ES2558625B1 - PLASMONIC BLACK METAL COATINGS MANUFACTURED BY DEPOSITION BY CATHODIC SPRAYING AT RASING INCIDENCE - Google Patents
PLASMONIC BLACK METAL COATINGS MANUFACTURED BY DEPOSITION BY CATHODIC SPRAYING AT RASING INCIDENCE Download PDFInfo
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- 230000008021 deposition Effects 0.000 title claims abstract description 6
- 238000005507 spraying Methods 0.000 title description 7
- 239000002086 nanomaterial Substances 0.000 claims abstract description 53
- 239000000463 material Substances 0.000 claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 claims abstract description 46
- 239000002184 metal Substances 0.000 claims abstract description 46
- 238000000576 coating method Methods 0.000 claims abstract description 36
- 239000010931 gold Substances 0.000 claims abstract description 25
- 239000011248 coating agent Substances 0.000 claims abstract description 24
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000009826 distribution Methods 0.000 claims abstract description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052737 gold Inorganic materials 0.000 claims abstract description 19
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 11
- 239000004332 silver Substances 0.000 claims abstract description 11
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 9
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 229910052741 iridium Inorganic materials 0.000 claims abstract description 8
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052762 osmium Inorganic materials 0.000 claims abstract description 8
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052703 rhodium Inorganic materials 0.000 claims abstract description 8
- 239000010948 rhodium Substances 0.000 claims abstract description 8
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011651 chromium Substances 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 6
- 238000000151 deposition Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 38
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 33
- 229910052786 argon Inorganic materials 0.000 claims description 18
- 239000011261 inert gas Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 6
- 230000031700 light absorption Effects 0.000 claims description 5
- 238000001228 spectrum Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 abstract description 6
- 210000002381 plasma Anatomy 0.000 description 8
- 238000002835 absorbance Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 239000000395 magnesium oxide Substances 0.000 description 4
- 229910000510 noble metal Inorganic materials 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 210000004027 cell Anatomy 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
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- 239000010409 thin film Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 230000032900 absorption of visible light Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 239000002103 nanocoating Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004416 surface enhanced Raman spectroscopy Methods 0.000 description 2
- 238000001429 visible spectrum Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 239000002772 conduction electron Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
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- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005329 nanolithography Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000002061 nanopillar Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Composite Materials (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Recubrimientos de metal negro plasmónico fabricado mediante deposición por pulverización catódica a incidencia rasante.#La presente invención se refiere a materiales recubiertos donde el recubrimiento comprende nanoestructuras de un metal seleccionado de oro, plata, paladio, platino, rutenio, rodio, osmio, iridio, cobre, cromo y cualquiera de sus combinaciones, caracterizado porque más del 45% de las nanoestructuras tienen un diámetro inferior 10 a 50 nm, y la distribución de los diámetros de las nanoestructuras tiene una desviación estándar superior a 5 nm en el intervalo de 0 a 50 nm.Plasmonic black metal coatings manufactured by sputtering sputtering deposition. # The present invention relates to coated materials where the coating comprises nanostructures of a metal selected from gold, silver, palladium, platinum, ruthenium, rhodium, osmium, iridium, copper, chromium and any combination thereof, characterized in that more than 45% of the nanostructures have a diameter of less than 10 to 50 nm, and the distribution of the diameters of the nanostructures has a standard deviation of more than 5 nm in the range of 0 to 50 nm
Description
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Recubrimientos de metal negro plasmonico fabricado mediante deposicion por pulverizacion catodica a incidencia rasantePlasma black metal coatings manufactured by cathode spray deposition at ground level
DESCRIPCIONDESCRIPTION
La presente invention se refiere a recubrimientos de metal negro plasmonico que tienen aplicacion en la fabrication de superficies para diversos dispositivos que implican la absorcion de luz visible.The present invention relates to plasmonic black metal coatings that have application in the manufacture of surfaces for various devices that involve the absorption of visible light.
ESTADO DE LA TECNICASTATE OF THE TECHNIQUE
El metodo de extraction flsica de atomos de un blanco de metal masivo mediante plasmas se denomina pulverizacion catodica o sputtering en ingles. Es una tecnica bien conocida desde hace decadas por crecer laminas delgadas muy compactas y con baja rugosidad. En esta tecnica, un bloque solido, tambien llamado blanco, de un metal determinado se coloca en el interior de un reactor o camara de vaclo con un gas inerte en su interior, como por ejemplo argon. Al inyectar una potencia electromagnetica a traves del blanco, se genera un plasma gaseoso, rico en iones energeticos, que pulverizan la superficie del bloque, emitiendose atomos metalicos en una direction preferentemente perpendicular al blanco, con energlas cineticas del orden de los 10 eV. Estos atomos, al llegar a una superficie en el interior del reactor paralela al blanco, denominada sustrato, se van acumulando y aglomerando, generando una pellcula delgada. Dependiendo de la presion de argon en el reactor, se puede controlar la energla con la que dichos atomos llegan a la superficie. A altas presiones (por encima de 1 Pa en condiciones estandar), las colisiones en el interior del plasma son numerosas, por lo que los atomos llegan al sustrato con baja energla (decimas o centesimas de eV). A bajas presiones, sin embargo, la energla de llegada es muy similar a la de salida del blanco (regimen ballstico), generando pellculas delgadas altamente compactas.The method of physical extraction of atoms of a massive metal blank by plasmas is called cathode spray or sputtering in English. It is a technique well known for decades to grow very compact thin sheets with low roughness. In this technique, a solid block, also called white, of a given metal is placed inside a reactor or vacuum chamber with an inert gas inside, such as argon. By injecting an electromagnetic power through the target, a gaseous plasma is generated, rich in energy ions, which pulverize the surface of the block, emitting metal atoms in a direction preferably perpendicular to the target, with kinetic energies of the order of 10 eV. These atoms, upon reaching a surface inside the reactor parallel to the target, called the substrate, accumulate and agglomerate, generating a thin film. Depending on the pressure of argon in the reactor, the energy with which these atoms reach the surface can be controlled. At high pressures (above 1 Pa under standard conditions), the collisions inside the plasma are numerous, so the atoms reach the substrate with low energy (tenths or hundredths of eV). At low pressures, however, the arrival energy is very similar to that of the target (ballistic regimen), generating highly compact thin films.
