system 100 may depart, at least in some design detail, from the description. of the processing chamber 185, which was explained hereinabove with respect to FIG. 4. At least one of the processing cameras 185 may have any pickling chamber design, with the necessary hardware suitable for pickling. and cleaning of substrates in preparation for deposition of coatings on their substrates deals by operating the processing chambers 185. The designs of the pickling chambers are widely known to those skilled in the art; therefore, it is not necessary to explain the hardware and design of pickling chamber 198 herein in detail. In general the pickling chamber may include a clamping tool inlet valve 188 and a clamping tool outlet valve 189, which facilitate the entry and exit of the clamping tool carrier assemblies 156 into and out of, respectively, the pickling chamber, as described hereinabove with respect to the processing chambers 185 in FIG. 4.

Referring now to Figure 5 of the drawings, a block diagram of a control system 216 is illustrated which is suitable for the implementation of the physical vapor deposition system 100. The control system 216 may include a programmable logic controller. (PLC) 222. A user interface (HMI) 224 can be interconnected with the PLC 222. The HMI interface 224 can include a keyboard, a mouse and / or other elements that can be used to program the PLC 222 in order to operating the multiple functions of system 100. An electrical distribution panel 220 may be interconnected with PLC 222. The various functional components of system 100 may be electrically connected to electrical distribution panel 220. Accordingly, PLC 222 may be adapted to operate the various subsystems of system 200 through electrical distribution panel 220.

Some of the system 100 subsystems may include a low vacuum pump 190, water cooled evaporation sources 194, a deposition liquid supply system 204, a clamping tool rotation mechanism 211, a tooling inlet valve clamping 188, a clamping tool outlet valve 189 and a turbomolecular pump 210, each of which is disposed within, or interconnected with, the processing chamber 185. The evaporative power supply 200 may be electrically connected to electrical distribution panel 220 and to water-cooled evaporation sources 194 in processing chamber 185. Water cooler 195 may be electrically connected to electrical distribution panel 220 and arranged in fluid communication with refrigerated evaporation sources by water 194. In some embodiments, an input position sensor 192 may be connected to the distribution panel. electric switch 220 and disposed in the inlet position of the processing chamber 185, adjacent to the clamping tool inlet valve 188. The inlet position sensor 192 may be adapted to detect the clamping tool carrier assembly 156 in the inlet position of the processing chamber 185 and make it possible for the PLC 222 to open the clamping tool inlet valve 188 of the processing chamber 185, for the input of the clamping tool carrier assembly 156 into the processing chamber 185, as will be described hereinafter. As further illustrated in FIG. 5, in some embodiments, a cooling system for chambers 236 may be interconnected with each processing chamber 185 and with electrical distribution panel 220, in order to cool the interior of the chamber. Processing 185.

Some of the subsystems of system 100 may be contained in subsystem compartment 125 (Figures 1 and 2) within the housing 124. In some embodiments, the low vacuum pumps 190, the water cooler 195 and the power supply Evaporation 200 can be contained in subsystem compartment 125 at the front inside the housing 124. Electrical distribution panel 220 and PLC 222 can be contained in subsystem compartment 125 at the rear inside the Housing 124. Subsystems can be selectively exposed and accessed for repair, replacement and / or maintenance purposes by opening the front doors of subsystem compartment 130 (Figure 1) and the rear door of subsystem compartment ( not illustrated). Similarly, PVD cameras 185 can be selectively exposed and accessed for repair, replacement, and / or maintenance purposes by opening the front door of camera compartment 132 and the rear door of camera compartment ( not illustrated).

In an exemplary application, system 100 is operated to apply one or multiple coatings (not shown) on one or both sides of a substrate (not shown) in a sequential manner, using a physical vapor deposition (PVD) process. ). In some applications, the substrate can be an optical lens that will be used in the mounting of glasses, such as a spectacle or sunglasses, for example, and without limitation. For example, and without limitation, in some applications system 100 can be operated to strip the front and rear sides of an optical lens with plasma; apply a mirror coating on the front side of the lens; and applying an oleophobic / hydrophobic coating on the front and back sides of the lens. In other applications, the substrate can be any type of substrate to which one or more coatings must be applied using a PVD process.

