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ES2661339B2 - Método de unión de sustratos y plásticos mediante zona de adhesión térmica controlada - Google Patents

Método de unión de sustratos y plásticos mediante zona de adhesión térmica controlada Download PDF

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Publication number
ES2661339B2
ES2661339B2 ES201600809A ES201600809A ES2661339B2 ES 2661339 B2 ES2661339 B2 ES 2661339B2 ES 201600809 A ES201600809 A ES 201600809A ES 201600809 A ES201600809 A ES 201600809A ES 2661339 B2 ES2661339 B2 ES 2661339B2
Authority
ES
Spain
Prior art keywords
plastic
substrate
plastics
mechanical
thermal barrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES201600809A
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English (en)
Other versions
ES2661339A1 (es
Inventor
José Manuel Quero Reboul
Salvador DOMÍNGUEZ BLAS
Francisco Antonio PERDIGONES SANCHEZ
Emilio FRANCO GONZÁLEZ
Miguel CABELLO VALVERDE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universidad de Sevilla
Original Assignee
Universidad de Sevilla
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Filing date
Publication date
Application filed by Universidad de Sevilla filed Critical Universidad de Sevilla
Priority to ES201600809A priority Critical patent/ES2661339B2/es
Priority to EP17862957.2A priority patent/EP3521000A4/en
Priority to PCT/ES2017/000119 priority patent/WO2018073465A1/es
Publication of ES2661339A1 publication Critical patent/ES2661339A1/es
Application granted granted Critical
Publication of ES2661339B2 publication Critical patent/ES2661339B2/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/3404—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint
    • B29C65/346—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint being a coating or being printed, e.g. being applied as a paint or forming a printed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/3468—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the means for supplying heat to said heated elements which remain in the join, e.g. special electrical connectors of windings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/3472—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the composition of the heated elements which remain in the joint
    • B29C65/3476—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the composition of the heated elements which remain in the joint being metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/302—Particular design of joint configurations the area to be joined comprising melt initiators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/302—Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3022—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/324—Avoiding burr formation
    • B29C66/3242—Avoiding burr formation on the inside of a tubular or hollow article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/348—Avoiding melting or weakening of the zone directly next to the joint area, e.g. by cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91441—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature the temperature being non-constant over time
    • B29C66/91443—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature the temperature being non-constant over time following a temperature-time profile
    • B29C66/91445—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature the temperature being non-constant over time following a temperature-time profile by steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91941—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined
    • B29C66/91943—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to Tg, i.e. the glass transition temperature, of the material of one of the parts to be joined higher than said glass transition temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/06—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using friction, e.g. spin welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/22—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being in the form of recurring patterns
    • B29C66/225—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being in the form of recurring patterns being castellated, e.g. in the form of a square wave or of a rectangular wave
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721—Fibre-reinforced materials
    • B29C66/7212—Fibre-reinforced materials characterised by the composition of the fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/0181—Using microheaters for bonding the lid

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

El objeto de la invención es un procedimiento para adhesión de sustratos a plásticos que pueden estar mecanizados o no. Se trata de un procedimiento de fabricación para un plástico (1), que pueden estar mecanizados o no, a un sustrato (2) con un metal en su superficie. El procedimiento está basado en la generación de calor, producido por efecto Joule, cuando una corriente eléctrica atraviesa un elemento conductor de electricidad (3). Un aspecto relevante de Ja invención es la inclusión de una barrera mecánico-térmica (6), cuya función principal es bajar la temperatura para que se solidifique el material plástico justo en la zona donde se encuentra dicha barrera.#La invención se encuadra en el área de las tecnologías de fabricación y de materiales, siendo muy variado el sector de actividad en el que se aplicaría los principales usos de la adhesión y conformado de estructuras recae en la fabricación de circuitos la bon chip para aplicaciones de tipo biológico o medioambiental. También puede ser usado para realizar carcasas protectoras de plásticos sobre circuitos electrónicos montados sobre placas de circuito impreso.