En los ultimos anos, la tecnica de sputtering tambien se esta empleando en geometrlas de angulo rasante, la llamada pulverizacion catodica a angulo rasante (sputtering at glancing angle, tambien GLAD): el sustrato donde se van acumulando los atomos ya no se coloca paralelo al blanco, sino formando con este un angulo superior a 60°, lo que provoca que los atomos lleguen al sustrato preferentemente con incidencia oblicua. Esta configuracion induce procesos de sombra en la superficie deIn recent years, the sputtering technique is also being used in flush-angle angles, the so-called sputtering at glancing angle (also GLAD), the substrate where the atoms accumulate is no longer placed parallel to the white, but forming with it an angle greater than 60 °, which causes the atoms to reach the substrate preferably with oblique incidence. This configuration induces shadow processes on the surface of
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la capa delgada en crecimiento que generan estructuras, en principio, inclinadas. Sin embargo, si ademas el sustrato esta rotando en torno a un eje perpendicular a su superficie, las estructuras producidas no estan inclinadas, sino que crecen verticales, es decir, perpendiculares al sustrato.the thin layer in growth that generate structures, in principle, inclined. However, if the substrate is also rotating around an axis perpendicular to its surface, the structures produced are not inclined, but grow vertical, that is, perpendicular to the substrate.
Se entiende por metal negro al metal que presenta una gran absorcion de luz en una region del espectro electromagnetico. Siendo estrictos, el color negro solo se da cuando esa gran absorcion de luz tiene lugar en el rango visible (longitud de onda entre 400 y 750 nm), pero por analogla tambien se habla de metales negros a los que absorben en otros rangos espectrales (ultravioleta, infrarrojo, etc.).Black metal is understood as metal that has a high absorption of light in a region of the electromagnetic spectrum. Being strict, the black color only occurs when that great absorption of light takes place in the visible range (wavelength between 400 and 750 nm), but by analogy it also speaks of black metals that they absorb in other spectral ranges ( ultraviolet, infrared, etc.).
El fundamento flsico de la absorcion de luz en estructuras metalicas a escala submicrometrica y nanometrica son las denominadas resonancias de plasmon localizado: excitaciones colectivas de los electrones de la banda de conduccion que aparecen para una determinada longitud de onda o color de luz incidente (AR) que depende del material asl como de las dimensiones y la forma de la estructura. Asl, cuando iluminamos con luz blanca y recogemos la senal reflejada en la muestra en un analizador espectral, vemos que la componente con AR ha disminuido notablemente. Esto significa que una gran parte de la componente con AR se ha absorbido: se ha empleado en excitar los electrones de conduccion, es decir, en producir la resonancia de plasmon localizado. Cuando se preparan superficies con estructuras metalicas que presentan una cierta distribution de tamanos, hay todo un conjunto de longitudes de onda que pueden resultar absorbidas, pues las estructuras mas pequenas presentaran su resonancia de plasmon a AR1, las siguiente en orden de tamano la presentaran a AR2 (con AR2> AR1), etc., y asl hasta las mayores que resonaran a ARN. Aunque esta fenomenologla la puede presentar cualquier metal, son los metales nobles los mas utilizados como metales negros, pues sus resonancias de plasmon son mas intensas y presentan menos perdidas que en los demas metales. Ademas dado que la plata se oxida en condiciones ambientales, el metal negro mas estudiado es el oro negro.The physical basis of light absorption in submicrometer and nanometric scale metal structures is the so-called localized resonance resonance: collective excitations of the conduction band electrons that appear for a given wavelength or incident light color (AR) It depends on the material as well as the dimensions and shape of the structure. Thus, when we illuminate with white light and collect the signal reflected in the sample in a spectral analyzer, we see that the component with AR has decreased significantly. This means that a large part of the component with AR has been absorbed: it has been used to excite conduction electrons, that is, to produce localized plasmon resonance. When preparing surfaces with metal structures that have a certain distribution of sizes, there is a whole set of wavelengths that can be absorbed, since the smaller structures will present their resonance from plasmon to AR1, the following in order of size will present it to AR2 (with AR2> AR1), etc., and so on until the older ones resonate with RNA. Although this phenomenology can be presented by any metal, noble metals are the most commonly used as black metals, since their plasmon resonances are more intense and have less losses than in other metals. In addition, since silver oxidizes under ambient conditions, the most studied black metal is black gold.
Hasta la fecha, los recubrimientos de metal negro se hablan fabricado mediante diversas tecnicas:To date, black metal coatings have been manufactured using various techniques:
- evaporation en presencia de atmosfera inerte (He o N2), que es el metodo mas antiguo, los recubrimientos generados tienen una estructura percolativa- evaporation in the presence of an inert atmosphere (He or N2), which is the oldest method, the generated coatings have a percolative structure
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(nanoestructuras que percolan formando agregados o clusters) sobre la que se tiene poco control, y la gran absorcion se produce en el infrarrojo;(nanostructures that percolate forming aggregates or clusters) over which there is little control, and the great absorption occurs in the infrared;
- deposicion electroqulmica, que requiere que el sustrato de partida sea conductor, pues de otro modo no se puede llevar a cabo la electrodeposicion. Ademas se generan residuos qulmicos;- electrochemical deposition, which requires that the starting substrate be conductive, otherwise the electrodeposition cannot be carried out. In addition, chemical residues are generated;
- anodizacion de una capa previamente depositada, que al igual que el metodo anterior, necesita un sustrato conductor y genera residuos qulmicos;- anodization of a previously deposited layer, which, like the previous method, needs a conductive substrate and generates chemical residues;
- ataque con laser ultra-rapido de una capa previamente depositada, que es un proceso muy caro pues requiere emplear laseres muy especlficos de femtosegundos, ademas de haber necesitado depositar previamente la capa que se va a nanoestructurar;- ultra-fast laser attack of a previously deposited layer, which is a very expensive process because it requires the use of very specific femtosecond lasers, in addition to having previously deposited the layer to be nanostructured;
- fabricar matrices de nanoestructuras plasmonicas, como por ejemplo nanosurcos en una capa metalica, es un proceso inherentemente caro pues requiere de tecnicas de nanolitografla (FIB, e-beam);- manufacturing matrices of plasmatic nanostructures, such as nanosurks in a metal layer, is an inherently expensive process because it requires nanolithography techniques (FIB, e-beam);
- fabricacion de pellculas delgadas con nanopartlculas mediante el denominado jetprinting method, que es una evaporacion resistiva del material en un crisol, rodeado de un bobinado que se calienta al pasar una corriente, que luego viaja por una columna y sale por un pequeno orificio colimador. Es una tecnica lenta para conseguir areas extensas.- Manufacturing of thin films with nanoparticles by means of the so-called jetprinting method, which is a resistive evaporation of the material in a crucible, surrounded by a winding that is heated when a current passes, which then travels through a column and leaves through a small collimating hole. It is a slow technique to achieve large areas.