A substrate is secured in each of the multiple holding tool carrier assemblies 156 (Figures 1-3). As will be further described hereinafter, each clamping tool carrier assembly 156 serves as a vehicle for transporting the substrate between, and within, sequential processing chambers 185. Accordingly, each substrate can initially be secured in the opening of frame 158 of a holding tool carrier assembly 156.

As illustrated in Figures 2 and 3, at least one clamping tool carrier assembly 156 (each containing a substrate 182 contained therein) is initially placed in the lower loading ramp segment 153 of the Holding Tools 147. In some embodiments, multiple holding tool carrier assemblies 156 may be placed in series on the lower loading ramp segment 153 of the holding tool transfer rail 147, as illustrated. Each clamping tool carrier assembly 156 can be inserted into place between the lower loading ramp segment 153 and the upper loading ramp segment 153a, such that a circumferential groove for the rail (not shown) in the frame of the set 157 of the holding tool carrier assembly 156 receives the lower loading ramp segment 153 and the upper loading ramp segment 153a of the holding tool transfer lane 147. Therefore, each holding tool carrier assembly 156 remains vertical by itself between the lower loading ramp segment 153 and the upper loading ramp segment 153a.

Due to the angled or inclined configuration of the lower loading ramp segment 153 and the upper loading ramp segment 153a, each clamping tool carrier assembly 156 has a tendency to roll under the influence of the gravity transfer rail. clamping tools 147, from its clamping tool loading end 148 to its clamping tooling discharge end 149. Accordingly, the clamping tool carrier assembly 156 which is the first in the series of multiple tool carrier assemblies Clamping 156 on the loading ramp segment 153 rolls to a "ready" position adjacent to a clamping tool inlet valve 188 at the inlet of the first processing chamber 185a. A second set Fixing tool carrier 156 rolls into the space previously occupied by the first clamping tool carrier set 156, and the remaining clamping tool carrier assemblies 156 roll to the spaces previously occupied by the clamping tool carrier assemblies 156 above, respectively.

System 100 initializes and enters a standby situation when PLC 222 is activated (Figure 5). The operating parameters (temperature, pressure, etc.) for the pickling process to be carried out and for each of the deposition processes, which must be carried out sequentially in the processing chambers 185, can be program in PLC 222 (Figure 5) through HMI interface 224. An inlet position sensor (not shown) in the “ready” position, adjacent to the clamping tool inlet valve 188 of the first processing chamber 185a, detects the location of the first clamp tooling assembly 156 in the "ready" position and transmits a signal to PLC 222. In response, PLC 222 opens clamping tool inlet valve 188 of the first processing chamber 185a and the first clamping tool carrier assembly 156 rolls into the first processing chamber 185a. The PLC 222 then closes the clamping tool inlet valve 188 of the first processing chamber 185a and sets the programmed pressure in the first processing chamber 185a. The next clamping tool carrier assembly 156 in the tail at the discharge chute segment 154 rolls on the clamping tool transfer rail 147 under the influence of gravity to the "ready" position adjacent to the inlet valve of holding tools 188 of the first processing chamber 185.

After the PLC 222 sets the pickling temperature, pressure, and other operating parameters, which were previously programmed into the PLC 222, the first processing chamber 185a can be operated, under the control of the PLC 222, to strip and clean both surfaces of each substrate being retained in the first clamping tool carrier assembly 156. After stripping and cleaning of the substrates in the first clamping tool carrier assembly 156 is completed, the PLC 222 opens an outlet valve of clamping tools 189 of the first processing chamber 185, and the first clamping tool carrier assembly 156 rolls from the first processing chamber 185 to the entry position of the second processing chamber 185b. The input position sensor 192 (Figure 5) detects that the first clamping tool carrier assembly 156 is in the input position of the second processing chamber 185b and transmits a signal to the PLC 222 indicating the input position of the first clamping tool carrier assembly 156. In response, the PLC 222 vents the first processing chamber 185a to the atmosphere and then opens the clamping tool inlet valve 188 of the second processing chamber 185b. Simultaneously, the liquid supply ports on the front and rear sides (not illustrated) of the second processing chamber 185b are open and the front and rear liquid supply injection arms (not illustrated), by actuation of the internalizing mechanisms of the arms (not illustrated) descend into the second processing chamber 185b. The first clamping tool carrier assembly 156 rolls into place in the second processing chamber 185b. The PLC 222 then closes the clamping tool inlet valve 188. The PLC 222, which responds to the input from the inlet sensor (not shown) in the "ready" position of the first processing chamber 185a , opens the clamping tool inlet valve (not shown) of the first processing chamber 185a and the clamping tool carrier assembly 156 which was next in the tail behind the first clamping tool carrier assembly 156 wheel in the clamping tool transfer lane 147 into the first processing chamber 185a.