Description

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DESCRIPCION
Metodo de union de sustratos y plasticos mediante zona de adhesion termica controlada
Objeto de la invencion
El objeto de la invencion es un procedimiento para adhesion de sustratos a plasticos que pueden estar mecanizados o no. Se trata de un procedimiento de fabricacion para un plastico (1), que pueden estar mecanizados o no, a un sustrato (2) con un metal en su superficie. El procedimiento esta basado en la generacion de calor, producido por efecto Joule, cuando una corriente electrica atraviesa un elemento conductor de electricidad (3). Un aspecto relevante de la invencion es la inclusion de una barrera mecanico-termica (6), cuya funcion principal es bajar la temperatura para que se solidifique el material plastico justo en la zona donde se encuentra dicha barrera.
La invencion se encuadra en el area de las tecnologias de fabricacion y de materiales, siendo muy variado el sector de actividad en el que se aplicarfa: los principales usos de la adhesion y conformado de estructuras recae en la fabricacion de circuitos la bon chip para aplicaciones de tipo biologico o medioambiental. Tambien puede ser usado para realizar carcasas protectoras de plasticos sobre circuitos electronicos montados sobre placas de circuito impreso.
Estado de la tecnica
Los metodos de adhesion mas usados actualmente entre estructuras de pollmero (plasticos) y sustratos son el pegado directo con cintas adhesivas de doble cara as! como la aplicacion de pegamento, ya sea mediante curado por temperatura o mediante radiacion ultravioleta. Ambas tecnicas tienen el inconveniente de que se tiene la presencia de pegamentos en algunas zonas en las que no se desee, como en el caso de los canales presentes en circuitos microfluidicos, por ejemplo, en los que el comportamiento de los liquidos puede variar al atravesar el canal, o se pueden contaminar por el hecho de estar en contacto con la cinta adhesiva.
La primera de estas tecnicas de pegado, consiste en la colocacion de cintas adhesivas entre el sustrato y el polimero a pegar. Estas pueden estar mecanizadas para pegar el termoplastico solo en las zonas deseadas, evitando el problema comentado anteriormente, lo que nos darla un proceso de pegado mas limpio y menos influyente en los liquidos. El problema de esta mejora proviene de que los procesos mas comunes para realizar este mecanizado de las cintas es mediante laser o fresado, por
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lo que el procedimiento de pegado deja de ser aplicable en un proceso de produccion en serie.
Estas cintas pueden tener adhesivos diferentes, como por ejemplo las presentadas en US 4,218,279, US 4,769,399, US 5,457,149 o incluso ser conductoras para poder usarlas como una capa de conduction adicional dentro del circuito electronico, como la mostrada en US 3,475,213. Estas cintas han servido para fabricar multitud de dispositivos utiles hasta la fecha, como los mostrados en [7-8],
La segunda de las dos tecnicas usadas actualmente, consiste en la deposicion de una capa muy fina de pegamento entre el sustrato PCB (Placa de circuito impreso) y el polimero. El curado puede realizarse por diferentes metodos, como los mostrados en US 4,717,605 A, 6 en US 4426243 A, que corresponden a tecnicas de curado mediante radiation (como rayos ultravioleta) y mediante la aplicacion de temperatura (ambiente en este caso), respectivamente. Estos metodos de pegado han sido usados para fabricar Lab-on-Chip en sustratos PCB funcionales, como los mostrados en [910]. Tambien pueden usarse tecnicas como el pegado por estampacion [11], que no es mas que la deposicion controlada de pegamento sobre la superficie a adherir colocando esta sobre un medio embebido del adhesivo.
El uso de pegamento introduce problemas a la hora de realizar canales en el caso de que dicho canal sea de pequenas dimensiones, dado a que tiende a entrar en ellos llegando incluso a cerrarlos. Este hecho se agrava cuando se debe realizar la alineacion entre el polimero mecanizado y el sustrato, puesto que el movimiento de una parte sobre otra produce un arrastre de pegamento, por lo que fomenta la aglomeracion de este en partes de la estructura de polimero, en cuyo caso serian necesarios metodos de alineacion por guias. Ademas, una vez curado, aparece el mismo problema que el ocurrido en el pegado mediante cintas adhesivas, que el pegamento existente en los canales contamina e influye a los liquidos que por ellos circula, a no ser que se trate de un pegamento especial para la aplicacion de que se trate, por ejemplo, en aplicaciones biologicas seria obligatorio que el pegamento tuviera propiedades biocompatibles. En este caso, ademas no existe la posibilidad de evitar este problema mediante el mecanizado.