Asimismo, y aunque no sean recubrimientos conductores, conviene mencionar que se han empleado metamateriales para conseguir absorbentes de luz en el visible. En estos materiales siempre se combinan nanoestructuras metalicas con capas dielectricas, p. ej., fabricando discos de oro por tecnicas litograficas sobre multicapas, metal/dielectrico o embebiendo nanopartlculas metalicas en matriz dielectrica.Likewise, and although they are not conductive coatings, it is worth mentioning that metamaterials have been used to obtain light absorbers in the visible. These materials always combine metal nanostructures with dielectric layers, e.g. eg, manufacturing gold discs by lithographic techniques on multilayers, metal / dielectric or embedding metal nanoparticles in dielectric matrix.
Recientemente, la patente US20130183540A1 describe un metodo de fabricacion en vaclo de nanopilares metalicos con aplicacion en SERS (del ingles, Surface Enhanced Raman Scattering), en la que las muestras presentan absorcion superior al 80% en el intervalo entre 400 y 800 nm, preparadas mediante un sistema de evaporacion asistida por canon de electrones y empleando incidencia oblicua y rotacion del sustrato. Sin embargo esta tecnica no se puede escalar industrialmente, pues para que el calentamiento sea uniforme los crisoles que contienen el material de partida tienen pequeno diametro (del orden de 1 cm), por lo que no se conseguirla fabricar un recubrimiento en area extensa.Recently, US20130183540A1 describes a method of manufacturing in metal nanopillar vacuum with SERS application (in English, Surface Enhanced Raman Scattering), in which the samples have absorption greater than 80% in the range between 400 and 800 nm, prepared through an evaporation system assisted by electron fees and using oblique incidence and rotation of the substrate. However, this technique cannot be industrially scaled, because so that the heating is uniform, the crucibles that contain the starting material have a small diameter (of the order of 1 cm), so it is not possible to manufacture a coating in a large area.
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La pulverizacion catodica de Au a incidencia rasante en regimen ballstico se ha descrito en Nanotechnology 24 (2013) 045604 y en Applied Physics Letters 97, 173103 (2010), aunque sin rotation del sustrato en torno a la perpendicular a su superficie. Sin embargo los recubrimientos obtenidos no presentaban comportamiento de metal negro.The cathode spray of Au a flush incidence in ballistic regime has been described in Nanotechnology 24 (2013) 045604 and in Applied Physics Letters 97, 173103 (2010), although without rotation of the substrate around the perpendicular to its surface. However, the coatings obtained did not exhibit black metal behavior.
Tambien se han obtenido nanoestructura con forma de zig-zag o helicoidal mediante pulverizacion catodica a incidencia rasante en regimen ballstico con rotacion del sustrato de Ti (J. Mater. Res., Vol. 14, No. 4, Apr 1999) y de Co o Ni (J. Vac. Sci. Technol. A, Vol. 18, No. 4, 2000).Zig-zag or helical nanostructure have also been obtained by means of cathode spraying at ground level in ballistic regime with rotation of the Ti substrate (J. Mater. Res., Vol. 14, No. 4, Apr 1999) and Co or Ni (J. Vac. Sci. Technol. A, Vol. 18, No. 4, 2000).
DESCRIPCION DE LA INVENCIONDESCRIPTION OF THE INVENTION
La presente invention esta dirigida a recubrimientos de metal negro plasmonico que tienen aplicacion en la fabrication de superficies para diversos dispositivos que implican la absorcion de luz visible, como intercambiadores de calor radiativo, materiales absorbentes de energla solar, electrodos en celulas fotovoltaicas, separadores para evitar efectos cruzados entre dispositivos opticos, emisores de luz termica, electrodos en biosensores, etc.The present invention is directed to plasmonic black metal coatings that have application in the manufacture of surfaces for various devices that involve the absorption of visible light, such as radiative heat exchangers, solar energy absorbing materials, photovoltaic cell electrodes, separators to avoid cross effects between optical devices, thermal light emitters, electrodes in biosensors, etc.
Ante las tecnicas mencionadas anteriormente, la tecnica de pulverizacion catodica a incidencia rasante y con sustrato giratorio, posee numerosas ventajas:Given the techniques mentioned above, the cathode spray technique with flush incidence and with rotating substrate, has numerous advantages:
- utiliza tecnicas de vaclo, por lo que no se generan residuos agresivos con el medio ambiente;- uses vacuum techniques, so that no aggressive waste is generated with the environment;
- es eficiente desde un punto de vista energetico ya que la pulverizacion catodica permite la fabricacion a temperatura ambiente y en un solo paso, es decir, no requiere ninguna deposicion previa;- it is efficient from an energetic point of view since cathode spraying allows manufacturing at room temperature and in a single step, that is, it does not require any previous deposition;
- se fundamenta en la tecnica de pulverizacion catodica (sputtering), que se utiliza ampliamente en la industria y que permite el crecimiento del material nanoestructurado en grandes superficies y con bastante control de la morfologla final;- It is based on the technique of sputtering, which is widely used in industry and allows the growth of nanostructured material on large surfaces and with enough control of the final morphology;
- puede hacerse sobre cualquier tipo de sustrato (conductor, aislante, semiconductor, sensibles a la temperatura, etc.), lo que hace que la tecnica de pulverizacion catodica a incidencia rasante y con sustrato giratorio sea mucho mas versatil;- It can be done on any type of substrate (conductor, insulator, semiconductor, temperature sensitive, etc.), which makes the cathode spray technique at ground level and with rotating substrate much more versatile;
- la tasa de crecimiento del recubrimiento se puede controlar inyectando mayor o menor potencia electromagnetica en el plasma, por lo que se puede utilizar industrialmente sobre grandes superficies y controlar, asimismo, el tiempo necesario- the rate of growth of the coating can be controlled by injecting more or less electromagnetic power into the plasma, so it can be used industrially on large surfaces and also control the time required
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del procesado. Esta particularidad confiere a la tecnica propuesta de un alto grado de escalabilidad con eficiencia controlada y bajo coste;of processing. This particularity gives the proposed technique a high degree of scalability with controlled efficiency and low cost;
- mayor control del tamano de las estructuras que se forman y reproducibilidad que en otras tecnicas, como por ejemplo con laser.- greater control of the size of the structures that are formed and reproducibility than in other techniques, such as with laser.
Por tanto, un primer aspecto de la presente invencion se refiere a un materialTherefore, a first aspect of the present invention relates to a material
recubierto donde el recubrimiento comprende nanoestructuras de un metalcoated where the coating comprises nanostructures of a metal
seleccionado de oro, plata, paladio, platino, rutenio, rodio, osmio, iridio, cobre, cromo ySelected from gold, silver, palladium, platinum, ruthenium, rhodium, osmium, iridium, copper, chrome and
cualquiera de sus combinaciones, caracterizado porque:any of its combinations, characterized in that:
mas del 45% de las nanoestructuras tienen un diametro inferior a 50 nm;more than 45% of the nanostructures have a diameter of less than 50 nm;
la distribucion de los diametros de las nanoestructuras tiene una desviacion estandarthe distribution of the nanostructure diameters has a standard deviation
superior a 5 nm en el intervalo de 0 a 50 nm.greater than 5 nm in the range of 0 to 50 nm.