The deposition liquid (not illustrated), which will form the coatings on one or both surfaces of each substrate in the first holding tool carrier assembly 156, is dispensed from the deposition liquid supply system 204 (FIG. 5) to through the respective liquid supply lines (not shown) to the liquid supply injector arms (not shown). The liquid supply injector arms dispense the deposition liquid to the water-cooled evaporation sources 194 (Figure 5) in the second processing chamber 185b. Once the deposition liquid is fully dispensed to the evaporation sources 194, the liquid supply injection arms of the second processing chamber 185b are retracted and the liquid supply ports are closed (not illustrated). The clamping tool rotation mechanism 211 (FIG. 5) can then rotate the first clamping tool carrier assembly 156 in the second processing chamber 185b and the PLC 222 vacuum in the second processing chamber 185b by low vacuum pump 190 medium and turbomolecular pump. Once the correct level of vacuum pressure has been reached in the second processing chamber 185b, the deposition liquid is evaporated in the evaporation sources 194 inside the second processing chamber 185b, which covers the substrate in the first holding tool carrier assembly 156. After a predetermined period of time has been determined to ensure thorough coating of the substrates, the PLC 222 vents the second processing chamber 185b to the atmosphere. The PLC 222 then opens the clamping tool outlet valve 189 of the second processing chamber 185b, so that the first clamping tool carrier assembly 156 rolls under the influence of gravity from the second processing chamber 185b to the entry position of clamping tools of the third processing chamber 185c. The same PVD and transfer process is then carried out on the substrates of the first holding tool carrier assembly 156 in the third processing chamber 185d, until the desired coatings have been sequentially applied to the surfaces of each substratum. As the PVD process is carried out in In the second processing chamber 185b, the substrates retained in the clamping tool carrier assembly 156 which was next in the queue behind the first clamping tool carrier assembly 156 in the first processing chamber 185a can be stripped. Subsequently, the substrates in the next glue tooling carrier assembly 156 can be subjected to the PVD processes, in the second processing chamber 185b and in the third processing chamber 185c, in the same manner as the substrates in the first holding tool holder assembly 156.

After the PVD processes in the third processing chamber 185c are completed, the clamping tool carrier assemblies 156 roll sequentially from the third processing chamber 185c to the discharge chute segment 154 of the tool transfer lane Clamping 147. Clamping tool carrier assemblies 156 are removed from discharge chute segment 154 and substrates are removed from frame openings 158 of clamping tool carrier assemblies 156 for further processing. Between uses of system 100, PLC 222 may periodically operate the cooling system of chambers 236 (Figure 5) to clean the interior of each processing chamber 185 as deemed necessary.

Those skilled in the art will appreciate that the physical vapor deposition system 100 can process substrates in multiple holding tool carrier assemblies 156 at the same time, by simultaneously operating the processing chambers 185. This resource facilitates production to High speed, low volume and high productivity of thin film coated substrates using physical vapor deposition processes. Furthermore, the transfer of the clamping tool carrier assemblies 156 between the processing chambers 185 by gravity eliminates the need for a mechanical structure and the associated power supply, which would otherwise be required for the transfer operation. System 100 can be designed so that the functions and capabilities of the chamber are flexible and can be adapted for various types of physical vapor deposition applications on different types of substrates. Examples include, but are not limited to, mirror ophthalmic coatings, anti-reflective ophthalmic coatings, protective coatings, cosmetic coatings, compact disc manufacturing, and medical device manufacturing. The construction methods and materials for system 100 can be tailored according to the particular thin films to be applied on the substrates. System 100 can be constructed in any of a variety of sizes depending on the desired application. Various alternative designs for subsystems, assemblies, and components can be used in various embodiments of system 100. System 100 can be manufactured using various manufacturing techniques including, but not limited to, soldering, brazing, connectors, terminal blocks, screws , bolts, nuts and clamps.