Aunque los dos metodos de pegado citados son los mas comunes, existen algunos otros, como el pegado de SU-8 y PCB, que se produce por el curado del polimero sobre el sustrato [12] y el uso de PMMA (polimetilmetacrilato) como medio de pegado para otros polimeros [13].
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Tambien, si los sustratos a los que adherir los polimeros son tambien materiales polimericos, es muy usada la aplicacion de calor para fusionar la zona de contacto entre polimeros para asi fusionarla. El calor puede ser producido bien por friccion, induccion magnetica o calentamiento directo [14].
El problema de este tipo de tecnicas, es que en el proceso se calienta por igual toda la zona de contacto, por lo que no se puede usar para pegar sustratos con estructuras microfluidicas en su superficie ya que quedan deformadas o destruidas por completo.
Respecto al uso que se le ha dado hasta el momento a las perdidas producidas en una resistencia debido al efecto Joule, se tiene, por ejemplo su uso para la fabrication de sensores de gas, microbombas, sensores de presion, sensores de flujo, microvalvulas y sensores de temperatura, entre otros [15-19], Tambien se ha usado con anterioridad para fusionar un sustrato de silicio con otro de cristal de silica [20], o para fusionar dos polimeros entre si [21], pero no se ha encontrado ningun trabajo donde se haya usado para pegar un polimero con un sustrato PCB.
Referencias
1. US 4,218,279 A, Bonding method employing film adhesives containing an epoxide resin, agosto 1980; Concesionario original: Ciba-Geigy Corporation; Inventores: George E. Green.
2. US 4,769,399, Epoxy adhesive film for electronic aplications, septiembre 1988;
Concesionario original: Minnesota Mining and Manufacturing Company;
Inventores: James L. Schenz.
3. US 5,457,149, Reworkable adhesive for electronic aplications, octubre 1995;
Concesionario original: Minnesota Mining and Manufacturing Company;
Inventores: Joyce B. Hall, Peter B. Hogerton, Jean-Marc Pujol.
4. US 3,475,213, Electrically conductive adhesive tape, septiembre 1965;
Concesionario original: Minnesota Mining and Manufacturing Company;
Inventores: Robert H. Stow.
5. US 4,717,605 A, Radiation curable adhesives, enero 1988; Concesionario original: Merck Patern Gesellschaft mit Beschrankter Haftung; Inventores: Manfred Urban, Jorg Ohngemach.
6. US 4426243 A, Room-temperature-curable, quick-setting acrylic/epoxy adhesives and methods of bonding, diciembre 1981; Concesionario original: Illinois Tool Works Inc; Inventores: Paul C. Brigss
7. A. Petropoulos, G. Kaltsas, D. Goustouridis, E. Gogolides, "A flexible capacitive device for pressure and tactile sensing”, Procedia Chemistry, 1(1), 867-870, 2009.
8. D. Moschou, T. Trantidou, A. Regoutz, D. Carta, H. Morgan, T. Prodromakis, “Surface and electrical characterization of Ag/AgCI pseudo-reference electrodes manufactured with commercially available PCB technologies", Sensors, 15(8), 18102-18113, 2015.
9. S. Schlautmann, G. A. J. Besselink, Radhakrishna Prabdu G., R. M. B. Schasfoort, “Fabrication of a microfluidic chip by UV bonding at room
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temperature for integration of temperature-sensitive layers", Journal of Micromech anise and Microengineering, 13, 81-84, 2003.
10.1. Burdallo, C. Jimenez-Jorquera, C. Fernandez-Sanchez, A. Baldi, “Integration of microelectronic chips in microfluidic systems on printed circuit board”, Journal of Micromechanics and Microengineering, 22(10), 105022, 2012.