Que haya este porcentaje de nanoestructuras con diametros inferiores a 50 nm y que la distribucion de los diametros de las nanoestructuras tenga la desviacion estandar indicada provoca que el recubrimiento tenga comportamiento de metal negro plasmonico en el espectro visible. Es necesario que haya una distribucion de diametros con anchura notable para que haya resonancia en todo el intervalo de longitudes de onda del visible.That there is this percentage of nanostructures with diameters below 50 nm and that the distribution of the nanostructure diameters has the indicated standard deviation causes the coating to have a plasmonic black metal behavior in the visible spectrum. It is necessary that there be a distribution of diameters with remarkable width so that there is resonance over the entire range of visible wavelengths.
En una realization del primer aspecto de la presente invencion se refiere el material recubierto donde esta caracterizado porque:In an embodiment of the first aspect of the present invention, the coated material is referred to as characterized in that:
mas del 45% de las nanoestructuras tienen un diametro inferior a 50 nm; la distribucion de los diametros de las nanoestructuras tiene una desviacion estandar superior a 5 nm en el intervalo de 0 a 50 nm; ymore than 45% of the nanostructures have a diameter of less than 50 nm; the distribution of the nanostructure diameters has a standard deviation greater than 5 nm in the range of 0 to 50 nm; Y
la altura media de las nanoestructuras esta comprendida entre 50 y 250 nm.The average height of the nanostructures is between 50 and 250 nm.
Tal y como se puede ver en la micrografla de la figura 3, que es una vista superior de un recubrimiento de la invencion, las nanoestructuras del recubrimiento tienen geometrla cuasi circular. Por diametro de las nanoestructuras se entiende por tanto el diametro de dicho clrculo.As can be seen in the micrograph of Figure 3, which is a top view of a coating of the invention, the nanostructures of the coating have a quasi-circular geometry. The diameter of the nanostructures is therefore understood as the diameter of said calculation.
En otra realizacion del primer aspecto de la presente invencion, la distribucion de los diametros de las nanoestructuras tiene una desviacion estandar entre 10 nm y 25 nm en el intervalo de 0 a 50 nm.In another embodiment of the first aspect of the present invention, the distribution of the nanostructure diameters has a standard deviation between 10 nm and 25 nm in the range of 0 to 50 nm.
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En otra realization del primer aspecto de la presente invention, la distribution de los diametros de las nanoestructuras tiene una desviacion estandar entre 10 nm y 25 nm en el intervalo de 0 a 50 nm y la distribution de los diametros de las nanoestructuras es una distribution asimetrica hacia la derecha en el intervalo de 0 a 50 nm. Esto quiere decir que los diametros presentan una distribution de diametros cuasi normal, con un maximo ligeramente por debajo de 25 nm.In another embodiment of the first aspect of the present invention, the distribution of the nanostructure diameters has a standard deviation between 10 nm and 25 nm in the range of 0 to 50 nm and the distribution of the nanostructure diameters is an asymmetric distribution to the right in the range of 0 to 50 nm. This means that the diameters have a quasi-normal distribution of diameters, with a maximum slightly below 25 nm.
En otra realization del primer aspecto de la presente invention, el recubrimiento tiene una absorcion superior al 60% en el intervalo de 400 nm a 700 nm del espectro electromagnetico, preferiblemente el recubrimiento tiene una absorcion superior al 75% en el intervalo de 400 a 500 nm del espectro electromagnetico.In another embodiment of the first aspect of the present invention, the coating has an absorption greater than 60% in the range of 400 nm to 700 nm of the electromagnetic spectrum, preferably the coating has an absorption greater than 75% in the range of 400 to 500 nm of the electromagnetic spectrum.
En otra realizacion del primer aspecto de la presente invencion, las nanoestructuras forman un angulo con el sustrato de entre 45° y 90°, preferiblemente forman un angulo con el sustrato de entre 60° y 90° y aun mas preferiblemente forman un angulo con el sustrato de entre 75° y 90°. Es decir, las nanoestructuras son sustancialmente perpendiculares al sustrato.In another embodiment of the first aspect of the present invention, the nanostructures form an angle with the substrate between 45 ° and 90 °, preferably form an angle with the substrate between 60 ° and 90 ° and even more preferably form an angle with the substrate between 75 ° and 90 °. That is, the nanostructures are substantially perpendicular to the substrate.
En otra realizacion del primer aspecto de la presente invencion, menos del 15% de las nanoestructuras tienen un diametro mayor a 100 nm.In another embodiment of the first aspect of the present invention, less than 15% of the nanostructures have a diameter greater than 100 nm.
En otra realizacion del primer aspecto de la presente invencion, donde la densidad de nanoestructuras esta entre 80 y 300 nanoestructuras/pm2, preferiblemente entre 160 y 250 nanoestructuras/pm2 y aun mas preferiblemente la densidad esta entre 170 y 230 nanoestructuras/pm2.In another embodiment of the first aspect of the present invention, where the density of nanostructures is between 80 and 300 nanostructures / pm2, preferably between 160 and 250 nanostructures / pm2 and even more preferably the density is between 170 and 230 nanostructures / pm2.
En otra realizacion del primer aspecto de la presente invencion, la altura media de las nanoestructuras es de 50 nm a 250, preferiblemente de 80 nm a 140 nm.In another embodiment of the first aspect of the present invention, the average height of the nanostructures is 50 nm to 250, preferably 80 nm to 140 nm.
En otra realization del primer aspecto de la presente invention, el metal se selecciona de oro, plata, paladio y platino, rutenio, rodio, osmio, iridio y cualquiera de sus combinaciones, preferiblemente el metal se selecciona de oro, plata, paladio, platino y cualquiera de sus combinaciones, mas preferiblemente el metal es oro. Los metales nobles presentan resonancias de plasmon mas intensas. Ademas los recubrimientos de oro presentan buena resistencia a la oxidation.In another embodiment of the first aspect of the present invention, the metal is selected from gold, silver, palladium and platinum, ruthenium, rhodium, osmium, iridium and any combination thereof, preferably the metal is selected from gold, silver, palladium, platinum and any of its combinations, more preferably the metal is gold. The noble metals have more intense plasmon resonances. In addition, gold coatings have good resistance to oxidation.