Those skilled in the art will further appreciate that each processing chamber 185 can contain multiple water-cooled evaporation sources 194 (FIG. 5) to improve the flexibility of the physical vapor deposition system 100. Thus, they can be carried out Multiple types of physical vapor deposition by evaporation processes in each processing chamber 185. System housing 122 can be manufactured with a small footprint to facilitate simple and spatially efficient placement of physical vapor deposition system 100 at locations of retail.

Various structural arrangements may be made in lieu of or in addition to those previously described herein with respect to the drawings, for the operation and distribution of the vacuum subsystem, the pneumatic subsystem, the electrical subsystem, and / or any other subsystems or components deemed necessary for the operation of the processing chambers 185 or of any other component or operating subsystem of the system 100. For example, and without limitation, the lines of the vacuum system (not illustrated) may be routed throughout the interior of the housing 124 to provide a connection between the low vacuum pumps 190, the turbomolecular pumps and / or other pumps and the processing chambers 185. The pneumatic system ducts (not illustrated) can provide a connection between the components of the vacuum subsystem or the components of the pneumatic subsystem and the processing chambers 185. The orifices ios of the pneumatic system (not shown) can be arranged in the clamping tool transfer rail 147 and / or in other structural components of the system 100 for the operation of the pneumatic subsystem. Other structural arrangements may include any supports, wiring, and piping that may be necessary to interconnect all components and subsystems.

The film applicator system 184 (Figure 17) of system 100 can be designed as a stand-alone unit, as part of an in-line physical vapor deposition system, or as part of a larger, more complex system. The film applicator system 184 can coat one side or two sides of a substrate, and a coating can be performed on both sides, which is applied to the substrate, individually or simultaneously at high speeds and with high productivity. Film applicator system 184 can operate manually, semi-automatically, or fully automatically by means of a computer or PLC 111 and HMI interface 224 (Figure 5).

The clamping tool carrier assemblies 156 can be constructed of various materials depending on the particular application. The clamping tool carrier assemblies 156 can be constructed for application in one side only and can be manufactured in various sizes. Alternative methods can be used to retain the substrate in the frame opening 158 of each clamping tool carrier assembly 156. In addition, the design of each clamp tooling carrier assembly 156, as well as each processing chamber 185, such As described and illustrated herein, it can facilitate uniform coating of either or both surfaces of each substrate depending on the desired application.

Referring now to Figure 6 of the drawings, a flow diagram 2300 of an illustrative embodiment of a physical vapor deposition method is illustrated. At block 2302, an inclined gradient is provided. In block 2304, the processing chambers are placed along the sloping gradient. In some applications, the processing chambers may include a pickling chamber and at least one physical vapor deposition (PVD) chamber. In some embodiments, the processing chambers can include a pickling chamber and multiple sequentially ordered PVD chambers. At block 2306, at least one holding tool carrier assembly is provided. At block 2308, a substrate is placed in the holding tool carrier assembly. At block 2310, the clamping tool carrier assemblies are transported into, and between, the processing chambers along the sloping gradient under the influence of gravity. The design of each PVD chamber and each holding tool carrier assembly can facilitate uniform deposition of one or more coatings on either or both surfaces of each substrate.

Although various illustrative embodiments of the disclosure have been described above, it will be recognized and understood that various modifications may be made to the disclosure and the appended claims are intended to encompass all such modifications that may be within the scope of the disclosure embodiments.