11. S. Gassmann, A. Trozjuk, J. Singhal, H. Schuette, M.L. Miranda, O. Zielinski, “PCB based micro fluidic system for thermal cycling of seawater samples. In Industrial Technology (ICIT)”, 2015 IEEE International Conference on (pp. 3365-3369), IEEE, 2015.
12. C. Aracil, F. Perdigones, J.M. Moreno, A. Luque, J.M. Quero, “Portable Lab-on- PCB platform for autonomous micromixing”, Microelectronic Engineering, 131, 13-18, 2015.
13. K. Kontakis, A. Petropoulos, G. Kaltsas, T. Speliotis, E. Gogol ides, “A novel microfluidic integration technology for PCB-based devices: Application to microflow sensing”, Microelectronic Engineering, 86(4), 1382-1384, 2009.
14. A. Yousef pour, M. Hojjati, J.P. Immarigeon, “Fusion BondingAA/elding of Thermoplastic Composites”, Journal of Thermoplastic Composite Materials 17(4), 303-341, 2004.
15. J. Laconte, C. Dupont, D. Flandre, J.P. Raskin, "SOI CMOS Compatible Low- Power Microheater Optimization for the Fabrication of Smart Gas Sensors", IEEE Sensors Journal vol. 4 (5), 670-680, 2004
16. K.L. Zhang, S.K. Chou, and S.S. Ang, "Fabrication, modeling and testing of a thin film Au/Ti microheater", International Journal of Thermal Sciences, vol. 46 (6), pp 580-588, 2006.
17. M.A. Gajda, and FI. Ahmed, "Application of thermal silicon sensors on membranes", Sensor and Actuators A vol. 49 (1-2), pp. 1-9, 1995.
18. J. Puigcorbe, D. Vogel, B. Michel, A. Vila, I. Gracia, C. Cane, and J.R. Morante, "Thermal and mechanical analysis of micromachined gas sensors", Journal of Micromechanics and Microengineering vol. 13 (5), pp. 548-556, 2003.
19. R. Phatthanakun, P. Deelda, W. Pummara, C. Sriphung, C. Pantong, N. Chomnawang, “Design and Fabrication of Thin-Film Aluminum Microheater and Nickel Temperature Sensor”, Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on. IEEE, 2012.
20. T.Y. Cheng, L. Lin,K. Najafi, “Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging", Microelectromechanical Systems, Journal of, 9(1), 3-8, 2000.
21. C.W. Tsao, D.L. DeVoe, "Bonding of thermoplastic polymer microfluidics” Microfluidics and Nanofluidics, 6(1), 1-16, 2009.
Descripcion de las figuras
Figura 1: Figura resumen de la invencion. (a) Vista en planta del plastico colocado sobre el sustrato (b) resultado final del pegado.
(1) Plastico
(2) Sustrato
(3) Resistencia de metal
(4) y (5) Conexiones electricas (6) Barrera mecanico-termica
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Figura 2: Curva generica de etapas de calentamiento y enfriamiento.
Figura 3: Proceso de pegado del plastico. (a) Colocacion y presion, (b) adhesion y (c) final del pegado.
(7) Elemento de presion Descripcion de la invencion
La invencion es un procedimiento de fabricacion para adherir plasticos, que pueden estar mecanizados o no, a una superficie con un metal sobre un sustrato, de forma que la zona de adhesion es controlada. El procedimiento esta basado en la generacion de calor producido por efecto Joule, cuando una corriente electrica atraviesa un elemento conductor de electricidad. Una caracteristica importante de la invencion es la inclusion de una barrera mecanico-termica, cuya funcion principal es frenar y bajar la temperatura para que se solidifique el plastico en ese punto, delimitando de esta forma la zona de adhesion.