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En otra realization del primer aspecto de la presente invention, el recubrimiento presenta conductividad electrica. Sin limitarse por la teorla, esta propiedad del recubrimiento parece indicar que por debajo de las nanoestructuras hay una capa continua del metal.In another embodiment of the first aspect of the present invention, the coating exhibits electrical conductivity. Without being limited by the theory, this property of the coating seems to indicate that below the nanostructures there is a continuous layer of the metal.
Un segundo aspecto de la presente invention se refiere a un procedimiento de obtencion de un material recubierto tal y como se ha descrito anteriormente por pulverization catodica a angulo rasante en superficies giratorias de un metal seleccionado de oro, plata, paladio, platino, rutenio, rodio, osmio, iridio, cobre, cromo y cualquiera de sus combinaciones;A second aspect of the present invention relates to a method of obtaining a coated material as described above by cathode spray at flush angle on rotating surfaces of a metal selected from gold, silver, palladium, platinum, ruthenium, rhodium , osmium, iridium, copper, chromium and any combination thereof;
donde el angulo de inclination del sustrato esta entre 85° y 90°; donde la presion del gas inerte es inferior a 0,5 Pa, preferiblemente la presion del gas es inferior a 0,4 Pa, mas preferiblemente la presion del gas es inferior a 0,2 Pa; y donde la deposition del metal tiene lugar en regimen ballstico.where the angle of inclination of the substrate is between 85 ° and 90 °; where the inert gas pressure is less than 0.5 Pa, preferably the gas pressure is less than 0.4 Pa, more preferably the gas pressure is less than 0.2 Pa; and where the deposition of the metal takes place in a ballastic regime.
Por pulverization catodica a angulo rasante en superficies giratorias se entiende el proceso flsico de deposition en fase vapor en el que atomos de un blanco se arrancan mediante un plasma gaseoso y se depositan en un sustrato; por angulo rasante se entiende que el angulo de inclination es superior a 75°; por superficies giratorias se entiende que el sustrato rota en torno a un eje perpendicular a su superficie.By cathode spraying at a flush angle on rotating surfaces, the physical vapor deposition process is understood in which atoms of a target are removed by a gaseous plasma and deposited on a substrate; flush angle means that the angle of inclination is greater than 75 °; by rotating surfaces it is understood that the substrate rotates around an axis perpendicular to its surface.
Por sustrato se entiende el material a recubrir.By substrate means the material to be coated.
Por regimen ballstico se entiende que los atomos viajan del blanco al material a recubrir con una direccionalidad preferente. Es necesario que los atomos lleguen al material a recubrir con una direccionalidad preferente bien definida para que se de el fenomeno de sombreado atomico, necesario para que el recubrimiento presente nanoestructuras y no un recubrimiento continuo. Si la condition de regimen ballstico no se cumple, los atomos sufren colisiones y llegan al material a recubrir por todas las direcciones, desapareciendo el fenomeno de sombreado atomico. Es rutinario para un experto en la tecnica ajustar los parametros para conseguir la deposition del metal en regimen ballstico.Ballistic regime means that atoms travel from the target to the material to be coated with a preferred directionality. It is necessary that the atoms arrive at the material to be coated with a well-defined preferential directionality so that the atomic shading phenomenon is necessary, so that the coating has nanostructures and not a continuous coating. If the ballistic regime condition is not met, the atoms suffer collisions and reach the material to be coated in all directions, disappearing the phenomenon of atomic shading. It is routine for a person skilled in the art to adjust the parameters to achieve the deposition of the metal in a ballistic regime.
Por angulo de inclination del sustrato se entiende el angulo definido entre la llnea recta que va desde el centro del sustrato hasta la superficie del blanco y la perpendicular a la superficie del sustrato.An angle of inclination of the substrate means the angle defined between the straight line that goes from the center of the substrate to the surface of the target and perpendicular to the surface of the substrate.
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En una realization del segundo aspecto de la presente invention, la velocidad de rotation del material a recubrir es inferior a 20 rpm, preferiblemente la velocidad de rotation esta entre 0,5 rpm y 15 rpm, mas preferiblemente la velocidad de rotation esta entre 1 rpm y 10 rpm (revoluciones por minuto).In an embodiment of the second aspect of the present invention, the rotation speed of the material to be coated is less than 20 rpm, preferably the rotation speed is between 0.5 rpm and 15 rpm, more preferably the rotation speed is between 1 rpm and 10 rpm (revolutions per minute).
En una realization del segundo aspecto de la presente invention, el cociente L/d es mayor a 2,5, preferiblemente mayor a 3,5, donde L es la distancia entre blanco y el material a recubrir y d es el diametro del blanco.In an embodiment of the second aspect of the present invention, the ratio L / d is greater than 2.5, preferably greater than 3.5, where L is the distance between the target and the material to be coated and d is the target diameter.
La distancia entre blanco y el material a recubrir, L, esta definida por la llnea recta que va desde el centro del sustrato hasta la superficie del blanco (Fig. 1, 5). El llmite inferior de L viene dado por la condition L/d > 2,5 que asegura colimacion del flujo de atomos. El llmite superior viene dado por la distancia a partir de la cual los atomos disparados pierden su direction inicial. L es menor de 45 cm, preferiblemente L es menor de 30 cm.The distance between white and the material to be coated, L, is defined by the straight line that goes from the center of the substrate to the surface of the target (Fig. 1, 5). The lower limit of L is given by the condition L / d> 2.5 that ensures collimation of atom flow. The upper limit is given by the distance from which the shot atoms lose their initial direction. L is less than 45 cm, preferably L is less than 30 cm.
Por blanco se entiende el bloque metalico de oro, plata, paladio, platino, rutenio, rodio, osmio, iridio, cobre, cromo y cualquiera de sus combinaciones del cual se arrancan atomos.By white it is understood the metallic block of gold, silver, palladium, platinum, ruthenium, rhodium, osmium, iridium, copper, chromium and any of its combinations from which atoms are torn.
Normalmente, el blanco tiene geometrla circular. En los casos en los que no, por ejemplo, cuando el blanco tenga geometrla cuadrada o geometrla cillndrica, por diametro del blanco, d, se entiende el diametro del clrculo que tiene la misma area que el area del blanco (independiente de su forma).Normally, white has circular geometry. In cases where, for example, when the target has square geometry or cylindrical geometry, by diameter of the target, d, the diameter of the circle is understood to have the same area as the area of the target (regardless of its shape) .