Claims (12)

1. A deposition system (100), comprising: a system shell (122) having a shell frame, shell panels (123, 127, 128) supported by said shell frame and an interior of the shell (124); a holding tool transfer assembly (146) having a generally elongated holding tool transfer inclined rail (147) supported by the system frame and extending through the interior of the housing; a plurality of sequentially arranged deposition chambers (185) supported by the clamping tool transfer rail inside the housing; a controller (222) that is interconnected with the deposition chambers; a plurality of circular clamping tool carrier assemblies (156) carried by the clamping tool transfer rail and each adapted to contain a substrate; and where clamping tool carrier assemblies roll along the clamping tool transfer rail under the influence of gravity. The deposition system (100) of claim 1, wherein the clamping tool transfer rail (147) of the clamping tool transfer assembly (146) comprises a loading ramp segment (153, 153a) and a discharge chute segment (154, 154a) extending from inside the housing (124) on opposite sides of the system housing (122). 3. The deposition system (100) of claim 1, wherein the system housing (122) comprises at least one inlet. The deposition system (100) of claim 1, wherein the interior of the housing (124) of the system housing (122) comprises a subsystem compartment (125) and a chamber compartment (126), and wherein the deposition chambers are contained in the chamber compartment. The deposition system of claim 4, wherein the system housing (122) comprises at least one subsystem compartment door (130), adapted to selectively open and close the subsystem compartment (125), and the minus a chamber compartment entrance adapted to selectively open and close the chamber compartment. The deposition system (100) of claim 5, wherein the subsystem compartment inlet (s) comprise a first and second subsystem compartment door (130) and the chamber compartment inlet (s) comprise a first and second camera compartment entrance. The deposition system (100) of claim 1, wherein each of the holding tool carrier assemblies (156) comprises a frame of the circular assembly (157); or further comprising an opening of the holding tool in the holding tool mounting plate and where the substrate is contained in the opening of the holding tool; or where each of the substrate clamping fixtures comprises a clamping fixture frame having an aperture of the clamping fixture frame dimensioned to receive a substrate; or further comprising a circumferential groove for the rail in the frame of the assembly (157) and receiving the clamping tool transfer rail (147) from the clamping tool transfer assembly (146); or where the clamping tool transfer rail (147) of the clamping tool transfer assembly (146) comprises a loading ramp segment (153, 153a) and an unloading ramp segment (154, 154a), which they extend from inside the housing (124) on opposite sides of the system housing (122); or further comprising a cooling system for the chambers (236) that is interconnected with each of the physical vapor deposition chambers (185) and the controller (222). 8. The deposition system (100) of claim 1, further comprising a user interface (224) that is interconnected with the controller (222). 9. The deposition system (100) according to claim 1, further comprising: a generally square system housing (122) with a subsystem compartment (125) and a camera compartment (126); the holding tool transfer assembly (146) generally extending through the chambers (126) within the housing; the plurality of sequentially arranged deposition chambers (185) supported by the clamping tool transfer rail (147) in the chamber compartment within the housing; a programmable logic controller (222) that is interconnected with the pickling chamber (198) and the physical vapor deposition chambers; a user interface that is interconnected with the programmable logic controller; including each one of the holding tool holder sets: a frame of the circular assembly; a mounting tool mounting plate carried in the assembly frame; a single clamping tool opening in the clamping tool mounting plate; a circumferential groove for the rail in the frame of the assembly and receiving the clamping tool transfer rail of the clamping tool transfer assembly; and where the holding tool holding assemblies are transferred between the pickling chamber and the deposition chambers under the influence of gravity. 10. The deposition system (100) of claim 9, wherein each of the substrates holding tools comprises a holding tool frame having a holding tool frame opening dimensioned to receive a substrate. The deposition system (100) of claim 9, wherein each of the deposition chambers (185) is adapted to apply at least one coating on each of the opposite surfaces of the substrate. 12. A deposition method, comprising: provide a fixed and inclined transfer lane; providing a plurality of deposition chambers along the inclined and fixed transfer rail; providing a circular clamping tool carrier assembly adapted to contain at least one substrate; place the substrate (s) in the holding tool holder assembly; and Rolling the clamping tool carrier assemblies into and between the deposition chambers along the inclined clamping tool transfer lane by gravity.