El objeto de la solicitud de patente es un procedimiento de fabricacion para un plastico (1), que pueden estar mecanizados o no, a un sustrato (2) con una resistencia de metal en su superficie (3) con sus dos conexiones electricas (4), (5) y una barrera (6), de forma que la zona de adhesion es controlada. El procedimiento esta basado en la generacion de calor producido por efecto Joule, cuando una corriente electrica atraviesa un elemento conductor de electricidad. Una caracteristica importante de la invencion es la inclusion de una barrera mecanico-termica (6), cuya funcion principal es frenar y bajar la temperatura para que se solidifique el material plastico justo en la zona donde se encuentra dicha barrera, y evitar que el plastico pase al otro lado. En la Figura 1 puede verse el procedimiento de la invencion, donde la Figura1(a) es la vista en planta del conjunto plastico-sustrato antes de ser pegado; la Figura 1(b) es la seccion transversal segun el piano A-A’ del pegado final del plastico con el sustrato. Con este procedimiento se evita que el plastico fluya mas alia de la barrera mecanico- termica.
Esta invencion, aparte de eliminar el uso de pegamentos o cintas, pretende solventar dicha dificultad tecnica posibilitando una adhesion libre de pegamentos, evitando los problemas de contamination comentados y facilitando la fabricacion de dichos dispositivos de forma competitiva, industrial y a bajo coste.
El pegado se puede realizar con cualquier plastico (1) mecanizado o no, siempre que este en estado solido. La forma y dimensiones del dispositivo podran variar en funcion de las necesidades
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Ei conductor que se utiliza para la invencion tambien puede ser cualquier metal, en el caso de la materializacion que se presenta en la Figura 1 (a y b), se trata de metal sobre un sustrato (2). En el caso del ejemplo, es un elemento resistivo de metal (3) con forma de serpentin, para conseguir el mayor calentamiento en la menor area posible, de manera que se pueda alcanzar un nivel de temperatura igual osuperior a la temperatura de transicion vitrea del plastico (1), consiguiendo la adhesion deseada. Para poder introducir la corriente en el circuito electrico se utilizan unas conexiones electricas (4) y (5). La corriente electrica necesaria para alcanzar la temperatura deseada dependera de la forma y la disposicion del conductor.
Una caracteristica importante de la invencion es la inclusion de una barrera mecanico- termica (6), realizada con el mismo metal usado para calentar, pero no conectado electricamente a este. La funcion de esta barrera mecanico-termica (6) es limitar el desplazamiento del plastico fundido y bajar la temperatura en la zona en la que se encuentra. Su uso se debe a que en el momento en que se realiza el calentamiento del plastico (1), este sobrepasa el punto de transicion vitrea y fluye. La barrera mecanico-termica (6) delimita el flujo de plastico hacia el interior de la estructura consiguiendo que mantenga la forma deseada. En particular, dicha forma viene definida por la forma de la barrera mecanico-termica (6).
La Figura 1 (a y b) representa el dispositivo una vez realizada la adhesion. Para ello, en primer lugar, se coloca el plastico (1) sobre el sustrato utilizado (2). Una vez alineados el plastico y el sustrato, se precede a ejercer una presion constante entre ellos. Esta presion sirve para favorecer posteriormente la adhesion del sistema debido a que el plastico (1) que, cuando se caliente se encontrara por encima del estado de transicion vitrea, cubrira el elemento resistivo (3) alcanzando el nivel del sustrato (2), y favorecera la transmision homogenea de calor.
Modo de realizacion de la invencion
Para la realizacion de la parte de plastico, se usa una lamina de polimetilmetacrilato (PMMA) extrusionado sin mecanizar (1). Como sustrato se utiliza una PCB (2), compuesto por FR4 y cobre Figura 1.
Sobre la PCB, mediante un proceso fotolitografico y ataque quimico de cobre se obtienen las pistas de cobre (3), (6) y los pads (4) y (5). Estas pistas de cobre (3), (6) y los pads (4) y (5) definen: la resistencia que actua de calentador (3), la barrera mecanico-termica (6), el pad de entrada de corriente (4) y el pad de toma de tierra (5).
Una vez fabricado el sustrato de PCB se procede a realizar el proceso de pegado, Figura 2 (corte A-A’) de la figura 1.