Tal y como se ha comentado anteriormente, la pulverization catodica tiene lugar en regimen ballstico. Por ejemplo, puede emplearse el formalismo detallado en Nanotechnology 24 (2013) 045604 y en Plasma Process. Polym. 11 (2014) 571, con el que se llega a una condition en la que el valor (pg.L) debe ser inferior a un determinador valor (1.5/x) para que se cumpla la condition de regimen ballstico, donde pg es la presion de argon en Pa, y L es la distancia entre blanco y el material a recubrir en cm. El valor concreto depende del metal a depositar, de la composition del gas y de la temperatura del mismo.As previously mentioned, cathodic pulverization takes place in ballistic regimes. For example, the formalism detailed in Nanotechnology 24 (2013) 045604 and in Plasma Process can be used. Polym 11 (2014) 571, with which a condition is reached in which the value (pg.L) must be less than a value (1.5 / x) determiner for the ballistic regime condition to be met, where pg is the Argon pressure in Pa, and L is the distance between white and the material to be coated in cm. The specific value depends on the metal to be deposited, the composition of the gas and its temperature.
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A modo de ejemplo, suponiendo que el gas inerte es argon y que la temperatura es 300K, la condition de regimen ballstico se darla para estos valores:As an example, assuming that the inert gas is argon and that the temperature is 300K, the ballistic regime condition will be given for these values:
- Masa (uma) Radio (pm) ^g (m2) V x(Pa _1m_1) (300^ ) Criterio ballstico Pg L < (Pa.cm) Mass (uma) Radius (pm) ^ g (m2) V x (Pa _1m_1) (300 ^) Ballistic criteria Pg L <(Pa.cm)
- Cr Cr
- 52,00 128 1,8874e-19 3 15,15 10 52.00 128 1.8874e-19 3 15.15 10
- Cu Cu
- 63,55 128 2,0025e-19 3,8 12,75 11,8 63.55 128 2.0025e-19 3.8 12.75 11.8
- Pd P.S
- 106,42 137 2,6016e-19 6,8 9,3 16,1 106.42 137 2.6016e-19 6.8 9.3 16.1
- Ag Ag
- 107,87 144 2,7934e-19 6,8 9,9 15,1 107.87 144 2.7934e-19 6.8 9.9 15.1
- Pt Pt
- 195,08 139 3,3604e-19 12,8 6,3 23,8 195.08 139 3,3604e-19 12.8 6.3 23.8
- Au Au
- 197 144 3,5367e-19 12,8 6,75 22,2 197 144 3,5367e-19 12.8 6.75 22.2
siendo ag la section eficaz geometrica, v el numero medio de colisiones necesarias para termalizar el atomo pulverizado, y % = ag / kBTgv donde kB es la constante de Boltzmann.where the geometric effective section is ag, v the average number of collisions necessary to thermalize the atomized atom, and% = ag / kBTgv where kB is the Boltzmann constant.
Por tanto, en una realization del segundo aspecto de la presente invention, el metal es oro, el gas inerte es argon, y Pg.L < 22,2 Pa.cm;Therefore, in an embodiment of the second aspect of the present invention, the metal is gold, the inert gas is argon, and Pg.L <22.2 Pa.cm;
donde pg es la presion de argon en Pa; y L es la distancia entre blanco y el material a recubrir en cm.where pg is the pressure of argon in Pa; and L is the distance between white and the material to be coated in cm.
En otra realizacion del segundo aspecto de la presente invencion, el metal es platino, el gas inerte es argon, y Pg.L < 23,8 Pa.cm;In another embodiment of the second aspect of the present invention, the metal is platinum, the inert gas is argon, and Pg.L <23.8 Pa.cm;
donde pg es la presion de argon en Pa; y L es la distancia entre blanco y el material a recubrir en cm.where pg is the pressure of argon in Pa; and L is the distance between white and the material to be coated in cm.
En otra realizacion del segundo aspecto de la presente invencion, el metal es plata, el gas inerte es argon, y Pg.L < 15,1 Pa.cm;In another embodiment of the second aspect of the present invention, the metal is silver, the inert gas is argon, and Pg.L <15.1 Pa.cm;
donde pg es la presion de argon en Pa; y L es la distancia entre blanco y el material a recubrir en cm.where pg is the pressure of argon in Pa; and L is the distance between white and the material to be coated in cm.
En otra realizacion del segundo aspecto de la presente invencion, el metal es cobre, el gas inerte es argon, y Pg.L < 11,8 Pa.cm;In another embodiment of the second aspect of the present invention, the metal is copper, the inert gas is argon, and Pg.L <11.8 Pa.cm;
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donde pg es la presion de argon en Pa; y L es la distancia entre blanco y el material a recubrir en cm.where pg is the pressure of argon in Pa; and L is the distance between white and the material to be coated in cm.
En otra realization del segundo aspecto de la presente invention, el metal es cromo, el gas inerte es argon, y Pg.L < 10 Pa.cm;In another embodiment of the second aspect of the present invention, the metal is chromium, the inert gas is argon, and Pg.L <10 Pa.cm;
donde pg es la presion de argon en Pa; y L es la distancia entre blanco y el material a recubrir en cm.where pg is the pressure of argon in Pa; and L is the distance between white and the material to be coated in cm.
En otra realizacion del segundo aspecto de la presente invencion, el metal es platino, el gas inerte es argon, y Pg.L < 23,8 Pa.cm;In another embodiment of the second aspect of the present invention, the metal is platinum, the inert gas is argon, and Pg.L <23.8 Pa.cm;
donde pg es la presion de argon en Pa; y L es la distancia entre blanco y el material a recubrir en cm.where pg is the pressure of argon in Pa; and L is the distance between white and the material to be coated in cm.
Un tercer aspecto de la presente invencion se refiere al uso del material recubierto tal y como se ha definido anteriormente como elemento para la fabrication de dispositivos de absorcion de luz visible.A third aspect of the present invention relates to the use of the coated material as defined above as an element for the manufacture of visible light absorbing devices.
En una realizacion del tercer aspecto de la presente invencion, los dispositivos de absorcion de luz visible se seleccionan entre intercambiadores de calor radiativo, dispositivos absorbentes de energla solar, electrodos en celulas fotovoltaicas, separadores de dispositivos opticos, emisores de luz termica, electrodos en biosensores, dispositivos fotocatallticos y detectores en el infrarrojo cercano.In an embodiment of the third aspect of the present invention, visible light absorbing devices are selected from radiative heat exchangers, solar energy absorbing devices, photovoltaic cell electrodes, optical device separators, thermal light emitters, biosensor electrodes , photocatatic devices and detectors in the near infrared.
Un cuarto aspecto de la presente invencion se refiere a un dispositivo de absorcion de luz visible que comprende el material recubierto tal y como se ha definido anteriormente.A fourth aspect of the present invention relates to a visible light absorbing device comprising the coated material as defined above.
