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ES2134655T3 - Dispositivo para aplicar depositos de material de union. - Google Patents

Dispositivo para aplicar depositos de material de union.

Info

Publication number
ES2134655T3
ES2134655T3 ES96945850T ES96945850T ES2134655T3 ES 2134655 T3 ES2134655 T3 ES 2134655T3 ES 96945850 T ES96945850 T ES 96945850T ES 96945850 T ES96945850 T ES 96945850T ES 2134655 T3 ES2134655 T3 ES 2134655T3
Authority
ES
Spain
Prior art keywords
joining material
pct
singling
deposits
singled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96945850T
Other languages
English (en)
Inventor
David Finn
Manfred Rietzler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of ES2134655T3 publication Critical patent/ES2134655T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)

Abstract

LA INVENCION SE REFIERE A UN DISPOSITIVO PARA LA APLICACION INDIVIDUALIZADA DE UN DEPOSITO DE MATERIAL DE JUNTA (30), EN PARTICULAR GLOBULOS DE SOLDADURA, A PARTIR DE UN TANQUE DE MATERIAL DE JUNTA CON MEDIOS DE APLICACION (13) Y MEDIOS (12) PARA AISLAR EL DEPOSITO DE MATERIAL DE JUNTA DEL TANQUE DE MATERIAL DE JUNTA. LOS MEDIOS AISLANTES (12) ADOPTAN LA FORMA DE MEDIOS DE TRANSPORTE (20) PARA LA TRANSFERENCIA SINGULAR DE DEPOSITOS DE MATERIAL DE JUNTA (30) A LOS MEDIOS DE APLICACION (13).
ES96945850T 1995-11-10 1996-10-30 Dispositivo para aplicar depositos de material de union. Expired - Lifetime ES2134655T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19541996A DE19541996C2 (de) 1995-11-10 1995-11-10 Vorrichtung zur Applikation von Verbindungsmaterialeinheiten

Publications (1)

Publication Number Publication Date
ES2134655T3 true ES2134655T3 (es) 1999-10-01

Family

ID=7777172

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96945850T Expired - Lifetime ES2134655T3 (es) 1995-11-10 1996-10-30 Dispositivo para aplicar depositos de material de union.

Country Status (7)

Country Link
US (1) US6152348A (es)
EP (1) EP0859681B1 (es)
JP (1) JPH11514933A (es)
AT (1) ATE182099T1 (es)
DE (2) DE19541996C2 (es)
ES (1) ES2134655T3 (es)
WO (1) WO1997017191A2 (es)