Para realizar la adhesion entre la pieza de PMMA (1) y la placa de circuito impreso (2), se coloca (1) sobre (2) de forma que la superficie inferior del PMMA (1) estan en 5 contacto con la cara superior del PCB (2). Ademas, se emplean un elemento (7) para ejercer presion sobre el conjunto, Figura 3 (a), mejorando de esta forma el pegado. Posteriormente, se aplica la diferencia de potencial electrico necesaria entre los pads
(4) y (5), que genera una intensidad sobre el calentador (3) que hace que este empiece a aumentar su temperatura durante una etapa unica de calentamiento,
10 transmitiendo ese calor a la parte de PMMA (1). La adhesion entre la pieza de PMMA (1) y e! sustrato PCB (2) comienza a producirse al superar la temperatura de transicion vitrea en la base de la lamina de PMMA (1), temperatura que se mantiene constante durante un intervalo de tiempo determinado. El sustrato PCB(2), contiene una barrera mecanico-termica que consiste en una pista de cobre (6), situada junto al calentador 15 de cobre (3), haciendo que la temperatura irradiada por dicho calentador de cobre (3) sea menor a medida que se acerca a dicha barrera (6), evitando de esta manera que el PMMA fundido invada la zona que se encuentra a la derecha de la barrera (6), Figura 3 (b).
Una vez alcanzada una temperatura superior la transicion vitrea, y conseguida la 20 fusion de la base de la lamina de PMMA (1), se deja de aplicar tension de forma paulatina, y en una unica etapa, entre el pad de entrada (4) y el pad de toma de tierra
(5) y se mantiene el elemento de presion (7) para que sigan ejerciendo presion entre PMMA (1) y PCB (2) hasta que se haya enfriado por completo a temperatura ambiente. Tras este paso, se pueden retirar el elemento de presion (7), quedando el
25 PMMA pegado al sustrato de PCB con la zona de adhesion definida por la barrera mecanico-termica (6). Figura 3 (c).

Claims (4)

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    ES 2 661 339 A1
    Reivindicaciones
    1. Metodo de union de sustratos y plasticos mediante zonas de adhesion termica controlada, caracterizado porque, partiendo de un sustrato compuesto por dos capas, una de ellas no conductora y otra conductora resistiva, se da forma a la capa conductora retirando material mediante ataque qulmico u otro medio de manera que se fabrican simultaneamente dos geometrias, una de ellas con dos conexiones electricas y otra que funciona como barrera mecanico-termica situandola junto a la anterior, tras lo que se coloca un plastico sobre la capa conductora resultante, de tal manera que cuando una corriente electrica atraviesa la geometria que contiene conexiones electricas, se genera una temperatura igual o superior a la temperatura de transicion vltrea del plastico que hace que se adhiera al sustrato, al mismo tiempo que fluye hasta parar en la barrera mecanico- termica sobre la que no circula ninguna corriente.
  2. 2. Metodo de union de sustratos y plasticos mediante zonas de adhesion termica controlada segun reivindicacion anterior, caracterizado porque el plastico es preferentemente polimetilmetacrilato,
  3. 3. Metodo de union de sustratos y plasticos mediante zonas de adhesion termica controlada segun reivindicacion 1, caracterizado porque el sustrato es cualquier material con deposicion de un material conductor termico sobre cualquiera de sus superficies,
  4. 4. Metodo de union de sustratos y plasticos mediante zonas de adhesion termica controlada, caracterizado porque, partiendo de un sustrato, se deposita una capa conductora resistiva y se le da una determinada forma geometrica que incluye dos conexiones electricas, tras lo que se ahade una nueva capa conductora resistiva de otro material conductor diferente y se le da una forma geometrica que funciona como barrera mecanico-termica, situandola junto a la geometria anterior, y se coloca un plastico sobre las capas conductoras resultantes, de tal manera que cuando una corriente electrica atraviesa la geometria que contiene las conexiones electricas, se genera una temperatura igual o superior a la temperatura de transicion vitrea del plastico que hace que se adhiera al sustrato al mismo tiempo que fluye hasta parar en la barrera mecanico- termica sobre la que no circula ninguna corriente.
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