A lo largo de la description y las reivindicaciones la palabra "comprende" y sus variantes no pretenden excluir otras caracterlsticas tecnicas, aditivos, componentes o pasos. Para los expertos en la materia, otros objetos, ventajas y caracterlsticas de la invencion se desprenderan en parte de la descripcion y en parte de la practica de la invencion. Los siguientes ejemplos y figuras se proporcionan a modo de ilustracion, y no se pretende que sean limitativos de la presente invencion.Throughout the description and the claims the word "comprises" and its variants are not intended to exclude other technical characteristics, additives, components or steps. For those skilled in the art, other objects, advantages and characteristics of the invention will be derived partly from the description and partly from the practice of the invention. The following examples and figures are provided by way of illustration, and are not intended to be limiting of the present invention.
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BREVE DESCRIPCION DE LAS FIGURASBRIEF DESCRIPTION OF THE FIGURES
FIG. 1. Esquema del montaje para la pulverization catodica a angulo rasante y sustrato giratorio. 1: Bloque de metal noble; 2: plasma; 3: Angulo de inclination; 4: Rotation del sustrato; 5: Distancia bloque-sustrato.FIG. 1. Assembly diagram for cathode spraying at flush angle and rotating substrate. 1: Noble metal block; 2: plasma; 3: Angle of inclination; 4: Rotation of the substrate; 5: Block-substrate distance.
FIG. 2. Fotografla de dos recubrimientos de Au depositados sobre sustratos de Si obtenidos con una velocidad de rotation de 3,6 RPM y un cociente L/d=5. A: Recubrimiento obtenido con un angulo de inclination de 87°; B: Recubrimiento obtenido con un angulo de inclination de 75°.FIG. 2. Photograph of two Au coatings deposited on Si substrates obtained with a rotation speed of 3.6 RPM and a ratio L / d = 5. A: Coating obtained with an inclination angle of 87 °; B: Coating obtained with an inclination angle of 75 °.
FIG. 3. Micrograflas de las nanoestructuras del recubrimiento A de la Fig. 2 con una densidad aproximada de 220 nanoestructuras/pm2.FIG. 3. Micrographs of the nanostructures of the coating A of Fig. 2 with an approximate density of 220 nanostructures / pm2.
FIG. 4. Distribution del tamano de las nanoestructuras de oro, donde pg < 0,5 Pa, en concreto pg =0,15 Pa. D: diametro de la base superior de las nanoestructuras; eje y: % abundancia; 75°, 80°, 85°, 87°: distribution de las nanoestructuras formadas en el recubrimiento a 75°, 80°, 85° y 87° de inclination del material a recubrir, respectivamente.FIG. 4. Distribution of the size of the gold nanostructures, where pg <0.5 Pa, specifically pg = 0.15 Pa. D: diameter of the upper base of the nanostructures; Y axis:% abundance; 75 °, 80 °, 85 °, 87 °: distribution of the nanostructures formed in the coating at 75 °, 80 °, 85 ° and 87 ° of inclination of the material to be coated, respectively.
FIG. 5. Distribution del tamano de las nanoestructuras cuando pg > 0,5 Pa, en concreto pg =0,6 Pa. D: diametro de la base superior de las nanoestructuras; eje y: % abundancia; 75°, 80°, 85°, 87°: distribution de las nanoestructuras formadas en el recubrimiento a 75°, 80°, 85° y 87° de angulo de inclination durante el proceso de fabricacion respectivamente.FIG. 5. Distribution of the size of the nanostructures when pg> 0.5 Pa, specifically pg = 0.6 Pa. D: diameter of the upper base of the nanostructures; Y axis:% abundance; 75 °, 80 °, 85 °, 87 °: distribution of the nanostructures formed in the coating at 75 °, 80 °, 85 ° and 87 ° of inclination angle during the manufacturing process respectively.
FIG. 6. Reflectancia de materiales recubiertos a diferentes grados de incidencia y a pg < 0,5 Pa, en concreto pg =0,15 Pa. R: reflectancia en %; A: longitud de onda en nm; 75°, 80°, 85° y 87°: materiales recubiertos a 75°, 80°, 85° y 87°, respectivamente.FIG. 6. Reflectance of coated materials at different degrees of incidence and at pg <0.5 Pa, specifically pg = 0.15 Pa. R: reflectance in%; A: wavelength in nm; 75 °, 80 °, 85 ° and 87 °: coated materials at 75 °, 80 °, 85 ° and 87 °, respectively.
FIG. 7. Reflectancia de materiales recubiertos a diferentes grados de incidencia y a pg > 0,5 Pa, en concreto pg =0,6 Pa. R: reflectancia en %; A: longitud de onda en nm; 80° y 87°: materiales recubiertos a 80° y 87°, respectivamente.FIG. 7. Reflectance of coated materials at different degrees of incidence and at pg> 0.5 Pa, specifically pg = 0.6 Pa. R: reflectance in%; A: wavelength in nm; 80 ° and 87 °: coated materials at 80 ° and 87 °, respectively.
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FIG. 8. Comportamiento espectral de las muestras 7 y 8 del Ejemplo 1 (sobre un sustrato transparente). Am, Tm y Rm: Absorbancia, transmitancia y reflectancia de la muestra 8 (capa fina de metal continuo, preparada a angulo de incidencia 0); A85, T85, R85: Absorbancia, transmitancia y reflectancia de la muestra 7 (recubrimiento nanoestructurado, preparado a angulo de incidencia 85); A(nm): longitud de onda en nm.FIG. 8. Spectral behavior of samples 7 and 8 of Example 1 (on a transparent substrate). Am, Tm and Rm: Absorbance, transmittance and reflectance of sample 8 (thin continuous metal layer, prepared at angle of incidence 0); A85, T85, R85: Absorbance, transmittance and reflectance of sample 7 (nanostructured coating, prepared at angle of incidence 85); A (nm): wavelength in nm.
EJEMPLOSEXAMPLES
A continuation se ilustrara la invention mediante unos ensayos realizados por los inventores, que pone de manifiesto la efectividad del producto de la invencion.The invention will be illustrated below by tests carried out by the inventors, which shows the effectiveness of the product of the invention.