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JP3532925B2 (ja) * 1997-06-13 2004-05-31 ピーエーシー ティーイーシーエイチ−パッケージング テクノロジーズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 欠陥のあるはんだ接合部を直す装置
DE19838532B4 (de) * 1997-08-28 2005-09-22 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zum Plazieren und Umschmelzen von Lotmaterialformstücken
DE19742711C1 (de) * 1997-09-26 1999-05-20 Intec Bielenberg Gmbh & Co Kg Vorrichtung zum Aufbringen von Klebepunkten auf ein Substrat
US6324973B2 (en) 1997-11-07 2001-12-04 Speedline Technologies, Inc. Method and apparatus for dispensing material in a printer
US6453810B1 (en) 1997-11-07 2002-09-24 Speedline Technologies, Inc. Method and apparatus for dispensing material in a printer
US5947022A (en) * 1997-11-07 1999-09-07 Speedline Technologies, Inc. Apparatus for dispensing material in a printer
JP4068304B2 (ja) 1998-08-25 2008-03-26 ピーエーシー ティーイーシーエイチ − パッケージング テクノロジーズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 半田材料製形状部品の配置、再溶融方法およびその装置
US6386433B1 (en) * 1999-08-24 2002-05-14 Kulicke & Soffa Investments, Inc. Solder ball delivery and reflow apparatus and method
US6227437B1 (en) * 1999-08-24 2001-05-08 Kulicke & Soffa Industries Inc. Solder ball delivery and reflow apparatus and method of using the same
US6336581B1 (en) * 2000-06-19 2002-01-08 International Business Machines Corporation Solder ball connection device and capillary tube thereof
EP1326730B1 (de) 2000-10-06 2009-09-23 Pac Tech - Packaging Technologies GmbH Vorrichtung zur positionierung eines werkzeuges gegenüber einem werkstück
EP1326729B1 (de) * 2000-10-06 2010-04-21 Pac Tech - Packaging Technologies GmbH Vorrichtung zur applikation von materialstücken auf ein werkstück
EP1330328B1 (de) 2000-10-06 2005-12-28 Pac Tech - Packaging Technologies GmbH Verfahren und vorrichtung zur applikation von materialstücken auf ein werkstück
DE10132567B4 (de) * 2001-07-10 2005-03-31 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zum Aufbringen eines Lötmittels auf ein Substrat
CA2585168C (en) * 2004-11-02 2014-09-09 Imasys Ag Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit
JP4338204B2 (ja) 2005-03-30 2009-10-07 Ｔｄｋ株式会社 半田付け方法及び半田付け装置並びに接合方法及び接合装置
JP4042914B2 (ja) 2005-04-22 2008-02-06 Ｔｄｋ株式会社 半田付け装置及び半田分配装置
US20070075056A1 (en) * 2005-09-30 2007-04-05 Sae Magnetics (H.K.) Ltd. Soldering device and method for forming electrical solder connections in a disk drive unit
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8608080B2 (en) * 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US7980477B2 (en) * 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
EP2040201B1 (en) 2007-09-18 2010-11-17 HID Global Ireland Teoranta Method for bonding a wire conductor laid on a substrate
JP5393235B2 (ja) * 2009-04-23 2014-01-22 パナソニック株式会社 半田付け装置及び半田付け方法
JP2011121070A (ja) * 2009-12-08 2011-06-23 Hitachi Global Storage Technologies Netherlands Bv ヘッド・ジンバル・アセンブリの製造方法及びヘッド・ジンバル・アセンブリの接続パッドを相互接続する装置
US20130256281A1 (en) * 2012-03-30 2013-10-03 Tatsumi Tsuchiya Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk drive
US9227260B2 (en) * 2013-02-14 2016-01-05 HGST Netherlands B.V. High-speed transportation mechanism for micro solder balls
US9501067B2 (en) 2013-09-19 2016-11-22 Gpd Global, Inc. Fluid pressure regulation system for fluid-dispensing systems
DE102013017159B3 (de) * 2013-10-16 2014-12-24 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur vereinzelten Applikation von Lotmaterialdepots
DE102013114453A1 (de) 2013-12-19 2015-06-25 Pac Tech-Packaging Technologies Gmbh Vorrichtung zur vereinzelten Applikation von Lotmaterialdepots
DE102013114447B4 (de) * 2013-12-19 2016-01-28 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur vereinzelten Applikation von Lotmaterialdepots
DE102014109934A1 (de) 2014-07-15 2016-01-21 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur vereinzelten Applikation von Verbindungsmaterialdepots
US10556284B2 (en) * 2015-08-24 2020-02-11 Seagate Technology Llc Method of forming electrical connections with solder dispensing and reflow
JP6453742B2 (ja) * 2015-11-09 2019-01-16 株式会社パラット 半田付け装置、および半田付け方法
US10730128B2 (en) 2016-01-20 2020-08-04 Western Digital Technologies, Inc. Reliable transportation mechanism for micro solder balls
WO2018079515A1 (ja) * 2016-10-28 2018-05-03 株式会社アンド 鏝先の状態判定方法
WO2019065065A1 (ja) * 2017-09-27 2019-04-04 株式会社堀内電機製作所 はんだ付けシステム及びはんだ付け方法
CN112384956B (zh) 2018-05-22 2024-03-15 先讯美资电子有限责任公司 细长柔性标签
JP7286372B2 (ja) * 2019-03-29 2023-06-05 株式会社パラット 半田付け装置、および半田付け装置用ノズル
US12223814B2 (en) 2019-09-16 2025-02-11 Sensormatic Electronics, LLC Security tag for textiles using conductive thread
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
US10783424B1 (en) 2019-09-18 2020-09-22 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US11247285B1 (en) 2020-04-03 2022-02-15 Seagate Technology Llc Fluidization of agglomerated solder microspheres
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
JP7460052B2 (ja) 2021-10-06 2024-04-02 パック テック－パッケージング テクノロジーズ ゲーエムベーハー 単一はんだ体を製造するためのプレス成形デバイス、装置、はんだ付着機及び方法
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article
CN114160908B (zh) * 2022-02-11 2022-05-06 江苏高凯精密流体技术股份有限公司 激光熔锡喷射焊多通道进料系统
CN117840536A (zh) * 2022-10-04 2024-04-09 派克泰克封装技术有限公司 激光辅助焊接设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1673281A (en) * 1924-08-09 1928-06-12 Western Electric Co Method of and apparatus for dispensing matter
FR2397910A1 (fr) * 1977-07-19 1979-02-16 Gleizes Raymond Ensemble automatique et portatif pour le soudage
US4936501A (en) * 1989-04-13 1990-06-26 Sergei Babarin Soldering device
SG42943A1 (en) * 1993-05-31 1997-10-17 Citizen Watch Co Ltd Solder ball supply device
DE4320055A1 (de) * 1993-06-17 1994-12-22 Ghassem Dipl Ing Azdasht Belötungsvorrichtung
US5828031A (en) * 1996-06-27 1998-10-27 International Business Machines Corporation Head transducer to suspension lead termination by solder ball place/reflow

Also Published As

Publication number Publication date
EP0859681A2 (de) 1998-08-26
EP0859681B1 (de) 1999-07-14
DE59602458D1 (de) 1999-08-19
WO1997017191A2 (de) 1997-05-15
US6152348A (en) 2000-11-28
ATE182099T1 (de) 1999-07-15
DE19541996C2 (de) 1997-09-25
DE19541996A1 (de) 1997-05-15
WO1997017191A3 (de) 1997-06-26
JPH11514933A (ja) 1999-12-21

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