Ejemplo 1. Procedimiento de obtencion de un material recubiertoExample 1. Procedure for obtaining a coated material
Laminas cuadradas de silicio (opaco) o de oxido de magnesio (transparente) de 1cm de lado se recubrieron con Au mediante pulverization catodica a incidencia rasante y con sustrato giratorio (3,6 rpm), con colimacion (L=19 cm y d=3,8 cm, por lo que L/d=5) y en regimen ballstico, con las siguientes variables:Square sheets of silicon (opaque) or magnesium oxide (transparent) of 1 cm side were coated with Au by cathode spraying at ground level and with rotating substrate (3.6 rpm), with collimation (L = 19 cm and d = 3 , 8 cm, so L / d = 5) and in the ballistic regime, with the following variables:
- Muestra Sample
- Metal noble material angulo inclination Pg [Pa] Noble metal material angle inclination Pg [Pa]
- 1 one
- Au Si 75° 0,15 Au Si 75 ° 0.15
- 2 2
- Au Si 80° 0,15 Au Si 80 ° 0.15
- 3 3
- Au Si 85° 0,15 Au Si 85 ° 0.15
- 4 4
- Au Si 87° 0,15 Au Si 87 ° 0.15
- 5 5
- Au Si 80° 0,6 Au Si 80 ° 0.6
- 6 6
- Au Si 87° 0,6 Au Si 87 ° 0.6
- 7 7
- Au MgO 85° 0,15 Au MgO 85 ° 0.15
- 8 8
- Au MgO 0° 0,15 Au MgO 0 ° 0.15
- Tabla 1. Variab Table 1. Variab
- es del procedimiento de obtencion d e cada It is from the procedure for obtaining each
e cada uno de los ejemplos.e each of the examples.
La muestra 8 se hizo sin incidencia rasante para tener una lamina continua con la que comparar.Sample 8 was made without flush incidence to have a continuous sheet with which to compare.
El montaje para llevar a cabo el recubrimiento del material se muestra en la figura 1.The assembly to carry out the coating of the material is shown in Figure 1.
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Ejemplo 2. Efecto del angulo de inclinacionExample 2. Effect of the angle of inclination
La figura 6 muestra el efecto del angulo de inclinacion del sustrato en la reflectancia del recubrimiento resultante. Se puede ver que las muestras 3 y 4, preparadas a angulos de inclinacion de 85° y 87° tiene una reflectancia inferior al 15% en el intervalo de longitudes de onda de 400 nm a 700 nm, es decir, que tienen una absorbancia superior al 85% en dicho intervalo. Estas dos muestras estan proximas a cumplir las especificaciones de material absorbente ideal para su uso en celulas solares (Kravets etal., Phys. Rev. B 78, 205405 (2008).Figure 6 shows the effect of the angle of inclination of the substrate on the reflectance of the resulting coating. It can be seen that samples 3 and 4, prepared at inclination angles of 85 ° and 87 °, have a reflectance of less than 15% in the wavelength range of 400 nm to 700 nm, that is, they have a higher absorbance to 85% in said interval. These two samples are close to meeting the specifications of absorbent material ideal for use in solar cells (Kravets etal., Phys. Rev. B 78, 205405 (2008).
Esta diferencia en la absorbancia se puede observar a simple vista. En la figura 2 se muestra una fotografla de las laminas de los ejemplos 1 (B) y 4 (A). La figura 3 muestra una micrografla de las nanoestructuras obtenidas en la muestra 4.This difference in absorbance can be observed with the naked eye. A picture of the sheets of examples 1 (B) and 4 (A) is shown in Figure 2. Figure 3 shows a micrograph of the nanostructures obtained in sample 4.
La figura 4 muestra el efecto del angulo de inclinacion del sustrato en el diametro de las nanoestructuras que se crean sobre el sustrato. Como se puede ver, los recubrimientos realizados a angulos de inclinacion superiores a 80° tienen un gran porcentaje de nanoestructuras con diametros inferiores a 50 nm.Figure 4 shows the effect of the angle of inclination of the substrate on the diameter of the nanostructures that are created on the substrate. As can be seen, coatings made at inclination angles greater than 80 ° have a large percentage of nanostructures with diameters below 50 nm.
En la figura 8 se puede ver la absorbancia, reflectancia y transmitancia de las muestras 7 y 8, en MgO (transparente).Figure 8 shows the absorbance, reflectance and transmittance of samples 7 and 8, in MgO (transparent).
La muestra 8 se preparo por incidencia normal durante el proceso de pulverizacion catodica, es decir, 0° de inclinacion del sustrato, y un tiempo de deposito muy inferior, en concreto coseno(85°) veces menor (tiempo menor porque para depositar la misma cantidad de oro requiere menos tiempo) Es decir, la muestra 8 es una muestra recubierta con la misma cantidad de oro que la 7 pero depositada en forma de pellcula continua.Sample 8 was prepared by normal incidence during the cathode spraying process, that is, 0 ° of inclination of the substrate, and a much shorter deposit time, specifically cosine (85 °) times less (less time because to deposit the same amount of gold requires less time) That is, sample 8 is a sample coated with the same amount of gold as 7 but deposited in the form of a continuous film.
Puede comprobarse que la dependencia espectral de la muestra 7 (con recubrimiento nanoestructurado) es muy distinta a la que presenta una lamina delgada continua: mientras que la muestra 8 tiene baja absorcion (20%) y alta reflectividad (por encima de 70%) a partir de 600 nm, la muestra 7 (nanoestructurada) tiene alta absorcion (por encima del 60%) y baja reflectividad (por debajo del 30%) en todo el espectro visible.It can be seen that the spectral dependence of sample 7 (with nanostructured coating) is very different from that of a continuous thin sheet: while sample 8 has low absorption (20%) and high reflectivity (above 70%) a from 600 nm, sample 7 (nanostructured) has high absorption (above 60%) and low reflectivity (below 30%) throughout the visible spectrum.
Ejemplo 3. Efecto de la presion del gas inerte (pg)Example 3. Effect of inert gas pressure (pg)
En la figura 7 se puede ver que cuando pg > 0,5 Pa, los recubrimientos resultantes tienen una reflectividad superior al 20%, incluso a angulos de inclination superiores a 80°.In Figure 7 it can be seen that when pg> 0.5 Pa, the resulting coatings have a reflectivity greater than 20%, even at angles of inclination greater than 80 °.
La figura 5 muestra la distribution de las nanoestructuras obtenidas a diferentes angulos cuando pg > 0,5 Pa (muestras 5 y 6). Se puede observar que la distribucion obtenida tiene una proportion de nanoestructuras con diametros inferiores a 50 nm inferior a la obtenida cuando pg < 0,4 Pa (Fig. 4).Figure 5 shows the distribution of the nanostructures obtained at different angles when pg> 0.5 Pa (samples 5 and 6). It can be seen that the distribution obtained has a proportion of nanostructures with diameters less than 50 nm lower than that obtained when pg <0.4 Pa (Fig. 4).
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Claims (18)
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| ES201431009A ES2558625B1 (en) | 2014-07-04 | 2014-07-04 | PLASMONIC BLACK METAL COATINGS MANUFACTURED BY DEPOSITION BY CATHODIC SPRAYING AT RASING INCIDENCE |
| PCT/ES2015/070516 WO2016001469A1 (en) | 2014-07-04 | 2015-07-02 | Plasmonic black metal coatings produced by low-incidence cathode sputtering |
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